STABISTOR DIODE
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | O-XALF-W2 |
| 针数 | 2 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 其他特性 | UL FLAMMABILITY |
| 外壳连接 | ISOLATED |
| 配置 | SINGLE |
| 二极管元件材料 | SILICON |
| 二极管类型 | STABISTOR DIODE |
| 最大正向电压 (VF) | 1.75 V |
| 正向电压最小值(VF) | 1.25 V |
| JESD-30 代码 | O-XALF-W2 |
| JESD-609代码 | e0 |
| 元件数量 | 1 |
| 端子数量 | 2 |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | ROUND |
| 封装形式 | LONG FORM |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | WIRE |
| 端子位置 | AXIAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |

| SV02YS | SV03YS | SV04YS | SV05YS | SV06YS | |
|---|---|---|---|---|---|
| 描述 | STABISTOR DIODE | SILICON, STABISTOR DIODE | SILICON, STABISTOR DIODE | STABISTOR DIODE | SILICON, STABISTOR DIODE |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 |
| 针数 | 2 | 2 | 2 | 2 | 2 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | UL FLAMMABILITY | UL FLAMMABILITY | UL FLAMMABILITY | UL FLAMMABILITY | UL FLAMMABILITY |
| 外壳连接 | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
| 配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 二极管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
| 二极管类型 | STABISTOR DIODE | STABISTOR DIODE | STABISTOR DIODE | STABISTOR DIODE | STABISTOR DIODE |
| 最大正向电压 (VF) | 1.75 V | 2.55 V | 3.3 V | 4.2 V | 4.95 V |
| 正向电压最小值(VF) | 1.25 V | 2.05 V | 2.7 V | 3.4 V | 4.05 V |
| JESD-30 代码 | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 元件数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 2 | 2 | 2 | 2 | 2 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | ROUND | ROUND | ROUND | ROUND | ROUND |
| 封装形式 | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | WIRE | WIRE | WIRE | WIRE | WIRE |
| 端子位置 | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved