DATASHEET
HI-506, HI-507, HI-508, HI-509
Single 16 and 8/Differential 8-Channel and 4-Channel CMOS Analog Multiplexers
The HI-506/HI-507 and HI-508/HI-509 monolithic CMOS
multiplexers each include an array of sixteen and eight
analog switches respectively, a digital decoder circuit for
channel selection, voltage reference for logic thresholds, and
an enable input for device selection when several
multiplexers are present. The Dielectric Isolation (DI)
process used in fabrication of these devices eliminates the
problem of latchup. DI also offers much lower substrate
leakage and parasitic capacitance than conventional junction
isolated CMOS (see Application Note AN520).
The switching threshold for each digital input is established by
an internal +5V reference, providing a guaranteed minimum
2.4V for logic “1” and maximum 0.8V for logic “0”. This allows
direct interface without pullup resistors to signals from most
logic families: CMOS, TTL, DTL and some PMOS. For
protection against transient overvoltage, the digital inputs
include a series 200 resistor and diode clamp to each
supply.
The HI-506 is a single 16-channel, the HI-507 is an
8-channel differential, the HI-508 is a single 8-channel and
the HI-509 is a 4-channel differential multiplexer.
If input overvoltages are present, the HI-546/HI-547/HI-548/
HI-549 multiplexers are recommended.
FN3142
Rev 10.00
Jun 14, 2016
Features
• Pb-Free Available (RoHS Compliant) (See Ordering Info)
• Low ON Resistance . . . . . . . . . . . . . . . . . . . . . . . . 180
• Wide Analog Signal Range
±15V
• TTL/CMOS Compatible
• Access Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250ns
• Maximum Power Supply . . . . . . . . . . . . . . . . . . . . . . 44V
• Break-Before-Make Switching
• No Latch-Up
• Replaces DG506A/DG506AA and DG507A/DG507AA
• Replaces DG508A/DG508AA and DG509A/DG509AA
Applications
• Data Acquisition Systems
• Precision Instrumentation
• Demultiplexing
• Selector Switch
FN3142 Rev 10.00
Jun 14, 2016
Page 1 of 25
HI-506, HI-507, HI-508, HI-509
Ordering Information
PART NUMBER
HI1-0506-2
HI4P0506-5Z (Note 1)
HI9P0506-9Z (Note 1)
HI3-0507-5Z
(No longer
available, recommended
replacement: HI3-0547-5Z)
HI1-0508-2
HI3-0508-5Z (Note 1)
HI9P0508-5Z (Notes 1, 2)
HI9P0508-9Z (Note 1)
HI1-0509-2
HI4P0509-5Z (Notes 1, 2)
(No
longer available,
recommended replacement:
DG409DYZ)
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte
tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
2. Add “96” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
3. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
PART MARKING
HI1-506-2
HI4P 506-5Z
HI9P506-9Z
HI3-507-5Z
TEMP.
RANGE (°C)
-55 to +125
0 to +75
-40 to +85
0 to +75
PACKAGE
28 Ld CERDIP
28 Ld PLCC (Pb-free)
28 Ld SOIC (Pb-free)
PKG. DWG. #
F28.6
N28.45
M28.3
28 Ld PDIP (Note 3) (Pb-free) E28.6
HI1-508-2
HI3-508-5Z
HI9P508-5Z
HI9P508-9Z
HI1-509-2
HI4P 509-5Z
-55 to 125
0 to +75
0 to +75
-40 to +85
-55 to +125
0 to +75
16 Ld CERDIP
F16.3
16 Ld PDIP (Note 3) (Pb-free) E16.3
16 Ld SOIC (Pb-free)
16 Ld SOIC (Pb-free)
16 Ld CERDIP
20 Ld PLCC (Pb-free)
M16.15
M16.15
F16.3
N20.35
FN3142 Rev 10.00
Jun 14, 2016
Page 2 of 25
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