32-bit Microcontrollers with Enhanced Security, Image Capture, LQFP, /Tray
参数名称 | 属性值 |
Brand Name | Renesas |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
Objectid | 1832248626 |
零件包装代码 | LQFP |
包装说明 | LFQFP, QFP100,.63SQ,20 |
针数 | 100 |
制造商包装代码 | PLQP0100KB |
Reach Compliance Code | compliant |
Samacsys Description | RX63N Group microcontrollers come in a comprehensive memory vs. package lineup to suit your system scale. In addition to standard functions such as 12-bit A/D converter, motor control timers, SCI, RSPI, I2C, CAN, and safety features, connectivity functions such as Ethernet and USB host have been enhanced. The lineup also includes products possessing specialized functions, such as sensing/image display using a CMOS camera, or security (hardware AES encryption). Products that support high-temperature (105°C) |
Samacsys Manufacturer | Renesas Electronics |
Samacsys Modified On | 2023-10-24 19:30:29 |
YTEOL | 10.33 |
具有ADC | YES |
地址总线宽度 | 24 |
位大小 | 32 |
CPU系列 | RX |
最大时钟频率 | 16 MHz |
DAC 通道 | YES |
DMA 通道 | YES |
外部数据总线宽度 | 16 |
JESD-30 代码 | S-PQFP-G100 |
长度 | 14 mm |
湿度敏感等级 | 3 |
DMA 通道数量 | 6 |
I/O 线路数量 | 79 |
端子数量 | 100 |
计时器数量 | 20 |
片上程序ROM宽度 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装等效代码 | QFP100,.63SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
认证状态 | Not Qualified |
RAM(字节) | 131072 |
ROM(单词) | 2097152 |
ROM可编程性 | FLASH |
座面最大高度 | 1.7 mm |
速度 | 100 MHz |
最大压摆率 | 100 mA |
最大供电电压 | 3.6 V |
最小供电电压 | 2.7 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
宽度 | 14 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
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