IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, MS-012AA, SOIC-8, MOSFET Driver
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | SOP, SOP8,.25 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 高边驱动器 | YES |
| 接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 标称输出峰值电流 | 3 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 | 14 V |
| 最小供电电压 | 9 V |
| 标称供电电压 | 12 V |
| 表面贴装 | YES |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 断开时间 | 45 µs |
| 接通时间 | 45 µs |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| LM5100AMX/NOPB | LM5100AM/NOPB | LM5100AMR | LM5100AMRX | LM5100ASD/NOPB | LM5100ASDX/NOPB | LM5100ASDX | LM5100ASD | LM5100AMX | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, MS-012AA, SOIC-8, MOSFET Driver | IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, MS-012AA, SOIC-8, MOSFET Driver | IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, PLASTIC, SOP-8, MOSFET Driver | IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, PLASTIC, SOP-8, MOSFET Driver | IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, 4 X 4 MM, LLP-10, MOSFET Driver | IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, 4 X 4 MM, LLP-10, MOSFET Driver | IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO10, 4 X 4 MM, LLP-10, MOSFET Driver | IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO10, 4 X 4 MM, LLP-10, MOSFET Driver | IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, MS-012AA, SOIC-8, MOSFET Driver |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | SOP, SOP8,.25 | SOP, SOP8,.25 | PLASTIC, SOP-8 | PLASTIC, SOP-8 | HVSON, SOLCC10,.16,32 | HVSON, SOLCC10,.16,32 | 4 X 4 MM, LLP-10 | 4 X 4 MM, LLP-10 | MS-012AA, SOIC-8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 高边驱动器 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-N10 | S-PDSO-N10 | R-PDSO-G8 |
| 长度 | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4 mm | 4 mm | 4 mm | 4 mm | 4.9 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 10 | 10 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出峰值电流 | 3 A | 3 A | 3 A | 3 A | 3 A | 3 A | 3 A | 3 A | 3 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | HLSOP | HLSOP | HVSON | HVSON | HVSON | HVSON | SOP |
| 封装等效代码 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOLCC10,.16,32 | SOLCC10,.16,32 | SOLCC10,.16,32 | SOLCC10,.16,32 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE |
| 电源 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.68 mm | 1.68 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.75 mm |
| 最大供电电压 | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V |
| 最小供电电压 | 9 V | 9 V | 9 V | 9 V | 9 V | 9 V | 9 V | 9 V | 9 V |
| 标称供电电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 断开时间 | 45 µs | 45 µs | 0.045 µs | 0.045 µs | 45 µs | 45 µs | 0.045 µs | 0.045 µs | 0.045 µs |
| 接通时间 | 45 µs | 45 µs | 0.045 µs | 0.045 µs | 45 µs | 45 µs | 0.045 µs | 0.045 µs | 0.045 µs |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 4 mm | 4 mm | 4 mm | 4 mm | 3.9 mm |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Is Samacsys | N | N | N | N | N | N | - | - | - |
| JESD-609代码 | e3 | e3 | - | - | e3 | e3 | e0 | e0 | e0 |
| 湿度敏感等级 | 1 | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
| 峰值回流温度（摄氏度） | 260 | 260 | - | - | 260 | 260 | 260 | 260 | 235 |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) |
| 处于峰值回流温度下的最长时间 | 40 | 40 | - | - | 40 | 40 | 40 | 40 | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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