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MEC1-120-02-F-D-A

产品描述1MM MINI-EDGE CARD ASSEMBLY
产品类别连接器    连接器   
文件大小1016KB,共1页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
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MEC1-120-02-F-D-A概述

1MM MINI-EDGE CARD ASSEMBLY

MEC1-120-02-F-D-A规格参数

参数名称属性值
是否Rohs认证符合
包装说明ROHS COMPLIANT
Reach Compliance Codecompliant
Samacsys Confidence4
Samacsys StatusReleased
Samacsys PartID319267
Samacsys Pin Count40
Samacsys Part CategoryConnector
Samacsys Package CategoryOther
Samacsys Footprint NameMEC1-120-02-F-D-A-1
Samacsys Released Date2017-01-13 11:19:58
Is SamacsysN
其他特性POLARIZED
板上安装选件PEG
主体宽度0.275 inch
主体深度0.275 inch
主体长度0.966 inch
主体/外壳类型SOCKET
连接器类型CARD EDGE CONNECTOR
联系完成配合GOLD FLASH OVER NICKEL (50)
联系完成终止Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别FEMALE
触点材料BERYLLIUM COPPER/BRASS
触点模式RECTANGULAR
触点样式CENTRONIC
DIN 符合性NO
滤波功能NO
IEC 符合性NO
绝缘体颜色BLACK
绝缘体材料LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码e3
MIL 符合性NO
插接触点节距0.039 inch
混合触点NO
安装选项1LOCKING
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数2
装载的行数2
最高工作温度125 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
电镀厚度10u inch
额定电流(信号)2 A
参考标准UL
可靠性COMMERCIAL
端子节距1 mm
端接类型SURFACE MOUNT
触点总数40
Base Number Matches1

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F-219
MEC1–120–02–F–D–A
MEC1–130–02–F–D–A
MEC1–140–02–L–D
(1.00 mm) .0394"
MEC1 SERIES
MINI EDGE CARD SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Sn or Au over 50 µ"
(1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Current Rating:
2.2 A per pin
(2 adjacent pins powered)
Voltage Rating:
300 VAC
Insertion Depth:
(5.84 mm) .230" to
(8.13 mm) .320"
RoHS Compliant:
Yes
Mates with:
(1.60 mm) .062" card
Mates with
(1.60 mm)
.062" card
APPLICATION
HIGH-SPEED CHANNEL PERFORMANCE
MEC1
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (05-20)
(0.15 mm) .006" max (30-70)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
14
G b p s
Optional
Alignment pin
MEC1
1
POSITIONS
PER ROW
02
PLATING
OPTION
D
NP
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
05, 08, 20, 30, 40, 50, 60, 70
= Gold flash on contact,
Matte tin on tail
–F
–L
ALSO AVAILABLE
(MOQ Required)
• Locking Clip
(Manual placement required)
• Other platings
(6.99)
.275
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
= No
Polarization
(05, 08, 20 &
30 positions
only)
Leave
Blank for
polarization
–NP
= Alignment
Pin metal or
plastic at
Samtec
discretion.
–A
= (7.87 mm)
.310" DIA
Polyimide film
Pick &
Place Pad
–K
(No. of Positions + 2) x
(1.00) .03937 + (2.54) .100
02
140
POSITIONS
PER ROW
05
08
20
30
40
50
60
70
Important Note:
Samtec recommends that
pads on the mating board be
Gold plated.
(0.36)
(1.00)
.014
.03937
(No. of Positions + 2)
x (1.00) .03937
01
139
(1.83)
.072
POLARIZED
POSITIONS
(No Contact)
3, 4
5, 6
15, 16
21, 22
31, 32
41, 42
31, 32, 63 & 64
53, 54, 115 & 116
= Tape & Reel
(05-60 only)
–TR
Notes:
While optimized for
50
W
applications, this
connector with alternative
signal/ground patterns may
also perform well in certain
75
W
applications.
Some sizes, styles and
options are non-standard,
non-returnable.
(8.89)
.350
(9.04)
.356
(0.15)
.006
(8.51)
.335
(0.89)
.035
DIA
(1.40)
.055
–A
OPTION
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

 
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