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MX29GL256FDXFI-11G: 产品描述IC FLASH 256M PARALLEL 64LFBGA; 产品类别存储存储; 文件大小950KB，共72页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx; 标准

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MX29GL256FDXFI-11G概述

IC FLASH 256M PARALLEL 64LFBGA

MX29GL256FDXFI-11G规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Macronix
零件包装代码	BGA
包装说明	LBGA, BGA64,8X8,40
针数	64
Reach Compliance Code	unknown
ECCN代码	3A991.B.1.A
Factory Lead Time	16 weeks
最长访问时间	110 ns
备用内存宽度	8
命令用户界面	YES
通用闪存接口	YES
数据轮询	YES
JESD-30 代码	R-PBGA-B64
长度	13 mm
内存密度	268435456 bit
内存集成电路类型	FLASH
内存宽度	16
功能数量	1
部门数/规模	256
端子数量	64
字数	16777216 words
字数代码	16000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	16MX16
封装主体材料	PLASTIC/EPOXY
封装代码	LBGA
封装等效代码	BGA64,8X8,40
封装形状	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE
页面大小	8/16 words
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3/3.3 V
编程电压	3 V
认证状态	Not Qualified
就绪/忙碌	YES
座面最大高度	1.4 mm
部门规模	128K
最大待机电流	0.00001 A
最大压摆率	0.03 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
切换位	YES
类型	NOR TYPE
宽度	11 mm

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MX29GL256F

DATASHEET

P/N:PM1544

REV. 1.5, OCT. 30, 2013

MX29GL256F

Contents

FEATURES ............................................................................................................................................................. 5

GENERAL FEATURES .................................................................................................................................. 5

PERFORMANCE ........................................................................................................................................... 5

SOFTWARE FEATURES............................................................................................................................... 5

HARDWARE FEATURES .............................................................................................................................. 5

PIN CONFIGURATION ........................................................................................................................................... 6

PIN DESCRIPTION ................................................................................................................................................. 7

BLOCK DIAGRAM.................................................................................................................................................. 8

BLOCK DIAGRAM DESCRIPTION ........................................................................................................................ 9

BLOCK STRUCTURE........................................................................................................................................... 10

Table 1. MX29GL256F SECTOR ARCHITECTURE ................................................................................... 10

BUS OPERATION ................................................................................................................................................. 11

Table 2-1. BUS OPERATION ....................................................................................................................... 11

Table 2-2. BUS OPERATION ....................................................................................................................... 12

FUNCTIONAL OPERATION DESCRIPTION ....................................................................................................... 13

READ OPERATION ..................................................................................................................................... 13

PAGE READ ................................................................................................................................................ 13

WRITE OPERATION ................................................................................................................................... 13

DEVICE RESET .......................................................................................................................................... 13

STANDBY MODE ........................................................................................................................................ 13

OUTPUT DISABLE ...................................................................................................................................... 14

BYTE/WORD SELECTION.......................................................................................................................... 14

HARDWARE WRITE PROTECT ................................................................................................................. 14

ACCELERATED PROGRAMMING OPERATION ....................................................................................... 14

WRITE BUFFER PROGRAMMING OPERATION ....................................................................................... 14

SECTOR PROTECT OPERATION .............................................................................................................. 15

AUTOMATIC SELECT BUS OPERATIONS ................................................................................................ 15

SECTOR LOCK STATUS VERIFICATION .................................................................................................. 15

READ SILICON ID MANUFACTURER CODE ............................................................................................ 16

READ INDICATOR BIT (Q7) FOR SECURITY SECTOR ............................................................................ 16

INHERENT DATA PROTECTION ................................................................................................................ 16

COMMAND COMPLETION ......................................................................................................................... 16

LOW VCC WRITE INHIBIT.......................................................................................................................... 16

WRITE PULSE "GLITCH" PROTECTION ................................................................................................... 16

LOGICAL INHIBIT........................................................................................................................................ 16

POWER-UP SEQUENCE ............................................................................................................................ 17

POWER-UP WRITE INHIBIT ....................................................................................................................... 17

POWER SUPPLY DECOUPLING................................................................................................................ 17

P/N:PM1544

REV. 1.5, OCT. 30, 2013

MX29GL256F

COMMAND OPERATIONS ................................................................................................................................... 18

READING THE MEMORY ARRAY .............................................................................................................. 18

AUTOMATIC PROGRAMMING OF THE MEMORY ARRAY ...................................................................... 18

ERASING THE MEMORY ARRAY............................................................................................................... 19

SECTOR ERASE ......................................................................................................................................... 19

CHIP ERASE .............................................................................................................................................. 20

ERASE SUSPEND/RESUME ...................................................................................................................... 21

SECTOR ERASE RESUME ........................................................................................................................ 21

PROGRAM SUSPEND/RESUME ............................................................................................................... 22

PROGRAM RESUME .................................................................................................................................. 22

BUFFER WRITE ABORT ............................................................................................................................. 22

AUTOMATIC SELECT OPERATIONS ......................................................................................................... 23

