NXP Semiconductors
Data Sheet: Technical Data
Document Number: KL82P121M72SF0
Rev. 4, 12/2016
Kinetis KL82 Microcontroller
72 MHz ARM® Cortex®-M0+ with 128 KB Flash and 96 KB
SRAM
The KL82 MCU family's high performance, encryption features
and ultra-low power capabilities extend its reach beyond
traditional mPOS pin pads and terminals into more power-
restricted payment applications, such as smartphone and tablet
attach readers, as well as those embedded in wearable
technology.
MKL82Z128Vxx7(R)
The product offers:
• Hardware asymmetric cryptography – high-speed, code-
and power-efficient data authentication with support for
latest encryption protocols
• EMV®-compatible with ISO7816-3 SIM interfaces – architected for EMV compliance and supported by
an EMV Level 1 software stack
• QSPI interface to expand program memory
• Sleep mode power consumption from 2.5 µA with the SRAM content retained and RTC enabled
• Crystal-less USB OTG controller, 16-bit ADC and multiple serial communication interfaces can all
function autonomously in low-power modes with minimal CPU intervention
• FlexIO to support any standard and customized serial peripheral emulation
100 & 80 & 64 LQFP
121 & 64 MAPBGA
(LL&LK&LH)
14x14 x1.7 mm Pitch
(MC&MP)
8x8x1.43 mm Pitch 0.5mm 12x12x1.6 mm
Pitch 0.5 mm
0.65 mm 5x5x1.23 mm
10x10x1.6 mm Pitch
Pitch 0.5 mm
0.5 mm
Core Processor
• 72 MHz ARM® Cortex®-M0+ core ( up to 96 MHz for high-
speed run)
Memories
• 128 KB program flash memory
• 96 KB SRAM
• 32 KB ROM with built-in boot loader
• 32 B backup register
• QSPI to expand program code in external high-speed serial
NOR flash memory
System
• 8-channel asynchronous enhanced DMA controller
• Watchdog
• Low-leakage wakeup unit
• Two-pin serial wire debug (SWD) programming and
debugging interface
• Micro trace buffer
• Bit manipulation engine
• Interrupt controller
Peripherals
• USB full-speed 2.0 OTG controller supporting
crystal-less operation and keeping connection
alive under ultra-low power
• Three low-power UART modules supporting
asynchronous operation in low-power modes
• Two I2C modules supporting up to 1 Mbps
• Two 16-bit SPI modules supporting up to
24Mbps
• One FlexIO module supporting emulation of
additional UART, SPI, I2C, I2S, PWM and
other serial modules, etc. up to 32 channels
• One 16-bit ADC module with high accurate
internal voltage reference and up to 16
channels
• High-speed analog comparator containing a 6-
bit DAC for programmable reference input
• One 12-bit DAC module
• Two EMVSIM modules supporting EMV L1
compatible interface
• Touch sensing interface up to 16 channels
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
• Memory protection unit
• SRAM bit-banding
Clocks
• 48 MHz high accuracy (up to 0.5%) internal reference clock
for high-speed run
• 4 MHz high accuracy (up to 2%) internal reference clock for
low-speed run
• 32 kHz internal reference clock
• 1 kHz internal reference clock
• 32–40 kHz and 3–32 MHz crystal oscillator
• PLL/FLL
Timers
• One 6-channel Timer/PWM module
• Two 2-channel Timer/PWM modules
• Two low-power timers
• 4-channel periodic interrupt timer
• Independent real time clock
Security
• 128-bit unique identification number per chip
• Advanced flash security and access control
• Hardware CRC module
• Low-power trusted crypto engine supporting AES128/256,
DES, 3DES, SHA256, RSA and ECC, with hardware DPA
• True random number generator
I/O
• Up to 85 General-purpose input/output pins
(GPIO)
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range (ambient): -40 to 105°C
Low Power
• Down to 125 µA/MHz in Run mode
• Down to 272 nA in Stop mode (RAM and RTC
retained)
• Six flexible static modes
Packages
• 121 MAPBGA 8mm x 8mm, 0.65mm pitch,
1.43mm max thickness
• 80 LQFP 12mm x 12mm, 0.5mm pitch, 1.6mm
max thickness
• 100 LQFP 14mm x 14mm, 0.5mm pitch,
1.7mm max thickness (Package Your Way)
• 64 MAPBGA 5mm x 5mm, 0.5mm pitch,
1.23mm max thickness (Package Your Way)
• 64 LQFP 10mm x 10mm, 0.5mm pitch, 1.6mm
max thickness (Package Your Way)
NOTE
The 100-, 64-pin LQFP and 64-pin MAPBGA packages supporting
MKL82Z128VLL7, MKL82Z128VLH7 and MKL82Z128VMP7 part numbers for this
product are not yet available. However, these packages are included in Package Your
Way program for Kinetis MCUs. Visit
nxp.com/KPYW
for more details.
