8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
8K × 8 I2C/2-线 串行 电可擦除只读存储器, PDSO8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DFN |
| 包装说明 | 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 内存密度 | 65536 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装等效代码 | SOLCC8,.11,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| Base Number Matches | 1 |
| 24LC64-I/MC | 24AA64_07 | 24LC64-E/MC | 24AA64T-I/MC | 24AA64T-E/MC | 24AA64-I/MC | 24AA64-E/MC | |
|---|---|---|---|---|---|---|---|
| 描述 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
| 是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | - | 不含铅 | - |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | - | 符合 | - |
| 零件包装代码 | DFN | - | DFN | DFN | - | DFN | - |
| 包装说明 | 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 | - | 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 | 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 | - | 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 | - |
| 针数 | 8 | - | 8 | 8 | - | 8 | - |
| Reach Compliance Code | compli | - | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - | EAR99 | - |
| 最大时钟频率 (fCLK) | 0.4 MHz | - | 0.4 MHz | 0.4 MHz | - | 0.4 MHz | - |
| 数据保留时间-最小值 | 200 | - | 200 | 200 | - | 200 | - |
| 耐久性 | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | - |
| I2C控制字节 | 1010DDDR | - | 1010DDDR | 1010DDDR | - | 1010DDDR | - |
| JESD-30 代码 | R-PDSO-N8 | - | R-PDSO-N8 | R-PDSO-N8 | - | R-PDSO-N8 | - |
| JESD-609代码 | e3 | - | e3 | e3 | - | e3 | - |
| 长度 | 3 mm | - | 3 mm | 3 mm | - | 3 mm | - |
| 内存密度 | 65536 bi | - | 65536 bi | 65536 bi | - | 65536 bi | - |
| 内存集成电路类型 | EEPROM | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | - | 8 | - |
| 湿度敏感等级 | 1 | - | 1 | 1 | - | 1 | - |
| 功能数量 | 1 | 1 | 1 | 1 | - | 1 | - |
| 端子数量 | 8 | 8 | 8 | 8 | - | 8 | - |
| 字数 | 8192 words | - | 8192 words | 8192 words | - | 8192 words | - |
| 字数代码 | 8000 | - | 8000 | 8000 | - | 8000 | - |
| 工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | - |
| 最高工作温度 | 85 °C | - | 125 °C | 85 °C | - | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | - | -40 °C | - |
| 组织 | 8KX8 | 8K × 8 | 8KX8 | 8KX8 | - | 8KX8 | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - |
| 封装代码 | VSON | - | VSON | VSON | - | VSON | - |
| 封装等效代码 | SOLCC8,.11,20 | - | SOLCC8,.11,20 | SOLCC8,.11,20 | - | SOLCC8,.11,20 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE | - |
| 并行/串行 | SERIAL | - | SERIAL | SERIAL | - | SERIAL | - |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | - | 260 | - |
| 电源 | 2/5 V | - | 3/5 V | 2/5 V | - | 2/5 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | - |
| 座面最大高度 | 1 mm | - | 1 mm | 1 mm | - | 1 mm | - |
| 串行总线类型 | I2C | - | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | 0.000001 A | - | 0.000001 A | 0.000001 A | - | 0.000001 A | - |
| 最大压摆率 | 0.003 mA | - | 0.003 mA | 0.003 mA | - | 0.003 mA | - |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | - |
| 最小供电电压 (Vsup) | 2.5 V | - | 2.5 V | 1.7 V | - | 1.7 V | - |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 2.5 V | - | 2.5 V | - |
| 表面贴装 | YES | Yes | YES | YES | - | YES | - |
| 技术 | CMOS | - | CMOS | CMOS | - | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | - | INDUSTRIAL | - |
| 端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | - |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | NO LEAD | - | NO LEAD | - |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | - | 0.5 mm | - |
| 端子位置 | DUAL | 双 | DUAL | DUAL | - | DUAL | - |
| 处于峰值回流温度下的最长时间 | 40 | - | 40 | 40 | - | 40 | - |
| 宽度 | 2 mm | - | 2 mm | 2 mm | - | 2 mm | - |
| 最长写入周期时间 (tWC) | 5 ms | - | 5 ms | 5 ms | - | 5 ms | - |
| 写保护 | HARDWARE | - | HARDWARE | HARDWARE | - | HARDWARE | - |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
