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SMBJ5360CE3/TR13

产品描述DIODE ZENER 25V 5W SMBJ
产品类别半导体    分立半导体   
文件大小397KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

SMBJ5360CE3/TR13概述

DIODE ZENER 25V 5W SMBJ

SMBJ5360CE3/TR13规格参数

参数名称属性值
电压 - 齐纳(标称值)(Vz)25V
容差±2%
功率 - 最大值5W
阻抗(最大值)(Zzt)4 Ohms
不同 Vr 时的电流 - 反向漏电流500nA @ 18V
不同 If 时的电压 - 正向(Vf1.2V @ 1A
工作温度-65°C ~ 150°C
安装类型表面贴装
封装/外壳DO-214AA,SMB
供应商器件封装SMBJ(DO-214AA)

文档预览

下载PDF文档
SMBJ5333B thru SMBJ5388B
Available
Surface Mount Silicon 5 Watt
Zener Diodes
DESCRIPTION
The SMBJ5333B - SMBJ5388B series of surface mount 5.0 watt Zeners provides a selection
from 3.3 to 200 volts with different tolerances as identified by suffix letter on the part number.
It is equivalent to the JEDEC registered 1N5333 thru 1N5388B with identical electrical
characteristics and testing. These parts are available with either Sn/Pb plating or a RoHS
compliant matte-tin finish. This J-bend design (SMBJ) in the DO-214AA allows for greater PC
board mounting density. These plastic encapsulated Zeners have a moisture classification of
“Level 1” with no dry pack required. Microsemi also offers numerous other Zener products to
meet higher and lower power applications.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-214AA
J-Bend Package
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
Surface mount equivalent to JEDEC registered 1N5333 thru 1N5388 series.
Ideal for high-density and low-profile mounting.
Zener voltage available 3.3 V to 200 V.
Plus/minus 10%, 5% and 2% voltage tolerances are available.
(See
part nomenclature
block.)
RoHS compliant versions available.
Also available in:
DO-215AA Package
(Gull-wing surface mount)
SMBG5333 – SMBG5388
T-18 Package
(axial-leaded)
1N5333 – 1N5388
APPLICATIONS / BENEFITS
Regulates voltage over broad operating current and temperature ranges.
Wide selection from 3.3 to 200 V.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Withstands high surge stresses.
Minimal changes of voltage versus current.
High specified maximum current (I
ZM
) with adequate heat sinking.
Moisture classification is “Level 1” per IPC/JEDEC J-STD-020B with no dry pack required.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
(1)
Thermal Resistance Junction-to-Ambient
o (2)
Off-State Power Dissipation @ 25 C
Forward Voltage @ 1.0 A
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
D
V
F
T
SP
Value
-65 to +150
25
90
5.0
1.2
260
Unit
C
C/W
o
C/W
W
V
o
C
o
o
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see
pad layout).
2. 5 watts at T
L
< 25
o
C, or 1.38 watts at T
A
= 25
º
C when mounted on FR4 PC board with recommended
footprint (also see
Figure 1).
T4-LDS-0246-2, Rev. 1 (120180)
©2012 Microsemi Corporation
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