Technical Data
DS4072
Effective
June
2017
Supersedes
March
2013
TVSA
Transient voltage
ESD suppressor
Applications
•
•
•
•
•
•
•
•
•
•
HF
Pb
FREE
HALOGEN
1
Surface Mount Device
Product features
•
Lead free, halogen free and RoHS compliant for
global applications
•
Single-line, bi-directional device for placement
flexibility
•
Silicon based chip
•
Low capacitance to meet the needs for high speed
single transient voltage protection
•
Provides ESD protection with fast response time
(<1ns) allowing equipment to pass IEC 61000-4-2
level 4 test
•
Low profile designs for board space savings
•
Low leakage current reduces power consumption
•
Low clamping voltage
•
Solid-state silicon-avalanche technology
2
Equivalent Circuits
Computers and peripherals
Digital cameras
Mobile phones
DVD/Media Players
MP3/Multimedia players
A-V Equipment
External storage
DSL Modems
Set top boxes
Docking systems
MLVB
04
V18
C001
Product Family
Size
Working DC Voltage
Capacitance in pF*
* Part numbers use “R” to denote decimal point for decimal values of pico farads.
Packaging
•
Size 0402: 10,000 pieces per reel - EIA (EIAJ)
•
Size 0603: 4000 pieces per reel - EIA (EIAJ)
Specifications
Part
Number
TVSA02V05C004
TVSA04V05C006
Size
0201
0402
Stand-O
Voltage
5
5
Breakdown
Voltage
10
10
Clamping Voltage
At I peak = 1A
17
17
Capacitance
pF
4
6
ESD
Air/Contact (kV)
15/8
15/8
Leakage Current
(typical)
< 10nA
< 10nA
Stand-off Voltage - Maximum DC operating voltage the diode can maintain and not exceed 1mA leakage
current. Breakdown Voltage - Measured at any I/O pin to ground at 1mA DC current.
Clamping Voltage - Maximum peak voltage across the diode with 8/20ms waveform and 1A pulse current.
Capacitance - Device capacitance measured with zero volt bias at 1MHz.
ESD Air/Contact - Voltages tested to IEC 61000-4-2.
Technical Data
DS4072
Effective
June
2017
TVSA
Transient voltage ESD suppressor
Dimensions - mm
Recommended Pad Layout - mm (in)
W
c
b
a
d
b
C
L
H
Size
0201
C
0.20±0.10
0.25±0.15
0402
Size
0201
0402
L
0.60±0.05
1.00±0.15
W
0.30±0.05
0.50±0.10
H
0.30±0.05
0.50±0.10
a
0.23
(0.009)
0.51
(0.020)
b
0.30
(0.012)
0.61
(0.024)
c
0.45
(0.018)
0.51
(0.020)
d
0.83
(0.033)
1.70
(0.067)
Tape Packaging Specifications - mm
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:
- IR Reflow = 260°C max for 30 sec. max.
- Wave Solder = 260°C max. for 10 sec. max.
• Recommended IR Reflow Profile:
0201 Carrier Dimensions
A
B
W
8.0
±0.1
E
F
P0
4.0
±0.1
P1
P2
D0
T
0.37
0.69
±0.03 ±0.03
1.75
3.5
±0.05 ±0.05
2.0
2.0
±0.05 ±0.05
1.55
0.42
±0.05 ±0.03
Temperature (°C)
Time (seconds)
0402 Carrier Dimensions
0.58
1.2
±0.03 ±0.03
8.0
±0.1
1.75
3.5
±0.05 ±0.05
4.0
±0.1
2.0
2.0
±0.05 ±0.05
1.55
0.60
±0.05 ±0.03
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved Printed in USA
Publication No.
DS4072
BU-SB13279
June
2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
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