电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MEC1-140-02-L-D-A-K-TR

产品描述1MM MINI-EDGE CARD ASSEMBLY
产品类别连接器    连接器   
文件大小1016KB,共1页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

MEC1-140-02-L-D-A-K-TR在线购买

供应商 器件名称 价格 最低购买 库存  
MEC1-140-02-L-D-A-K-TR - - 点击查看 点击购买

MEC1-140-02-L-D-A-K-TR概述

1MM MINI-EDGE CARD ASSEMBLY

MEC1-140-02-L-D-A-K-TR规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性POLARIZED
主体宽度0.275 inch
主体深度0.356 inch
主体长度1.754 inch
连接器类型CARD EDGE CONNECTOR
联系完成配合GOLD (10)
联系完成终止Matte Tin (Sn)
触点性别FEMALE
触点材料BERYLLIUM COPPER
触点模式RECTANGULAR
触点样式CENTRONIC
DIN 符合性NO
滤波功能NO
IEC 符合性NO
绝缘体颜色BLACK
绝缘体材料LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码e3
MIL 符合性NO
插接触点节距0.039 inch
混合触点NO
安装选项1LOCKING
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数2
装载的行数2
最高工作温度125 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
PCB触点行间距7.0866 mm
电镀厚度10u inch
额定电流(信号)1.6 A
参考标准UL
可靠性COMMERCIAL
端子节距1 mm
端接类型SURFACE MOUNT
触点总数80
Base Number Matches1

文档预览

下载PDF文档
F-219
MEC1–120–02–F–D–A
MEC1–130–02–F–D–A
MEC1–140–02–L–D
(1.00 mm) .0394"
MEC1 SERIES
MINI EDGE CARD SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Sn or Au over 50 µ"
(1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Current Rating:
2.2 A per pin
(2 adjacent pins powered)
Voltage Rating:
300 VAC
Insertion Depth:
(5.84 mm) .230" to
(8.13 mm) .320"
RoHS Compliant:
Yes
Mates with:
(1.60 mm) .062" card
Mates with
(1.60 mm)
.062" card
APPLICATION
HIGH-SPEED CHANNEL PERFORMANCE
MEC1
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (05-20)
(0.15 mm) .006" max (30-70)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
14
G b p s
Optional
Alignment pin
MEC1
1
POSITIONS
PER ROW
02
PLATING
OPTION
D
NP
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
05, 08, 20, 30, 40, 50, 60, 70
= Gold flash on contact,
Matte tin on tail
–F
–L
ALSO AVAILABLE
(MOQ Required)
• Locking Clip
(Manual placement required)
• Other platings
(6.99)
.275
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
= No
Polarization
(05, 08, 20 &
30 positions
only)
Leave
Blank for
polarization
–NP
= Alignment
Pin metal or
plastic at
Samtec
discretion.
–A
= (7.87 mm)
.310" DIA
Polyimide film
Pick &
Place Pad
–K
(No. of Positions + 2) x
(1.00) .03937 + (2.54) .100
02
140
POSITIONS
PER ROW
05
08
20
30
40
50
60
70
Important Note:
Samtec recommends that
pads on the mating board be
Gold plated.
(0.36)
(1.00)
.014
.03937
(No. of Positions + 2)
x (1.00) .03937
01
139
(1.83)
.072
POLARIZED
POSITIONS
(No Contact)
3, 4
5, 6
15, 16
21, 22
31, 32
41, 42
31, 32, 63 & 64
53, 54, 115 & 116
= Tape & Reel
(05-60 only)
–TR
Notes:
While optimized for
50
W
applications, this
connector with alternative
signal/ground patterns may
also perform well in certain
75
W
applications.
Some sizes, styles and
options are non-standard,
non-returnable.
(8.89)
.350
(9.04)
.356
(0.15)
.006
(8.51)
.335
(0.89)
.035
DIA
(1.40)
.055
–A
OPTION
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 341  696  2772  2310  612  27  2  46  1  48 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved