IC TXRX NON-INVERT 3.6V 60HUQFN
参数名称 | 属性值 |
Brand Name | NXP Semiconductor |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | QFN |
包装说明 | VBCC, SLGA60,8X12,20 |
针数 | 60 |
制造商包装代码 | SOT1134-1 |
Reach Compliance Code | compliant |
其他特性 | WITH DIRECTION CONTROL |
控制类型 | COMMON CONTROL |
计数方向 | BIDIRECTIONAL |
系列 | LVT |
JESD-30 代码 | R-PBCC-B60 |
长度 | 6 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS TRANSCEIVER |
最大I(ol) | 0.064 A |
位数 | 8 |
功能数量 | 2 |
端口数量 | 2 |
端子数量 | 60 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VBCC |
封装等效代码 | SLGA60,8X12,20 |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER, VERY THIN PROFILE |
包装方法 | TAPE AND REEL |
电源 | 3.3 V |
Prop。Delay @ Nom-Sup | 3.3 ns |
传播延迟(tpd) | 3.5 ns |
认证状态 | Not Qualified |
座面最大高度 | 0.5 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子形式 | BUTT |
端子节距 | 0.5 mm |
端子位置 | BOTTOM |
宽度 | 4 mm |
Base Number Matches | 1 |
74LVT16245BBQ,518 | 935288809515 | 935288809518 | 74LVT16245BEV-S | 74LVTH16245BBQ,518 | 935288811518 | ACT381T-42700LADNBBXZC | |
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描述 | IC TXRX NON-INVERT 3.6V 60HUQFN | LVT SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PBCC60, 4 X 6 MM, 0.50 MM HEIGHT, PLASTIC, SOT1134-1, HQFN-60 | LVT SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PBCC60, 4 X 6 MM, 0.50 MM HEIGHT, PLASTIC, SOT1134-1, HQFN-60 | 总线收发器 3.3V xver dir pin N-inv bush3s | IC TXRX NON-INVERT 3.6V 60HUQFN | LVT SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PBCC60, 4 X 6 MM, 0.50 MM HEIGHT, PLASTIC, SOT1134-1, HQFN-60 | TCXO |
厂商名称 | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
包装说明 | VBCC, SLGA60,8X12,20 | HVBCC, | HVBCC, | - | 4 X 6 MM, 0.50 MM HEIGHT, PLASTIC, SOT1134-1, HQFN-60 | 4 X 6 MM, 0.50 MM HEIGHT, PLASTIC, SOT1134-1, HQFN-60 | - |
Reach Compliance Code | compliant | unknow | unknow | - | compliant | unknown | - |
其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | - | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | - |
系列 | LVT | LVT | LVT | - | LVT | LVT | - |
JESD-30 代码 | R-PBCC-B60 | R-PBCC-B60 | R-PBCC-B60 | - | R-PBCC-B60 | R-PBCC-B60 | - |
长度 | 6 mm | 6 mm | 6 mm | - | 6 mm | 6 mm | - |
逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | - | BUS TRANSCEIVER | BUS TRANSCEIVER | - |
位数 | 8 | 8 | 8 | - | 8 | 8 | - |
功能数量 | 2 | 2 | 2 | - | 2 | 2 | - |
端口数量 | 2 | 2 | 2 | - | 2 | 2 | - |
端子数量 | 60 | 60 | 60 | - | 60 | 60 | - |
最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | - |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | - |
输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | - |
输出极性 | TRUE | TRUE | TRUE | - | TRUE | TRUE | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | VBCC | HVBCC | HVBCC | - | VBCC | HVBCC | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
封装形式 | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
传播延迟(tpd) | 3.5 ns | 3.5 ns | 3.5 ns | - | 3.5 ns | 3.5 ns | - |
座面最大高度 | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm | - |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | - |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | - |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | - |
表面贴装 | YES | YES | YES | - | YES | YES | - |
技术 | BICMOS | BICMOS | BICMOS | - | BICMOS | BICMOS | - |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - |
端子形式 | BUTT | BUTT | BUTT | - | BUTT | BUTT | - |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm | - |
端子位置 | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | - |
宽度 | 4 mm | 4 mm | 4 mm | - | 4 mm | 4 mm | - |
Base Number Matches | 1 | 1 | 1 | - | 1 | - | - |
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