Related resources
Type
Selector Guide
Reference
Manual
Data Sheet
Chip Errata
Package
drawing
Description
The NXP Solution Advisor is a web-based tool that features
interactive application wizards and a dynamic product selector.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
Resource
Solution Advisor
KL82P121M72SF0RM
1
KL82P121M72SF0
1
The chip mask set Errata provides additional or corrective information
xN51R
2
for a particular device mask set.
Package dimensions are provided in package drawings.
MAPBGA 121-pin:
98ASA00423D
MAPBGA 64-pin:
98ASA00420D
LQFP 100-pin:
98ASS23308W
LQFP 80-pin:
98ASS23174W
LQFP 64-pin:
98ASS23234W
1. To find the associated resource, go to
http://www.nxp.com
and perform a search using this term.
2
NXP Semiconductors
Kinetis KL82 Microcontroller, Rev. 4, 12/2016
2. To find the associated resource, go to
http://www.nxp.com
and perform a search using this term with the "x" replaced
by the revision of the device you are using.
Kinetis KL82 Microcontroller, Rev. 4, 12/2016
3
NXP Semiconductors
Table of Contents
1 Ordering information............................................................... 5
2 Overview................................................................................. 5
2.1 System features...............................................................7
2.1.1
2.1.2
2.1.3
ARM Cortex-M0+ core...................................... 7
NVIC..................................................................7
AWIC.................................................................7
4.3.7
Communication interfaces.................................48
4.3.8
Human-machine interfaces (HMI)..................... 51
4.4 KL82 Pinouts................................................................... 51
4.5 Package dimensions....................................................... 57
5 Electrical characteristics..........................................................64
5.1 Terminology and guidelines.............................................64
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
Definitions......................................................... 65
Examples.......................................................... 65
Typical-value conditions....................................66
Relationship between ratings and operating
requirements..................................................... 66
Guidelines for ratings and operating
requirements..................................................... 67
2.1.4
Memory............................................................. 8
2.1.5
Reset and boot..................................................9
2.1.6
Clock options.....................................................11
2.1.7
Security............................................................. 14
2.1.8
Power management.......................................... 15
2.1.9
LLWU................................................................ 16
2.1.10 Debug controller................................................18
2.1.11 INTMUX............................................................ 18
2.1.12 Watch dog......................................................... 18
2.2 Peripheral features.......................................................... 19
2.2.1
BME.................................................................. 19
2.2.2
eDMA and DMAMUX........................................ 19
2.2.3
TPM...................................................................20
2.2.4
ADC...................................................................21
2.2.5
VREF.................................................................21
2.2.6
CMP.................................................................. 22
2.2.7
RTC...................................................................22
2.2.8
2.2.9
2.2.10
2.2.11
2.2.12
2.2.13
2.2.14
2.2.15
2.2.16
2.2.17
2.2.18
2.2.19
2.2.20
PIT.....................................................................23
LPTMR.............................................................. 23
CRC.................................................................. 24
LPUART............................................................ 24
SPI.................................................................... 25
I2C.....................................................................25
USB...................................................................26
FlexIO................................................................27
DAC...................................................................27
EMV-SIM...........................................................28
LTC................................................................... 29
TRNG................................................................ 29
TSI.....................................................................29
