(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
Operating Junction Temperature Range
Symbol
V
RRM
V
RWM
V
R
300
400
I
F(AV)
1.0
2.0
I
FSM
35
T
J
−65 to +175
°C
A
A
Value
Unit
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Rating
Thermal Resistance, Junction−to−Lead (T
L
= 25°C)
Symbol
R
qJL
Max
13
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 1)
(i
F
= 2.0 A, T
J
= 25°C)
(i
F
= 2.0 A, T
J
= 150°C)
Maximum Instantaneous Reverse Current (Note 1)
(Rated DC Voltage, T
J
= 25°C)
(Rated DC Voltage, T
J
= 150°C)
Maximum Reverse Recovery Time
(i
F
= 1.0 A, di/dt = 50 A/ms)
(i
F
= 0.5 A, i
R
= 1.0 A, I
R
to 0.25 A)
Maximum Forward Recovery Time
(i
F
= 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V)
Symbol
v
F
1.30
1.05
i
R
5.0
150
t
rr
65
50
t
fr
50
ns
ns
mA
Value
Unit
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
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2
MURS230T3G, NRVUS230T3G, MURS240T3G, NRVUS240T3G
10
7.0
5.0
10
7.0
5.0
3.0
175°C
I , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
2.0
T
C
= 25°C
1.0
0.7
0.5
100°C
I , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
3.0
175°C
2.0
T
C
= 25°C
1.0
0.7
0.5
100°C
0.3
0.2
0.3
0.2
0.1
0.07
0.05
0.1
0.07
0.05
0.03
0.02
0.03
0.02
0.01
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
v
F,
INSTANTANEOUS VOLTAGE (VOLTS)
0.01
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
v
F,
INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
100
T
J
= 175°C
I
R
, REVERSE CURRENT (mA)
I
R
, REVERSE CURRENT (mA)
10
T
J
= 150°C
1
T
J
= 100°C
0.1
1000
T
J
= 175°C
100
T
J
= 150°C
10
T
J
= 100°C
0.01
T
J
= 25°C
0
50
100
150
200
250
300
350
400
1
T
J
= 25°C
0.001
V
R
, REVERSE VOLTAGE (VOLTS)
0.1
0
50
100
150
200
250
300
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current*
* The curves shown are typical for the highest voltage device in the voltage
grouping. Typical reverse current for lower voltage selections can be estim
ated from these same curves if applied V
R
is sufficiently below rated V
R
.
Figure 4. Maximum Reverse Current for
MURS230T3G, NRVUS230T3G
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3
MURS230T3G, NRVUS230T3G, MURS240T3G, NRVUS240T3G
1000
I
R
, REVERSE CURRENT (mA)
T
J
= 175°C
100
T
J
= 150°C
10
T
J
= 100°C
1
T
J
= 25°C
0.1
0
50
100
150
200
250
300
350
400
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 5. Maximum Reverse Current for
MURS240T3G, NRVUS240T3G
30
25
C, CAPACITANCE (pF)
20
15
10
5
0
0
4.0
8.0
12
16
20
24
28
32
36
40
V
R
, REVERSE VOLTAGE (VOLTS)
NOTE: TYPICAL
CAPACITANCE AT
0 V = 26 pF
35
30
C, CAPACITANCE (pF)
25
20
15
10
5
0
0
4
8
12
16
20
24
28
32
36
40
V
R
, REVERSE VOLTAGE (VOLTS)
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 30 pF
Figure 6. Typical Capacitance
Figure 7. Maximum Capacitance
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
10
9
8
7
6
5
4
3
2
1
0
80
90
100
110
120
130
140
150
160
170
180
T
C
, CASE TEMPERATURE (°C)
SQUARE WAVE
dc
RATED VOLTAGE APPLIED
R
qJL
= 13°C/W
T
J
= 175°C
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
5
T
J
= 175°C
4
3
SQUARE WAVE
dc
1
0
0
0.5
1.0
1.5
2.0
2.5
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
2
Figure 8. Current Derating, Case
Figure 9. Power Dissipation
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4
MURS230T3G, NRVUS230T3G, MURS240T3G, NRVUS240T3G
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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