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74HC74DTR2

产品描述HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14
产品类别逻辑    逻辑   
文件大小131KB,共8页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
下载文档 详细参数 选型对比 全文预览

74HC74DTR2概述

HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14

HC/UH系列, 双正边沿D触发器, 互补输出, PDSO14

74HC74DTR2规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称ON Semiconductor(安森美)
零件包装代码TSSOP
包装说明TSSOP, TSSOP14,.25
针数14
Reach Compliance Codenot_compliant
系列HC/UH
JESD-30 代码R-PDSO-G14
JESD-609代码e0
长度5 mm
负载电容(CL)50 pF
逻辑集成电路类型D FLIP-FLOP
最大频率@ Nom-Sup20000000 Hz
最大I(ol)0.004 A
位数1
功能数量2
端子数量14
最高工作温度125 °C
最低工作温度-55 °C
输出极性COMPLEMENTARY
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP14,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)240
电源2/6 V
传播延迟(tpd)150 ns
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
触发器类型POSITIVE EDGE
宽度4.4 mm
Base Number Matches1

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74HC74
Dual D Flip−Flop with Set
and Reset
High−Performance Silicon−Gate CMOS
The 74HC74 is identical in pinout to the LS74. The device inputs are
compatible with standard CMOS outputs; with pullup resistors, they
are compatible with LSTTL outputs.
This device consists of two D flip−flops with individual Set, Reset,
and Clock inputs. Information at a D−input is transferred to the
corresponding Q output on the next positive going edge of the clock
input. Both Q and Q outputs are available from each flip−flop. The Set
and Reset inputs are asynchronous.
Features
14
1
http://onsemi.com
MARKING
DIAGRAMS
14
SOIC−14
D SUFFIX
CASE 751A
1
HC74G
AWLYWW
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0
mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the JEDEC Standard No. 7A Requirements
ESD Performance: HBM
>
2000 V; Machine Model
>
200 V
Chip Complexity: 128 FETs or 32 Equivalent Gates
Pb−Free Packages are Available
14
14
1
TSSOP−14
DT SUFFIX
CASE 948G
1
HC
74
ALYW
G
G
HC74
= Device Code
A
= Assembly Location
L, WL
= Wafer Lot
Y
= Year
W, WW = Work Week
G or
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2007
February, 2007
Rev. 0
1
Publication Order Number:
74HC74/D

74HC74DTR2相似产品对比

74HC74DTR2 74HC74DTR2G 74HC74DR2G 74HC74DR2 74HC74DG 74HC74D 74HC74
描述 HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 Dual D Flip−Flop with Set and Reset High−Performance Silicon−Gate CMOS HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14
系列 HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH
位数 1 1 1 1 1 1 1
功能数量 2 2 2 2 2 2 2
端子数量 14 14 14 14 14 14 14
输出极性 COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
表面贴装 YES YES YES YES YES YES Yes
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE 边缘
是否Rohs认证 不符合 符合 符合 不符合 符合 不符合 -
厂商名称 ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美) -
零件包装代码 TSSOP TSSOP SOIC SOIC SOIC SOIC -
包装说明 TSSOP, TSSOP14,.25 TSSOP, TSSOP14,.25 SOP, SOP14,.25 SOP, SOP14,.25 SOP, SOP14,.25 SOP, SOP14,.25 -
针数 14 14 14 14 14 14 -
Reach Compliance Code not_compliant unknown unknown not_compliant compliant _compli -
JESD-30 代码 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 -
JESD-609代码 e0 e4 e3 e0 e3 e0 -
长度 5 mm 5 mm 8.65 mm 8.65 mm 8.65 mm 8.65 mm -
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF -
逻辑集成电路类型 D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP -
最大频率@ Nom-Sup 20000000 Hz 20000000 Hz 20000000 Hz 20000000 Hz 20000000 Hz - -
最大I(ol) 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A -
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C -
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 TSSOP TSSOP SOP SOP SOP SOP -
封装等效代码 TSSOP14,.25 TSSOP14,.25 SOP14,.25 SOP14,.25 SOP14,.25 SOP14,.25 -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE -
包装方法 TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL RAIL RAIL -
峰值回流温度(摄氏度) 240 260 260 240 260 NOT SPECIFIED -
电源 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V -
传播延迟(tpd) 150 ns 150 ns 150 ns 150 ns 150 ns 150 ns -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
座面最大高度 1.2 mm 1.2 mm 1.75 mm 1.75 mm 1.75 mm 1.75 mm -
最大供电电压 (Vsup) 6 V 6 V 6 V 6 V 6 V 6 V -
最小供电电压 (Vsup) 2 V 2 V 2 V 2 V 2 V 2 V -
标称供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V -
技术 CMOS CMOS CMOS CMOS CMOS CMOS -
端子面层 TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn) TIN LEAD MATTE TIN TIN LEAD -
端子节距 0.65 mm 0.65 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm -
处于峰值回流温度下的最长时间 30 40 40 30 40 NOT SPECIFIED -
宽度 4.4 mm 4.4 mm 3.9 mm 3.9 mm 3.9 mm 3.9 mm -
Base Number Matches 1 1 1 1 1 - -

 
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