PLL Frequency Synthesizer, BICMOS, CQCC24, 3.50 X 4.50 MM, 1 MM HEIGHT, CSP-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | QFN |
| 包装说明 | TQCCN, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER |
| JESD-30 代码 | R-CQCC-N24 |
| JESD-609代码 | e0 |
| 长度 | 4.5 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | TQCCN |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.5 mm |
| Base Number Matches | 1 |
| LMX2371SLBX | LMX2371TM | LMX2372SLBX | LMX2372TM | |
|---|---|---|---|---|
| 描述 | PLL Frequency Synthesizer, BICMOS, CQCC24, 3.50 X 4.50 MM, 1 MM HEIGHT, CSP-24 | PLL Frequency Synthesizer, BICMOS, PDSO20, PLASTIC, TSSOP-20 | PLL Frequency Synthesizer, BICMOS, CQCC24, 3.50 X 4.50 MM, 1 MM HEIGHT, CSP-24 | PLL Frequency Synthesizer, BICMOS, PDSO20, PLASTIC, TSSOP-20 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | QFN | TSSOP | QFN | TSSOP |
| 包装说明 | TQCCN, | TSSOP, | TQCCN, | TSSOP, |
| 针数 | 24 | 20 | 24 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Is Samacsys | N | N | N | N |
| 模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER |
| JESD-30 代码 | R-CQCC-N24 | R-PDSO-G20 | R-CQCC-N24 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 4.5 mm | 6.5 mm | 4.5 mm | 6.5 mm |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 20 | 24 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | TQCCN | TSSOP | TQCCN | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm | 0.5 mm | 0.65 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.5 mm | 4.4 mm | 3.5 mm | 4.4 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
