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25AA160D-I/W16K

产品描述IC EEPROM 16K SPI 10MHZ WAFER
产品类别存储    存储   
文件大小966KB,共34页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
下载数据手册 下载用户手册 详细参数 选型对比 全文预览

25AA160D-I/W16K概述

IC EEPROM 16K SPI 10MHZ WAFER

25AA160D-I/W16K规格参数

参数名称属性值
厂商名称Microchip(微芯科技)
包装说明DIE,
Reach Compliance Codeunknown
其他特性ALSO OPERATES WITH 2.5V MIN @ 5MHZ AND 1.8VMIN @3MHZ
最大时钟频率 (fCLK)10 MHz
JESD-30 代码R-XUUC-N
内存密度16384 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
字数2048 words
字数代码2000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织2KX8
封装主体材料UNSPECIFIED
封装代码DIE
封装形状RECTANGULAR
封装形式UNCASED CHIP
并行/串行SERIAL
串行总线类型SPI
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式NO LEAD
端子位置UPPER
最长写入周期时间 (tWC)5 ms

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25AA160C/D, 25LC160C/D
16K SPI Bus Serial EEPROM
Device Selection Table
Part Number
25LC160C
25AA160C
25LC160D
25AA160D
V
CC
Range
2.5-5.5V
1.8-5.5V
2.5-5.5V
1.8-5.5V
Page Size
16 Byte
16 Byte
32 Byte
32 Byte
Temp. Ranges
I,E
I
I,E
I, E
Packages
P, SN, ST, MS, MN
P, SN, ST, MS, MN
P, SN, ST, MS, MN
P, SN, ST, MS, MN
Features:
• Max. Clock 10 MHz
• Low-Power CMOS Technology:
- Max. write current: 5 mA at 5.5V
- Read current: 5 mA at 5.5V, 10 MHz
- Standby current: 5 uA at 5.5V
• 2048 x 8-bit Organization
• 16-Byte Page (‘C’ version devices)
• 32-Byte Page (‘D’ version devices)
• Self-Timed Erase and Write Cycles (5 ms max.)
• Block Write Protection:
- Protect none, 1/4, 1/2 or all of array
• Built-In Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
• Sequential Read
• High Reliability:
- Endurance: > 1M erase/write cycles
- Data retention: > 200 years
- ESD protection: > 4000V
• Temperature Ranges Supported:
- Industrial (I):
-40C to +85C
- Automotive (E):
-40°C to +125°C
• Pb-Free and RoHS Compliant
Description:
The Microchip Technology Inc. 25AA160C/D,
25LC160C/D (25XX160C/D
*
) are 16 Kbit Serial
Electrically Erasable PROMs. The memory is accessed
via a simple Serial Peripheral Interface (SPI)
compatible serial bus. The bus signals required are a
clock input (SCK) plus separate data in (SI) and data
out (SO) lines. Access to the device is controlled
through a Chip Select (CS) input.
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused, transi-
tions on its inputs will be ignored, with the exception of
Chip Select, allowing the host to service higher priority
interrupts.
The 25XX160C/D is available in standard packages
including 8-lead PDIP and SOIC, and advanced
packaging including 8-lead MSOP, TSSOP, and 2x3
TDFN. All packages are Pb-free and RoHS compliant.
Package Types (not to scale)
TSSOP/MSOP
(ST, MS)
CS
SO
WP
V
SS
1
2
3
4
8
7
6
5
V
CC
HOLD
SCK
SI
PDIP/SOIC
(P, SN)
CS
SO
WP
V
SS
1
2
3
4
8
7
6
5
V
CC
HOLD
SCK
SI
TDFN
(MN)
CS 1
SO 2
WP 3
8
7
6
5
V
CC
HOLD
SCK
V
SS
4
SI
*
25XX160C/D
is used in this document as a generic part
number for the 25AA160C/D, 25LC160C/D devices.
2009-2013 Microchip Technology Inc.
DS22150B-page 1

25AA160D-I/W16K相似产品对比

25AA160D-I/W16K 25AA160D-I/S16K 25AA160D-I/WF16K 25LC160C-I/SN 25AA160DT-E/SN16KVAO 25AA160D-E/SN16KVAO
描述 IC EEPROM 16K SPI 10MHZ WAFER IC EEPROM 16K SPI 10MHZ WAFER IC EEPROM 16K SPI 10MHZ WAFER 存储器接口类型:SPI 存储器容量:16Kb (2K x 8) 工作电压:2.5V ~ 5.5V 存储器类型:Non-Volatile 16 Kbit(2K x 8bit),SPI接口,电压范围:2.5V~5.5V EEPROM, 1KX8, Serial, CMOS, PDSO8 EEPROM, 1KX8, Serial, CMOS, PDSO8
包装说明 DIE, DIE, DIE, SOP, SOP8,.25 SOP, SOIC-8
Reach Compliance Code unknown unknown unknown compliant compliant compli
最大时钟频率 (fCLK) 10 MHz 10 MHz 10 MHz 5 MHz 10 MHz 10 MHz
JESD-30 代码 R-XUUC-N R-XUUC-N R-XUUC-N R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
内存密度 16384 bit 16384 bit 16384 bit 8192 bit 8192 bit 8192 bi
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 8 8 8 8 8 8
功能数量 1 1 1 1 1 1
字数 2048 words 2048 words 2048 words 1024 words 1024 words 1024 words
字数代码 2000 2000 2000 1000 1000 1000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 2KX8 2KX8 2KX8 1KX8 1KX8 1KX8
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIE DIE DIE SOP SOP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 UNCASED CHIP UNCASED CHIP UNCASED CHIP SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
并行/串行 SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
串行总线类型 SPI SPI SPI SPI SPI SPI
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 2.5 V 1.8 V 1.8 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 NO LEAD NO LEAD NO LEAD GULL WING GULL WING GULL WING
端子位置 UPPER UPPER UPPER DUAL DUAL DUAL
最长写入周期时间 (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) - - Microchip(微芯科技)

 
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