2M X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDIP36
参数名称 | 属性值 |
厂商名称 | DALLAS |
Reach Compliance Code | unknow |
最长访问时间 | 70 ns |
其他特性 | 5 YEARS OF DATA RETENTION PERIOD |
JESD-30 代码 | R-PDIP-T36 |
内存密度 | 16777216 bi |
内存集成电路类型 | NON-VOLATILE SRAM MODULE |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 36 |
字数 | 2097152 words |
字数代码 | 2000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2MX8 |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
DS1270AB | DS1270AB-100 | DS1270AB-100IND | DS1270AB-70 | DS1270AB-70IND | DS1270Y | DS1270Y-100 | DS1270Y-100IND | DS1270Y-70 | DS1270Y-70IND | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | 2M X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDIP36 | 2M X 8 NON-VOLATILE SRAM MODULE, 100 ns, PDMA36 | 16M Nonvolatile SRAM | 2M X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA36 | 16M Nonvolatile SRAM | 2M X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDIP36 | 2M X 8 NON-VOLATILE SRAM MODULE, 100 ns, PDMA36 | 16M Nonvolatile SRAM | 2M X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA36 | 16M Nonvolatile SRAM |
厂商名称 | DALLAS | DALLAS | - | DALLAS | - | DALLAS | DALLAS | - | DALLAS | - |
Reach Compliance Code | unknow | unknow | - | unknow | - | unknow | unknow | - | unknow | - |
最长访问时间 | 70 ns | 100 ns | - | 70 ns | - | 70 ns | 100 ns | - | 70 ns | - |
其他特性 | 5 YEARS OF DATA RETENTION PERIOD | 5 YEAR DATA RETENTION PERIOD | - | 5 YEAR DATA RETENTION PERIOD | - | 5 YEARS OF DATA RETENTION PERIOD | 5 YEAR DATA RETENTION PERIOD | - | 5 YEAR DATA RETENTION PERIOD | - |
JESD-30 代码 | R-PDIP-T36 | R-PDMA-P36 | - | R-PDMA-P36 | - | R-PDIP-T36 | R-PDMA-P36 | - | R-PDMA-P36 | - |
内存密度 | 16777216 bi | 16777216 bi | - | 16777216 bi | - | 16777216 bi | 16777216 bi | - | 16777216 bi | - |
内存集成电路类型 | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE | - | NON-VOLATILE SRAM MODULE | - | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE | - | NON-VOLATILE SRAM MODULE | - |
内存宽度 | 8 | 8 | - | 8 | - | 8 | 8 | - | 8 | - |
功能数量 | 1 | 1 | - | 1 | - | 1 | 1 | - | 1 | - |
端子数量 | 36 | 36 | - | 36 | - | 36 | 36 | - | 36 | - |
字数 | 2097152 words | 2097152 words | - | 2097152 words | - | 2097152 words | 2097152 words | - | 2097152 words | - |
字数代码 | 2000000 | 2000000 | - | 2000000 | - | 2000000 | 2000000 | - | 2000000 | - |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | - |
最高工作温度 | 70 °C | 70 °C | - | 70 °C | - | 70 °C | 70 °C | - | 70 °C | - |
组织 | 2MX8 | 2MX8 | - | 2MX8 | - | 2MX8 | 2MX8 | - | 2MX8 | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
封装形式 | IN-LINE | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | - | IN-LINE | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | - |
并行/串行 | PARALLEL | PARALLEL | - | PARALLEL | - | PARALLEL | PARALLEL | - | PARALLEL | - |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | - |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | - | 5.25 V | - | 5.5 V | 5.5 V | - | 5.5 V | - |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | - | 4.75 V | - | 4.5 V | 4.5 V | - | 4.5 V | - |
标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | - | 5 V | 5 V | - | 5 V | - |
表面贴装 | NO | NO | - | NO | - | NO | NO | - | NO | - |
技术 | CMOS | CMOS | - | CMOS | - | CMOS | CMOS | - | CMOS | - |
温度等级 | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | - |
端子形式 | THROUGH-HOLE | PIN/PEG | - | PIN/PEG | - | THROUGH-HOLE | PIN/PEG | - | PIN/PEG | - |
端子位置 | DUAL | DUAL | - | DUAL | - | DUAL | DUAL | - | DUAL | - |
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