IC BUFF NON-INVERT 5.5V 20DHVQFN
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 厂商名称 | Nexperia |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 20 |
| 制造商包装代码 | SOT764-1 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 8 weeks |
| Samacsys Description | 74HC244; 74HCT244 - Octal buffer/line driver; 3-state@en-us |
| 系列 | HCT |
| JESD-30 代码 | R-PQCC-N20 |
| JESD-609代码 | e4 |
| 长度 | 4.5 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 传播延迟(tpd) | 33 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 2.5 mm |

| 74HCT244BQ,115 | 74HCT244DB,118 | 74HCT244D,653 | PRA100C7-264RBWB31 | 74HC244D,653 | |
|---|---|---|---|---|---|
| 描述 | IC BUFF NON-INVERT 5.5V 20DHVQFN | IC BUF NON-INVERT 5.5V 20SSOP | Array/Network Resistor, Bussed, Thin Film, 0.1W, 264ohm, 50V, 0.1% +/-Tol, -10,10ppm/Cel, 2806, | 逻辑电路的归属系列:74HC 逻辑类型:缓冲器,非反向 元件数:2 每元件位数:4 | |
| 包装说明 | HVQCCN, | SSOP, | SOP, | SMT, 2806 | SOP, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 系列 | HCT | HCT | HCT | PRA (CNW) | HC/UH |
| JESD-609代码 | e4 | e4 | e4 | e0 | e4 |
| 端子数量 | 20 | 20 | 20 | 14 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 155 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMT | SMALL OUTLINE |
| 技术 | CMOS | CMOS | CMOS | THIN FILM | CMOS |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Brand Name | Nexperia | Nexperia | Nexperia | - | Nexperia |
| 厂商名称 | Nexperia | Nexperia | Nexperia | - | Nexperia |
| 零件包装代码 | QFN | SSOP2 | SOP | - | SOP |
| 针数 | 20 | 20 | 20 | - | 20 |
| 制造商包装代码 | SOT764-1 | SOT339-1 | SOT163-1 | - | SOT163-1 |
| Factory Lead Time | 8 weeks | - | 4 weeks | - | 4 weeks |
| Samacsys Description | 74HC244; 74HCT244 - Octal buffer/line driver; 3-state@en-us | 74HC244; 74HCT244 - Octal buffer/line driver; 3-state@en-us | 74HC244; 74HCT244 - Octal buffer/line driver; 3-state@en-us | - | 74HC244; 74HCT244 - Octal buffer/line driver; 3-state@en-us |
| JESD-30 代码 | R-PQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | - | R-PDSO-G20 |
| 长度 | 4.5 mm | 7.2 mm | 12.8 mm | - | 12.8 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 |
| 位数 | 4 | 4 | 4 | - | 4 |
| 功能数量 | 2 | 2 | 2 | - | 2 |
| 端口数量 | 2 | 2 | 2 | - | 2 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | - | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | SSOP | SOP | - | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | - | 260 |
| 传播延迟(tpd) | 33 ns | 33 ns | 33 ns | - | 165 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1 mm | 2 mm | 2.65 mm | - | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | YES | YES | YES | - | YES |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE |
| 端子形式 | NO LEAD | GULL WING | GULL WING | - | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | - | 30 |
| 宽度 | 2.5 mm | 5.3 mm | 7.5 mm | - | 7.5 mm |
| 是否Rohs认证 | - | 符合 | 符合 | 不符合 | 符合 |
| 负载电容(CL) | - | 50 pF | 50 pF | - | 50 pF |
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