5.2 Ratings............................................................................ 67
5.2.1
Thermal handling ratings...................................67
5.2.2
Moisture handling ratings.................................. 68
5.2.3
ESD handling ratings........................................ 68
5.2.4
Voltage and current operating ratings............... 68
5.3 General............................................................................ 69
5.3.1
AC electrical characteristics.............................. 69
5.3.2
Nonswitching electrical specifications............... 69
5.3.3
Switching specifications.................................... 83
5.3.4
Thermal specifications...................................... 84
5.4 Peripheral operating requirements and behaviors...........86
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
5.4.6
Core modules....................................................86
Clock modules...................................................88
Memories and memory interfaces.....................95
Security and integrity modules.......................... 101
Analog............................................................... 101
Timers............................................................... 112
5.4.7
Communication interfaces.................................112
5.4.8
Human-machine interfaces (HMI)..................... 123
6 Design considerations.............................................................124
6.1 Hardware design considerations..................................... 124
6.1.1
Printed circuit board recommendations.............124
6.1.2
Power delivery system...................................... 124
6.1.3
6.1.4
6.1.5
Analog design................................................... 125
Digital design.....................................................126
Crystal oscillator................................................128
2.2.21 QuadSPI............................................................30
3 Memory map........................................................................... 30
4 Pinouts.................................................................................... 32
4.1 KL82 signal multiplexing and pin assignments................ 32
4.2 Pin properties.................................................................. 37
4.3 Module signal description tables..................................... 42
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
4.3.6
Core Modules....................................................42
System modules................................................42
Clock Modules...................................................44
Memories and memory interfaces.....................44
Analog............................................................... 45
Timer Modules.................................................. 46
6.2 Software considerations.................................................. 130
6.3 Soldering temperature..................................................... 131
7 Part identification.....................................................................131
7.1 Description.......................................................................131
7.2 Format............................................................................. 131
7.3 Fields............................................................................... 131
7.4 Example...........................................................................132
8 Revision history.......................................................................132
4
NXP Semiconductors
Kinetis KL82 Microcontroller, Rev. 4, 12/2016
Ordering information
1 Ordering information
The following chips are available for ordering.
Table 1. Ordering information
Product
Part number
Marking
(Line1/Line2)
MKL82Z128VMC7(R)
MKL82Z128VLL7(R)
MKL82Z128VLK7(R)
MKL82Z128VMP7(R)
MKL82Z128VLH7(R)
MKL82
Z128VMC7
MKL82Z128VL
L7
MKL82Z128
VLK7
M82N7V
MKL82Z128V
LH7
1. INT: interrupt pin numbers; HD: high drive pin numbers
128
128
96
96
64
64
MAPBGA
LQFP
41
41
41/0
41/0
11/1
11/1
128
128
96
96
100
80
LQFP
LQFP
66
56
66/0
56/0
14/1
12/1
Memory
Flash
(KB)
128
SRAM
(KB)
96
Package
Pin
count
121
Package
IO and ADC channel
GPIOs
GPIOs
(INT/
HD)
1
85/0
ADC
channels
(SE/DP)
16/2
MAPBGA
85
NOTE
The 100-, 64-pin LQFP and 64-pin MAPBGA packages supporting
MKL82Z128VLL7, MKL82Z128VLH7 and MKL82Z128VMP7 part
numbers for this product are not yet available. However, these packages
are included in Package Your Way program for Kinetis MCUs. Visit
nxp.com/KPYW
for more details.
2 Overview
The following figure shows the system diagram of this device
Kinetis KL82 Microcontroller, Rev. 4, 12/2016
5
NXP Semiconductors
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
