IC SWITCH 8X L-SIDE W/SPI 24SOIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | SOIC |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 内置保护 | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE |
| 驱动器位数 | 8 |
| 接口集成电路类型 | SIPO BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 长度 | 15.4 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出电流流向 | SOURCE AND SINK |
| 最大输出电流 | 0.5 A |
| 标称输出峰值电流 | 1 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 220 |
| 电源 | 5,9/16 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BCDMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 断开时间 | 50 µs |
| 接通时间 | 50 µs |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |
| MC33291DWR2 | MCZ33291EG | MCZ33291EGR2 | KIT33291DWEVB | MC33291LDW | |
|---|---|---|---|---|---|
| 描述 | IC SWITCH 8X L-SIDE W/SPI 24SOIC | Power Switch ICs - Power Distribution BASIC OCTAL SERIAL SW | Power Switch ICs - Power Distribution BASIC OCTAL SERIAL SW | KIT EVAL FOR MC33291 SMART SW | IC SWITCH 8X L-SIDE W/SPI 24SOIC |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | - | 不符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | - | SOIC |
| 针数 | 24 | 24 | 24 | - | 24 |
| Reach Compliance Code | unknown | unknown | unknown | - | unknown |
| 内置保护 | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | OVER CURRENT; OVER VOLTAGE; THERMAL; ZENER CLAMP | OVER CURRENT; OVER VOLTAGE; THERMAL; ZENER CLAMP | - | OVER CURRENT; OVER VOLTAGE; THERMAL; ZENER CLAMP |
| 驱动器位数 | 8 | 8 | 8 | - | 8 |
| 接口集成电路类型 | SIPO BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | - | R-PDSO-G24 |
| JESD-609代码 | e0 | e3 | e3 | - | e0 |
| 长度 | 15.4 mm | 15.4 mm | 15.4 mm | - | 15.395 mm |
| 湿度敏感等级 | 1 | 3 | 3 | - | - |
| 功能数量 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 24 | 24 | 24 | - | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C |
| 输出电流流向 | SOURCE AND SINK | SINK | SINK | - | SINK |
| 最大输出电流 | 0.5 A | 0.5 A | 0.5 A | - | 0.5 A |
| 标称输出峰值电流 | 1 A | 1 A | 1 A | - | 2 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | - | SOP |
| 封装等效代码 | SOP24,.4 | SOP24,.4 | SOP24,.4 | - | SOP24,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 220 | 260 | 260 | - | NOT SPECIFIED |
| 电源 | 5,9/16 V | 5,9/16 V | 5,9/16 V | - | 5,9/16 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | - | 2.65 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | YES | YES | YES | - | YES |
| 技术 | BCDMOS | BCDMOS | BCDMOS | - | BCDMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 40 | 40 | - | NOT SPECIFIED |
| 断开时间 | 50 µs | 50 µs | 50 µs | - | 50 µs |
| 接通时间 | 50 µs | 50 µs | 50 µs | - | 50 µs |
| 宽度 | 7.5 mm | 7.5 mm | 7.5 mm | - | 7.5 mm |
| Base Number Matches | 1 | 1 | 1 | - | 1 |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
| 包装说明 | - | SOP, SOP24,.4 | SOP, SOP24,.4 | - | SOP, SOP24,.4 |
| ECCN代码 | - | EAR99 | EAR99 | - | EAR99 |
| 电源电压1-最大 | - | 26.5 V | 26.5 V | - | 26.5 V |
| 电源电压1-分钟 | - | 9 V | 9 V | - | 9 V |
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