C150 Series
8 Contact Row Signal Connectors
•
Offset-grid contact layout, eight contact rows within
dielectric connector body, 2.54 mm center-to-center
contact spacing in each row and 1.27 row-to-row
spacing.
•
0.5 mm nominal pin DIA contact size; 304, 372
contact positions; dip solder and SMT soldering
contact termination types in PPS solid body.
•
High contact density, high shock and vibration proof
(no micro interruptions - test: 2ns).
•
Conforms to MIL-DTL-55302.
•
For military and industrial applications.
Technical Characteristics
MATERIAL
Body
Contacts
PPS
Brass
CuBe
Phosphor-Bronze
Stainless steel
CuBe
MIL-M-24519
ASTM B16
ASTM B197
ASTM B139
ASTM A582
ASTM B196
Hardware
FINISHES
Contacts
Hardware
Gold
Passivation
Nichel
ASTM B488
ASTM A967
QQ-N-290
MECHANICAL
Mating/Unmating force
Contact life
50g max
30.000 insertion
-
-
ELECTRICAL
Current rating
(1)
Contact resistance
Dielectric withstanding voltage
Insulation resistance
2.0 A
≤
5.0 mΩ
1000 VRMS, 60 Hz a.s.l.
≥
5000 MΩ at 500 VDC
-
-
-
-
PHYSICAL AND ENVIROMENTAL
Shock
Vibration
Operating range
(1)
Consult
-
-
-65°C +125°C
In accordance with MIL-STD-1344
In accordance with MIL-STD-1344
-
factory for details
APRIL
2005
83
C150 Series
Ordering Information
C150
***
*
*
*
* *
* *
Connector family
Connector size
372
304
372
304
Connector and contacts style
Pin connector
Socket connector
P
S
Contact terminal style
(1)
Flex-circuit (pcb thickness 1.30-2.30)
Flex-circuit (pcb thickness 2.00-3.00)
Flex-circuit (pcb thickness 2.80-4.00)
Flex-circuit (pcb thickness 4.00-5.00)
Flex-circuit (pcb thickness 4.60-5.80)
Dip solder, straight through L= 2.77mm.
Dip solder, straight through L= 3.56mm.
Dip solder, straight through L= 4.37mm.
Dip solder, straight through L= 5.00mm.
Dip solder, straight through L= 5.94mm.
N
R
T
V
Z
D
E
G
L
M
Hardware codee
(2)
D-shaped guide
Omnipolarized guide (for test type connector)
Screw lock
Hardware polarization
Only for connector with flex circuit
(pos. 01 without Loctite)
D-shaped guide
Omnipolarized guide
Guide (type P, Y) shipped loose
Y
P
K
00
01÷16
17
18
Contact finishing
Plating conforming to MIL-DTL-55302 + tin dipping
(1)
HS
H
Plating conforming to MIL-DTL-55302
(1)
Pin
(2)
connector 304 contact position, straight contact terminal style equipped, is not available.
Hardware code type K for socket connector with flex circuit is not available.
(3)
This finishing is only for contacts dip solder, straight thru
84
APRIL
2005
C150 Series
Pin connector, 372 contact positions, surface mount tail termination style
1.27x46=58.42
6.35
B1
A2
A24
A27
1.27x46=58.42
2.54
=
=
A50
1.27
14.61
1.27x7=8.89
H1
14.00
H24
H27
H49 G50
138.10
136.00
65.9765
4.00
3.80
65.9765
Ref.
Ref.
Ref.
Ref.
Ref.
N:
X=5.45
R:
X=5.10
T:
X=4.65
V:
X=4.10
Z:
X=3.75
X
Alpha
****
C150372P****H
Beta
8.51
4.80
2.80
Male guide pins
Pin connector, 372 contact positions, surface mount tail contact termination style, board package thickness from .051 to .228 inch, (1.30 to 5.80 mm).
ALPHA
END
12.70
F49 G50 E50
BETA
END
M2.50
3 PLACES
D-SHAPED MALE GUIDE PINS
H1
F1
G2
G24 E24 H24
E27 H27 F27
SIDE B
A
SIDE A
D1
ALPHA
END
B1
C2
C24 A24 D24
A27 D27 B27
B49 C50 A50
BETA
END
0.635
0.635x92=58.42
4.064
65.9765
±0.05
Ø 2.70 min
(3 HOLES)
0.60
65.9765
±0.05
6.35
0.635x92=58.42
4.064
A
4.50 max
C
0.40
SIDE B
SIDE A
C=from 1.30 to 2.30 mm
C=from 2.00 to 3.00 mm
C=from 2.80 to 4.00 mm
C=from 4.00 to 5.00 mm
C=from 4.60 to 5.80 mm
3.50
RECOMMENDED PAD
(Tin lead plated)
0.635
SECTION A-A
Enlarged pad for D1, D24, A27, A50, and H1, H24, E27, E50 positions
Mounting pattern, daughterboard application, or in line arrangement board-to-board connection
Dimensions are in mm
APRIL
1.27
2005
85
C150 Series
Pin connector, 372 contact positions, surface mount tail termination style
E2
G2
F1
H1
H
G
F
F2
H2
E3
G3
E24
G24
F23
H23
H24
E27
E29
E28
G28
G29
F28
F27
H27
H28
E50
G50
F49
H49
ALPHA
END
E
D
C
B
A
D2
D1
B1
B2
C2
C3
A3
A2
D23
D24
B23
C24
D28
D27
B28
B27
C29
C28
A27
A28
A29
D49
B49
C50
A50
BETA
END
A24
SIDE OPPOSITE PIN CONNECTOR
Flex-circuits contact assignment diagram
86
APRIL
2005
C150 Series
Socket connector, 372 contact positions, surface mount tail termination style
7.40
M2.50
3 PLACES
5.55
8.90
65.9765
139.10
3.80
65.9765
16.31
14.40
Alpha
****
C150372S****H
Beta
X
Ref.
Ref.
Ref.
Ref.
Ref.
N:
X=5.45
R:
X=5.10
T:
X=4.65
V:
X=4.10
Z:
X=3.75
H1
H24
H27
H49 G50
1.27
1.27x7=8.89
2.54
1.27x46=58.42
6.35
1.27x46=58.42
D-SHAPED GUIDE SOCKETS
Socket connector, 372 contact positions, surface mount tail contact termination style, board package thickness from 1.30 to 5.80 mm.
SIDE B
H1
ALPHA
END
F1
G2
G24 E24 H24
E27 H27 F27
F49 G50 E50
BETA
END
65.9765
±0.05
4.064
0.635x92=58.42
0.635
6.35
65.9765
±0.05
4.50 max
4.064
0.635x92=58.42
A
ALPHA
END
14.00
BETA
END
=
=
=
B1
A2
A24
A27
A50
=
1.27
D1
B1
C2
C24 A24 D24
A27 D27 B27
B49 C50 A50
SIDE A
0.60
Ø 2.70 min
(3 HOLES)
0.40
A
C=from 1.30 to 2.30 mm
C=from 2.00 to 3.00 mm
C=from 2.80 to 4.00 mm
C=from 4.00 to 5.00 mm
C=from 4.60 to 5.80 mm
RECOMMENDED PAD
(Tin lead plated)
0.635
SIDE "B"
SIDE "A"
3.50
C
SECTION A-A
Enlarged pad for D1, D24, A27, A50, and H1, H24, E27, E50 positions
Mounting pattern, in line arrangement board-to-board connection, or daughterboard application when connector use reverse gender contacts.
Dimensions are in mm
APRIL
2005
87
Microchip MCU
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