IC LIMITING AMP 10UMAX
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | SOIC |
| 包装说明 | 3 MM, MICRO MAX PACKAGE-10 |
| 针数 | 10 |
| Reach Compliance Code | not_compliant |
| 应用程序 | SONET |
| JESD-30 代码 | S-PDSO-N10 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SON |
| 封装等效代码 | TSSOP10,.19,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大压摆率 | 0.041 mA |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 电信集成电路类型 | ATM/SONET/SDH SUPPORT CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| MAX3747AEUB-T | MAX3747EUB+ | MAX3747EUB+T | MAX3747AEUB+ | MAX3747BEUB+ | MAX3747BEUB+T | MAX3747BEUB-CBK | MAX3747AEUB+C99 | MAX3747BEUB+TCBK | MAX3747AEUB+T | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC LIMITING AMP 10UMAX | IC amp limiting sfp 10-umax | IC amp limiting sfp 10-umax | limiting amplifiers 155-3.2gbps sfp | limiting amplifiers 155-3.2gbps sfp | limiting amplifiers 155-3.2gbps sfp | Limiting Amplifiers 3.2G SFP Limiting Amplifier | Limiting Amplifiers 3.2G SFP Limiting Amplifier | Limiting Amplifiers 3.2G SFP Limiting Amplifier | |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - | - | 不含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - | - | 符合 |
| 包装说明 | 3 MM, MICRO MAX PACKAGE-10 | SON, TSSOP10,.19,20 | SON, TSSOP10,.19,20 | SON, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | - | - | - | SON, TSSOP10,.19,20 |
| Reach Compliance Code | not_compliant | compliant | compliant | compliant | compliant | compliant | - | - | - | compliant |
| JESD-30 代码 | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-G10 | R-PDSO-G10 | - | - | - | S-PDSO-N10 |
| JESD-609代码 | e0 | e4 | e4 | e3 | e3 | e3 | - | - | - | e3 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | - | - | - | - | 3 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - | 1 |
| 端子数量 | 10 | 10 | 10 | 10 | 10 | 10 | - | - | - | 10 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | - | - | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY |
| 封装代码 | SON | SON | SON | SON | TSSOP | TSSOP | - | - | - | SON |
| 封装等效代码 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | - | - | - | TSSOP10,.19,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | - | - | - | SQUARE |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | - | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED | - | - | - | - | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | - | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.1 mm | - | - | - | - | 0.8 mm |
| 最大压摆率 | 0.041 mA | 0.035 mA | 0.035 mA | 0.041 mA | 43 mA | 43 mA | - | - | - | 0.041 mA |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | - | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - | - | - | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - | - | - | BIPOLAR |
| 电信集成电路类型 | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | - | - | - | - | ATM/SONET/SDH SUPPORT CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | - | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING | - | - | - | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - | - | - | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | - | - | - | - | 3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - | 1 |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 | - | - | - | 1 |
| 端子面层 | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | - | - | Matte Tin (Sn) |
微控制器 MCU
RF/无线
PCB设计
聊聊、笑笑、闹闹
stm32/stm8
stm32/stm8
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
