Datasheet> 器件分类 > 存储> 存储> BR25H320F-2CE2

BR25H320F-2CE2: 产品描述IC EEPROM 32K SPI 10MHZ 8SOP; 产品类别存储存储; 文件大小917KB，共34页; 制造商ROHM(罗姆半导体); 官网地址https://www.rohm.com/; 标准

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BR25H320F-2CE2概述

IC EEPROM 32K SPI 10MHZ 8SOP

BR25H320F-2CE2规格参数

参数名称	属性值
是否Rohs认证	符合
包装说明	SOP-8
Reach Compliance Code	compliant
Factory Lead Time	16 weeks
其他特性	ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED
最大时钟频率 (fCLK)	10 MHz
数据保留时间-最小值	20
耐久性	300000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8
长度	5 mm
内存密度	32768 bit
内存集成电路类型	EEPROM
内存宽度	8
功能数量	1
端子数量	8
字数	4096 words
字数代码	4000
工作模式	SYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-40 °C
组织	4KX8
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3/5 V
认证状态	Not Qualified
筛选级别	AEC-Q100
座面最大高度	1.71 mm
串行总线类型	SPI
最大待机电流	0.00001 A
最大压摆率	0.004 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	4.4 mm
最长写入周期时间 (tWC)	4 ms
写保护	HARDWARE
Base Number Matches	1

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Datasheet

Serial EEPROM Series Automotive EEPROM

125℃ Operation SPI BUS EEPROM

BR25H320-2C

●General

Description

BR25H320-2C is a serial EEPROM of SPI BUS interface method.

●Features

High speed clock action up to 10MHz (Max.)

Wait function by HOLDB terminal.

Part or whole of memory arrays settable as read only

memory area by program.

2.5½5.5V single power source action most suitable

for battery use.

Page write mode useful for initial value write at

factory shipment.

For SPI bus interface (CPOL, CPHA)=(0, 0), (1, 1)

Self-timed programming cycle.

Low Supply Current

At Write Operation (5V)

: 1.0mA (Typ.)

At Read Operation (5V)

: 1.0mA (Typ.)

At Standby Operation (5V)

: 0.1μA (Typ.)

Address auto increment function at read operation

Prevention of write mistake

Write prohibition at power on.

Write prohibition by command code (WRDI).

Write prohibition by WPB pin.

Write prohibition block setting by status registers

(BP1, BP0).

Write mistake prevention function at low voltage.

MSOP8, TSSOP-B8, SOP8, SOP-J8 Package

Data at shipment Memory array: FFh, status register

WPEN, BP1, BP0 : 0

Data kept for 50 years (Ta≦125℃).

Data rewrite up to 300,000 times (Ta≦125℃).

AEC-Q100 Qualified.

●Package

MSOP8

2.90mm x 4.00mm x 0.90mm

TSSOP-B8

3.00mm x 6.40mm x 1.20mm

SOP8

5.00mm x 6.20mm x 1.71mm

SOP-J8

4.90mm x 6.00mm x 1.65mm

●Page

write

Number of pages

Product Number

32 Byte

BR25H320-2C

●BR25H320-2C

Capacity

Bit Format

32Kbit

4Kx8

Product Number

BR25H320-2C

Supply Voltage

2.5~5.5V

MSOP8

●

TSSOP-B8

●

SOP8

●

SOP-J8

●

○Product

structure：Silicon monolithic integrated circuit

www.rohm.com

TSZ22111・14・001

○This

product is not designed protection against radioactive rays

1/31

TSZ02201-0W1W0G100010-1-2

19.Dec.2012 Rev.003

BR25H320F-2CE2相似产品对比

	BR25H320F-2CE2	BR25H320FVT-2CE2	BR25H320FVM-2CTR	BR25H320FJ-2CE2
描述	IC EEPROM 32K SPI 10MHZ 8SOP	EEPROM SPI BUS 10MHz 32Kbit 2.5-5.5V	IC EEPROM 32K SPI 10MHZ 8MSOP	IC EEPROM 32K SPI 10MHZ 8SOPJ
是否Rohs认证	符合	符合	符合	符合
包装说明	SOP-8	TSSOP-8	MSOP-8	SOP-8
Reach Compliance Code	compliant	compliant	compliant	compliant
其他特性	ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED	ALSO OPERATES AT 2.5V WITH 5MHZ	ALSO OPERATES AT 2.5V WITH 5MHZ	ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED
最大时钟频率 (fCLK)	10 MHz	10 MHz	10 MHz	10 MHz
数据保留时间-最小值	20	20	20	20
耐久性	300000 Write/Erase Cycles	300000 Write/Erase Cycles	300000 Write/Erase Cycles	300000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
长度	5 mm	4.4 mm	2.9 mm	4.9 mm
内存密度	32768 bit	32768 bit	32768 bit	32768 bit
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	8	8	8	8
功能数量	1	1	1	1
端子数量	8	8	8	8
字数	4096 words	4096 words	4096 words	4096 words
字数代码	4000	4000	4000	4000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C
组织	4KX8	4KX8	4KX8	4KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	TSSOP	VSSOP	LSOP
封装等效代码	SOP8,.25	TSSOP8,.25	TSSOP8,.16	SOP8,.25
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	3/5 V	3/5 V	3/5 V	3/5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified
筛选级别	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100
座面最大高度	1.71 mm	1.2 mm	0.9 mm	1.65 mm
串行总线类型	SPI	SPI	SPI	SPI
最大待机电流	0.00001 A	0.00001 A	0.00001 A	0.00001 A
最大压摆率	0.004 mA	0.004 mA	0.004 mA	0.004 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	0.65 mm	0.65 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	4.4 mm	3 mm	2.8 mm	3.9 mm
最长写入周期时间 (tWC)	4 ms	4 ms	4 ms	4 ms
写保护	HARDWARE	HARDWARE	HARDWARE	HARDWARE
Base Number Matches	1	1	1	1
Factory Lead Time	16 weeks	-	16 weeks	16 weeks

BR25H320F-2CE2

BR25H320F-2CE2在线购买

BR25H320F-2CE2概述

BR25H320F-2CE2规格参数

文档预览

BR25H320F-2CE2相似产品对比

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