16M Nonvolatile SRAM
| DS1270Y-70IND | DS1270AB | DS1270AB-100 | DS1270AB-100IND | DS1270AB-70 | DS1270AB-70IND | DS1270Y | DS1270Y-100 | DS1270Y-100IND | DS1270Y-70 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 16M Nonvolatile SRAM | 2M X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDIP36 | 2M X 8 NON-VOLATILE SRAM MODULE, 100 ns, PDMA36 | 16M Nonvolatile SRAM | 2M X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA36 | 16M Nonvolatile SRAM | 2M X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDIP36 | 2M X 8 NON-VOLATILE SRAM MODULE, 100 ns, PDMA36 | 16M Nonvolatile SRAM | 2M X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA36 |
| 厂商名称 | - | DALLAS | DALLAS | - | DALLAS | - | DALLAS | DALLAS | - | DALLAS |
| Reach Compliance Code | - | unknow | unknow | - | unknow | - | unknow | unknow | - | unknow |
| 最长访问时间 | - | 70 ns | 100 ns | - | 70 ns | - | 70 ns | 100 ns | - | 70 ns |
| 其他特性 | - | 5 YEARS OF DATA RETENTION PERIOD | 5 YEAR DATA RETENTION PERIOD | - | 5 YEAR DATA RETENTION PERIOD | - | 5 YEARS OF DATA RETENTION PERIOD | 5 YEAR DATA RETENTION PERIOD | - | 5 YEAR DATA RETENTION PERIOD |
| JESD-30 代码 | - | R-PDIP-T36 | R-PDMA-P36 | - | R-PDMA-P36 | - | R-PDIP-T36 | R-PDMA-P36 | - | R-PDMA-P36 |
| 内存密度 | - | 16777216 bi | 16777216 bi | - | 16777216 bi | - | 16777216 bi | 16777216 bi | - | 16777216 bi |
| 内存集成电路类型 | - | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE | - | NON-VOLATILE SRAM MODULE | - | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE | - | NON-VOLATILE SRAM MODULE |
| 内存宽度 | - | 8 | 8 | - | 8 | - | 8 | 8 | - | 8 |
| 功能数量 | - | 1 | 1 | - | 1 | - | 1 | 1 | - | 1 |
| 端子数量 | - | 36 | 36 | - | 36 | - | 36 | 36 | - | 36 |
| 字数 | - | 2097152 words | 2097152 words | - | 2097152 words | - | 2097152 words | 2097152 words | - | 2097152 words |
| 字数代码 | - | 2000000 | 2000000 | - | 2000000 | - | 2000000 | 2000000 | - | 2000000 |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
| 最高工作温度 | - | 70 °C | 70 °C | - | 70 °C | - | 70 °C | 70 °C | - | 70 °C |
| 组织 | - | 2MX8 | 2MX8 | - | 2MX8 | - | 2MX8 | 2MX8 | - | 2MX8 |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | - | IN-LINE | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | - | IN-LINE | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | - | PARALLEL | PARALLEL | - | PARALLEL | - | PARALLEL | PARALLEL | - | PARALLEL |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| 最大供电电压 (Vsup) | - | 5.25 V | 5.25 V | - | 5.25 V | - | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | - | 4.75 V | 4.75 V | - | 4.75 V | - | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | - | 5 V | - | 5 V | 5 V | - | 5 V |
| 表面贴装 | - | NO | NO | - | NO | - | NO | NO | - | NO |
| 技术 | - | CMOS | CMOS | - | CMOS | - | CMOS | CMOS | - | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| 端子形式 | - | THROUGH-HOLE | PIN/PEG | - | PIN/PEG | - | THROUGH-HOLE | PIN/PEG | - | PIN/PEG |
| 端子位置 | - | DUAL | DUAL | - | DUAL | - | DUAL | DUAL | - | DUAL |
模拟与混合信号
创意市集
嵌入式系统
FPGA/CPLD
嵌入式系统
TI技术论坛
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
