PLL Frequency Synthesizer, BICMOS, PDSO20, PLASTIC, TSSOP-20
参数名称 | 属性值 |
是否无铅 | 含铅 |
厂商名称 | Rochester Electronics |
零件包装代码 | TSSOP |
包装说明 | TSSOP, |
针数 | 20 |
Reach Compliance Code | unknown |
Is Samacsys | N |
模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e0 |
长度 | 6.5 mm |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4.4 mm |
Base Number Matches | 1 |
LMX2371TM | LMX2371SLBX | LMX2372SLBX | LMX2372TM | |
---|---|---|---|---|
描述 | PLL Frequency Synthesizer, BICMOS, PDSO20, PLASTIC, TSSOP-20 | PLL Frequency Synthesizer, BICMOS, CQCC24, 3.50 X 4.50 MM, 1 MM HEIGHT, CSP-24 | PLL Frequency Synthesizer, BICMOS, CQCC24, 3.50 X 4.50 MM, 1 MM HEIGHT, CSP-24 | PLL Frequency Synthesizer, BICMOS, PDSO20, PLASTIC, TSSOP-20 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | TSSOP | QFN | QFN | TSSOP |
包装说明 | TSSOP, | TQCCN, | TQCCN, | TSSOP, |
针数 | 20 | 24 | 24 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Is Samacsys | N | N | N | N |
模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER |
JESD-30 代码 | R-PDSO-G20 | R-CQCC-N24 | R-CQCC-N24 | R-PDSO-G20 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 6.5 mm | 4.5 mm | 4.5 mm | 6.5 mm |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 24 | 24 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
封装代码 | TSSOP | TQCCN | TQCCN | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, THIN PROFILE | CHIP CARRIER, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | NO LEAD | NO LEAD | GULL WING |
端子节距 | 0.65 mm | 0.5 mm | 0.5 mm | 0.65 mm |
端子位置 | DUAL | QUAD | QUAD | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4.4 mm | 3.5 mm | 3.5 mm | 4.4 mm |
Base Number Matches | 1 | 1 | 1 | 1 |
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