IC 4BIT BINARY FULL ADDER 16SSOP
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SSOP1 |
| 包装说明 | SSOP, SSOP16,.3 |
| 针数 | 16 |
| 制造商包装代码 | SOT338-1 |
| Reach Compliance Code | compliant |
| 其他特性 | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 6.2 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | ADDER/SUBTRACTOR |
| 湿度敏感等级 | 1 |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 传播延迟（tpd） | 315 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 5.3 mm |
| 74HC283DB,112 | 74HC283D/AUJ | 74HC283D,653 | 74HC283D,652 | 74HC283DB,118 | 74HC283N,652 | 74HC283PW,112 | 74HC283PW,118 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC 4BIT BINARY FULL ADDER 16SSOP | logic adder & subtractor 4-bit binary full adder w/fastcarry | IC 4BIT BINARY FULL ADDER 16SOIC | IC 4BIT BINARY FULL ADDER 16SOIC | IC 4BIT BINARY FULL ADDER 16SSOP | IC 4BIT BINARY FULL ADDER 16-DIP | IC 4BIT BINAR FULL ADDER 16TSSOP | IC 4BIT BINAR FULL ADDER 16TSSOP |
| Brand Name | NXP Semiconductor | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SSOP1 | - | SOP | SOP | SSOP1 | DIP | TSSOP | TSSOP |
| 包装说明 | SSOP, SSOP16,.3 | - | SOP, | SOP, SOP16,.25 | SSOP, | DIP, DIP16,.3 | TSSOP, TSSOP16,.25 | TSSOP, |
| 针数 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | SOT338-1 | - | SOT109-1 | SOT109-1 | SOT338-1 | SOT38-4 | SOT403-1 | SOT403-1 |
| Reach Compliance Code | compliant | - | compliant | compliant | unknown | compliant | compliant | compliant |
| 其他特性 | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING | - | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING |
| 系列 | HC/UH | - | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e4 | - | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 6.2 mm | - | 9.9 mm | 9.9 mm | 6.2 mm | 19.025 mm | 5 mm | 5 mm |
| 负载电容（CL） | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | ADDER/SUBTRACTOR | - | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | - | 1 | 1 |
| 位数 | 4 | - | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | TRUE | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | - | SOP | SOP | SSOP | DIP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 315 ns | - | 315 ns | 315 ns | 315 ns | 315 ns | 315 ns | 315 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | - | 1.75 mm | 1.75 mm | 2 mm | 4.2 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 6 V | - | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | - | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | YES | YES | YES | NO | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | - | 1.27 mm | 1.27 mm | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 5.3 mm | - | 3.9 mm | 3.9 mm | 5.3 mm | 7.62 mm | 4.4 mm | 4.4 mm |
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