AUTOMATIC SELECT COMMAND SEQUENCE ........................................................................................ 23

READ MANUFACTURER ID OR DEVICE ID .............................................................................................. 24

RESET ........................................................................................................................................................ 24

ADVANCED SECTOR PROTECTION/UN-PROTECTION.......................................................................... 25

Figure 1. Advance Sector Protection/Unprotection SPB Program Algorithm ............................................... 25

Figure 2. Lock Register Program Algorithm ................................................................................................. 26

Figure 3. SPB Program Algorithm................................................................................................................ 28

SECURITY SECTOR FLASH MEMORY REGION ...................................................................................... 31

TABLE 3. COMMAND DEFINITIONS .......................................................................................................... 32

COMMON FLASH MEMORY INTERFACE (CFI) MODE ..................................................................................... 35

QUERY COMMAND AND COMMAND FLASH MEMORY INTERFACE (CFI) MODE ................................ 35

Table 4-1. CFI mode: Identification Data Values

(Note 1)

................................................................................ 35

Table 4-2. CFI mode: System Interface Data Values ................................................................................... 35

Table 4-3. CFI mode: Device Geometry Data Values .................................................................................. 36

Table 4-4. CFI mode: Primary Vendor-Specific Extended Query Data Values

............................................ 37

ELECTRICAL CHARACTERISTICS .................................................................................................................... 38

ABSOLUTE MAXIMUM STRESS RATINGS ............................................................................................... 38

OPERATING TEMPERATURE AND VOLTAGE .......................................................................................... 38

Maximum Negative Overshoot Waveform

................................................................................................... 38

Maximum Positive Overshoot Waveform

..................................................................................................... 38

DC CHARACTERISTICS............................................................................................................................. 39

SWITCHING TEST CIRCUITS .................................................................................................................... 40

Test Condition ............................................................................................................................................. 40

SWITCHING TEST WAVEFORMS ............................................................................................................. 40

AC CHARACTERISTICS ............................................................................................................................. 41

WRITE COMMAND OPERATION......................................................................................................................... 43

Figure 4. COMMAND WRITE OPERATION ................................................................................................ 43

READ/RESET OPERATION ................................................................................................................................. 44

Figure 5. READ TIMING WAVEFORMS ...................................................................................................... 44

Figure 6. RESET# TIMING WAVEFORM ................................................................................................... 45

P/N:PM1544

REV. 1.5, OCT. 30, 2013

MX29GL256F

ERASE/PROGRAM OPERATION ........................................................................................................................ 46

Figure 7. AUTOMATIC CHIP ERASE TIMING WAVEFORM ....................................................................... 46

Figure 8. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART ............................................................ 47

Figure 9. AUTOMATIC SECTOR ERASE TIMING WAVEFORM ................................................................ 48

Figure 10. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART .................................................... 49

Figure 11. ERASE SUSPEND/RESUME FLOWCHART ............................................................................. 50

Figure 12. AUTOMATIC PROGRAM TIMING WAVEFORMS...................................................................... 51

Figure 13. ACCELERATED PROGRAM TIMING DIAGRAM....................................................................... 51

Figure 14. CE# CONTROLLED WRITE TIMING WAVEFORM ................................................................... 52

Figure 15. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART .................................................... 53

Figure 16. SILICON ID READ TIMING WAVEFORM .................................................................................. 54

WRITE OPERATION STATUS .............................................................................................................................. 55

Figure 17. DATA# POLLING TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS) .................. 55

Figure 18. STATUS POLLING FOR WORD PROGRAM/ERASE................................................................ 56

Figure 19. STATUS POLLING FOR WRITE BUFFER PROGRAM ............................................................. 57

Figure 20. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)........................ 58

Figure 21. TOGGLE BIT ALGORITHM ........................................................................................................ 59

Figure 22. BYTE# TIMING WAVEFORM FOR READ OPERATIONS (BYTE# switching from byte mode to

word mode) ................................................................................................................................................. 60

Figure 23. PAGE READ TIMING WAVEFORM............................................................................................ 61

Figure 24. DEEP POWER DOWN MODE WAVEFORM ............................................................................ 62

Figure 25. WRITE BUFFER PROGRAM FLOWCHART ............................................................................. 63

RECOMMENDED OPERATING CONDITIONS .................................................................................................... 64

At Device Power-Up .................................................................................................................................... 64

ERASE AND PROGRAMMING PERFORMANCE ............................................................................................... 65

DATA RETENTION ............................................................................................................................................... 65

LATCH-UP CHARACTERISTICS ......................................................................................................................... 65

PIN CAPACITANCE .............................................................................................................................................. 65

ORDERING INFORMATION ................................................................................................................................. 66

PART NAME DESCRIPTION ................................................................................................................................ 67

PACKAGE INFORMATION ................................................................................................................................... 68

REVISION HISTORY ............................................................................................................................................ 71

P/N:PM1544

REV. 1.5, OCT. 30, 2013

MX29GL256FDXFI-11G

MX29GL256FDXFI-11G概述

MX29GL256FDXFI-11G规格参数

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