Low IQ linear battery charge management solution with LDO and ADC 20-DSBGA -40 to 85
具有 LDO 和 ADC 的低 IQ 线性电池充电管理解决方案 20-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Battery charge voltage(Min)(V) | 3.6 |
| Features | Integrated LDO,Power Path,JEITA BAT Temp Monitoring (Thermistor Pin),Temp Monitoring (Thermistor Pin),Integrated ADC,Thermal Regulation |
| Charge current(Max)(A) | 0.5 |
| Rating | Catalog |
| Absolute Vin (safety rating)(Max)((V)) | 20 |
| Package Group | DSBGA|20 |
| Number of series cells | 1 |
| Battery charge voltage(Max)(V) | 4.6 |
| Operating Vin(Min)(V) | 3.4 |
| Control interface | I2C |
| Cell chemistry | Li-Ion/Li-Polymer |
| Operating Vin(Max)(V) | 5.5 |
| Control topology | Linear |
| BQ25150 | BQ25150YFPR | BQ25150YFPT | |
|---|---|---|---|
| 描述 | Low IQ linear battery charge management solution with LDO and ADC 20-DSBGA -40 to 85 | Low IQ linear battery charge management solution with LDO and ADC 20-DSBGA -40 to 85 | I2C controlled 500-mA linear battery charger with Power Path, Low Iq, integrated LDO and 16-bit ADC 20-DSBGA -40 to 85 |
| Brand Name | - | Texas Instruments | Texas Instruments |
| 是否无铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 |
| 包装说明 | - | VFBGA, | VFBGA, |
| Reach Compliance Code | - | compliant | compliant |
| 可调阈值 | - | YES | YES |
| 模拟集成电路 - 其他类型 | - | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | - | R-XBGA-B20 | R-PBGA-B20 |
| JESD-609代码 | - | e1 | e1 |
| 长度 | - | 2.015 mm | 2.015 mm |
| 湿度敏感等级 | - | 1 | 1 |
| 信道数量 | - | 2 | 2 |
| 功能数量 | - | 1 | 1 |
| 端子数量 | - | 20 | 20 |
| 最高工作温度 | - | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C |
| 封装主体材料 | - | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | - | VFBGA | VFBGA |
| 封装形状 | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 座面最大高度 | - | 0.5 mm | 0.5 mm |
| 最大供电电压 (Vsup) | - | 5.25 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 3.15 V | 3.4 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V |
| 表面贴装 | - | YES | YES |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | TIN SILVER COPPER |
| 端子形式 | - | BALL | BALL |
| 端子节距 | - | 0.4 mm | 0.4 mm |
| 端子位置 | - | BOTTOM | BOTTOM |
| 宽度 | - | 1.615 mm | 1.615 mm |
嵌入式系统
嵌入式系统
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