电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

206-115LPSP

产品描述FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, RECEPTACLE
产品类别半导体    其他集成电路(IC)   
文件大小275KB,共4页
制造商CTS [CTS Corporation]
下载文档 全文预览

206-115LPSP概述

FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, RECEPTACLE

文档预览

下载PDF文档
Series 206/208 DIP
®
Multifunctional
Through Hole
DIP Switches
Features
Optimized Mechanical Features
• Standard 2.54mm (.100") x 7.62mm (.300") DIP
centers
• Available with flush actuators for low profile
SPST & SPDT applications
• Sealed version optional; assures
contaminant-free switch operation after
wave soldering and cleaning
• Available with low profile, standard, or extended
actuators
• Contact wiping action on make and break
• Integral terminal and contact locked into
thermoset base
• Electrostatic discharge shield rated to 22 KV
• Series 206, gold plated copper alloy
contacts
• Series 208, solder coated, copper alloy contacts
• All UL 94 V-0 plastics used
• RoHS compliant
Optimized Contact System
Materials
Series 206 – Premium Programmable DIP Switch
Series 208 – Economical Programmable DIP Switch
Electrical and Mechanical Specifications
Switch Function
SPST - 1 through 10 and 12 positions
SPDT&DPST- 1 through 6 positions
DPDT&4PST - 1 through 3 positions
3PST - 1 through 4 positions
Switch Contact Resistance
Switch Series
206
208
Initial, max.
50 milliohms
100 milliohms
End of life , max.
100 milliohms
500 milliohms
Insulation Resistance
1,000 megohms minimum across open switch
1,000 megohms minimum between adjacent
closed switches
Dielectric Strength
500 VAC minimum for 1 minute between adjacent
switches
Nonswitching Rating
100 mA or 50 VDC maximum
Switch Capacitance
5.0 pF maximum between adjacent closed switches
Operating Temperature
- 55°C to +85°C
Actuation Life
Series 206: 10,000 cycles switching
50 mA @ 24 VDC
Series 208: 2,000 cycles switching
50 mA @ 24 VDC
Allowable Solder Time
Up to 5 seconds with 260°C
Vibration
Per MIL-STD-202F, method 204D, condition B
with no contact inconsistencies greater than
1 microsecond
Shock
Per MIL-STD-202F, method 213B, condition A
with no contact inconsistencies greater than
1 microsecond
Sealing
Optional bottom epoxy seal
Optional top tape seal
Marking
Special side or top marking available-consult CTS
Packaging
Standard : Anti-Static tube packaging
1-4
CTS Electronic Components
© 2006 CTS Corporation. All rights reserved. Information subject to change.
www.ctscorp.com
6/30/06
Qorvo的射频前端技术创新引领5G终端发展
5G时代,终端成为各行业关注的焦点。终端是最接近用户的部分,直接影响用户的5G体验。而在智能终端中,射频前端模块先行,射频前端模块的技术创新推动了移动通信技术的发展。在5G时代的潮流中 ......
Jacktang 无线连接
evc下获取汉字内码后取字模
Hi,各位,请教一下: 1.在evc下是如何获取汉字的内码的?假设汉字为“房”,其内码为623F,在GB2312则为2331,如果知道GB2312下的内码怎样转换成Unicode下的内码? 2.在CE4.2下,系统的字库 ......
dlw123 嵌入式系统
生成SOPC时遇到错误
用demo程序重新生成SOPC时遇到下面的错误提示: Error: Failed to refresh PTF fileInfo: Finished elaborating PTF file.Executing: C:/altera/91/quartus//sopc_builder/bin/sopc_builder -- ......
logicengineer FPGA/CPLD
关于C6678DSPlib中的函数调用问题
这两天一直在研究C6678DSPlib中的DSPF_sp_convol函数的调用问题,我看了TI给的关于他的调用方法的介绍,但是总是感觉一头雾水,有些参数到底是怎么传递的,我感觉它没有说清楚。下面是我截的一 ......
huangjie DSP 与 ARM 处理器
请教:sc32410的DMA的nXDREQ0和nXDREQ1两个外部源的问题
各位: 我在关于DMA驱动的事情。在ARM外接一块FPGA进行DMA数据传输。想用nXDREQ0为DMA请求源。在datasheet上面写道DREQ与DACK与HCLK同步。我不大理解什么意思?nXDREQ0是在FPGA端发起的, ......
sakura123 嵌入式系统
官网CC2541SDK无法串口打印
我下载了官网CC2541SDK,版本:BLE-CC254x-1.5.0.16 预编译: INT_HEAP_LEN=3072 HALNODEBUG OSAL_CBTIMER_NUM_TASKS=1 HAL_AES_DMA=TRUE HAL_DMA=TRUE xPOWER_SAVING ......
chenbingjy 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1749  2413  1427  1683  274  36  49  29  34  6 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved