Ultra Low ON-Resistance, Low Voltage,Single Supply, Quad 2:1 Analog Multiplexer; TQFN16, TSSOP16; Temp Range: -40° to 85°C
参数名称 | 属性值 |
Brand Name | Intersil |
是否Rohs认证 | 符合 |
厂商名称 | Renesas(瑞萨电子) |
零件包装代码 | TQFN, TSSOP |
包装说明 | VQCCN, LCC16,.12SQ,20 |
针数 | 16, 16 |
Reach Compliance Code | compliant |
Factory Lead Time | 1 week |
Is Samacsys | N |
模拟集成电路 - 其他类型 | SPDT |
JESD-30 代码 | S-PQCC-N16 |
JESD-609代码 | e3 |
长度 | 3 mm |
湿度敏感等级 | 2 |
信道数量 | 1 |
功能数量 | 4 |
端子数量 | 16 |
标称断态隔离度 | 68 dB |
通态电阻匹配规范 | 0.13 Ω |
最大通态电阻 (Ron) | 0.6 Ω |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VQCCN |
封装等效代码 | LCC16,.12SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 1.8/3 V |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大信号电流 | 0.3 A |
最大供电电流 (Isup) | 0.0015 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 1.6 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
最长断开时间 | 14 ns |
最长接通时间 | 20 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 3 mm |
Base Number Matches | 1 |
ISL84780IRZ-T | ISL84780IR-T | ISL84780IVZ-T | ISL84780IRZ | ISL84780IR | ISL84780IV | |
---|---|---|---|---|---|---|
描述 | Ultra Low ON-Resistance, Low Voltage,Single Supply, Quad 2:1 Analog Multiplexer; TQFN16, TSSOP16; Temp Range: -40° to 85°C | QUAD 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PQCC16, 3 X 3 MM, PLASTIC, MO-220-VEED, QFN-16 | Ultra Low ON-Resistance, Low Voltage,Single Supply, Quad 2:1 Analog Multiplexer; TQFN16, TSSOP16; Temp Range: -40° to 85°C | Ultra Low ON-Resistance, Low Voltage,Single Supply, Quad 2:1 Analog Multiplexer; TQFN16, TSSOP16; Temp Range: -40° to 85°C | QUAD 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PQCC16, 3 X 3 MM, PLASTIC, MO-220-VEED, QFN-16 | QUAD 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO16, PLASTIC, MO-153-AB, TSSOP-16 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 符合 | 不符合 | 不符合 |
厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
零件包装代码 | TQFN, TSSOP | QFN | TQFN, TSSOP | TQFN, TSSOP | QFN | TSSOP |
包装说明 | VQCCN, LCC16,.12SQ,20 | QFN-16 | TSSOP, TSSOP16,.25 | VQCCN, LCC16,.12SQ,20 | QFN-16 | TSSOP-16 |
针数 | 16, 16 | 16 | 16, 16 | 16, 16 | 16 | 16 |
Reach Compliance Code | compliant | not_compliant | compliant | compliant | not_compliant | not_compliant |
模拟集成电路 - 其他类型 | SPDT | SPDT | SPDT | SPDT | SPDT | SPDT |
JESD-30 代码 | S-PQCC-N16 | S-PQCC-N16 | R-PDSO-G16 | S-PQCC-N16 | S-PQCC-N16 | R-PDSO-G16 |
JESD-609代码 | e3 | e0 | e3 | e3 | e0 | e0 |
长度 | 3 mm | 3 mm | 5 mm | 3 mm | 3 mm | 5 mm |
湿度敏感等级 | 2 | 1 | 1 | 2 | 1 | 1 |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
标称断态隔离度 | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB |
通态电阻匹配规范 | 0.13 Ω | 0.13 Ω | 0.13 Ω | 0.13 Ω | 0.13 Ω | 0.13 Ω |
最大通态电阻 (Ron) | 0.6 Ω | 0.6 Ω | 0.6 Ω | 0.6 Ω | 0.6 Ω | 0.6 Ω |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VQCCN | VQCCN | TSSOP | VQCCN | VQCCN | TSSOP |
封装等效代码 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | TSSOP16,.25 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | TSSOP16,.25 |
封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 240 | 260 | 260 | 240 | 240 |
电源 | 1.8/3 V | 1.8/3 V | 1.8/3 V | 1.8/3 V | 1.8/3 V | 1.8/3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1 mm | 1.2 mm | 1 mm | 1 mm | 1.2 mm |
最大信号电流 | 0.3 A | 0.3 A | 0.3 A | 0.3 A | 0.3 A | 0.3 A |
最大供电电流 (Isup) | 0.0015 mA | 0.0015 mA | 0.0015 mA | 0.0015 mA | 0.0015 mA | 0.0015 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
最长断开时间 | 14 ns | 14 ns | 14 ns | 14 ns | 14 ns | 14 ns |
最长接通时间 | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.65 mm |
端子位置 | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL |
处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 40 | 30 | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | 3 mm | 4.4 mm | 3 mm | 3 mm | 4.4 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
Is Samacsys | N | - | - | N | N | N |
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