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1N5943D

产品描述ZENER DIODE
产品类别分立半导体    二极管   
文件大小350KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
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1N5943D概述

ZENER DIODE

1N5943D规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
Reach Compliance Codeunknown
ECCN代码EAR99
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-41
JESD-30 代码O-LALF-W2
JESD-609代码e0
湿度敏感等级1
元件数量1
端子数量2
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.5 W
认证状态Not Qualified
标称参考电压56 V
表面贴装NO
技术ZENER
端子面层TIN LEAD
端子形式WIRE
端子位置AXIAL
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差1%
工作测试电流6.7 mA
Base Number Matches1

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1N5913BG – 1N5956BG
Screening in
reference to
MIL-PRF-19500
available
Available
Axial-Leaded 1.5 Watt Glass Zener Diodes
DESCRIPTION
The 1N5913BG-5956BG series of 1.5 watt Zeners provides voltage regulation in a selection
from 3.3 to 200 volts with a variety of tolerances available. They are also available in various
military equivalent screening levels for high reliability. These glass encapsulated Zeners with
a G suffix provide hermetic-sealed qualities and higher rated temperature beyond that
optionally provided in equivalent plastic-body constructions (P suffix) for the same JEDEC part
numbers. Both package options are available from Microsemi.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
JEDEC registered 1N5913B TO 1N5956B number series.
Zener voltage available 3.3 V to 200 V.
Voltage tolerances of 10%, 5%, 2% and 1% are available.
Screening in reference to MIL-PRF-19500 is available.
(See
part nomenclature
for all available options.)
RoHS compliant versions available (commercial grade only).
Optional plastic body axial-leaded Zeners available as
1N5913BP – 1N5956BP.
(See separate data sheet)
DO-41
(DO-204AL)
Package
Also available in:
DO-213AB package
(MELF surface mount)
1N5913BUR-1 –
1N5956BUR-1
APPLICATIONS / BENEFITS
Regulates voltage over a broad range of operating current and temperature.
Flexible axial-lead mounting terminals.
Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance
in glass hermetically sealed package
Non-sensitive to ESD per MIL-STD-750 method 1020.
Hermetically sealed glass body construction.
Inherently radiation hard as described in Microsemi
MicroNote 050.
SMB package
(tabbed surface mount)
SMBG(J)5913B –
SMBG(J)5956B
SMAJ package
(tabbed surface mount)
SMAJ5913B –
SMAJ5956B
Powermite package
(tabbed surface mount)
1PMT5913B –
1PMT5956B
MAXIMUM RATINGS
@ T
A
= 25 C unless otherwise specified
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
@ 3/8 inch (10 mm) lead length from body
(1)
Thermal Resistance Junction-to-Ambient
(2)
Steady State Power Dissipation
@ T
L
≤ 85 ºC
(1)
@ T
A
= 25 ºC
Rated Average Power Dissipation (also see
figure 1)
Forward Voltage
@ 200 mA
Solder Temperature @ 10 s
Symbol
T
J
& T
STG
R
ӨJL
R
ӨJA
P
D
P
M(AV)
V
F
T
SP
Value
-65 to +175
60
120
1.5
1.25
1.5
1.2
260
Unit
o
C
o
C/W
o
o
C/W
W
W
V
o
C
MSC – Lawrence
6 Lake Street, Lawrence,
MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with 4 mm
2
copper pads and track width 1 mm, length 25 mm..
2. At 3/8 inch (10 mm) lead length from body.
T4-LDS-0300, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 1 of 5
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