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LM5100AMR

产品描述IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, PLASTIC, SOP-8, MOSFET Driver
产品类别驱动程序和接口   
文件大小349KB,共16页
制造商National Semiconductor(TI )
官网地址http://www.ti.com
敬请期待 详细参数 选型对比

LM5100AMR概述

IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, PLASTIC, SOP-8, MOSFET Driver

LM5100AMR规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称National Semiconductor(TI )
包装说明PLASTIC, SOP-8
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
高边驱动器YES
接口集成电路类型HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码R-PDSO-G8
长度4.9 mm
功能数量1
端子数量8
最高工作温度125 °C
最低工作温度-40 °C
标称输出峰值电流3 A
封装主体材料PLASTIC/EPOXY
封装代码HLSOP
封装等效代码SOP8,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
电源12 V
认证状态Not Qualified
座面最大高度1.68 mm
最大供电电压14 V
最小供电电压9 V
标称供电电压12 V
表面贴装YES
温度等级AUTOMOTIVE
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
断开时间0.045 µs
接通时间0.045 µs
宽度3.9 mm
Base Number Matches1

LM5100AMR相似产品对比

LM5100AMR LM5100AM/NOPB LM5100AMRX LM5100AMX/NOPB LM5100ASD/NOPB LM5100ASDX/NOPB LM5100ASDX LM5100ASD LM5100AMX
描述 IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, PLASTIC, SOP-8, MOSFET Driver IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, MS-012AA, SOIC-8, MOSFET Driver IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, PLASTIC, SOP-8, MOSFET Driver IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, MS-012AA, SOIC-8, MOSFET Driver IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, 4 X 4 MM, LLP-10, MOSFET Driver IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, 4 X 4 MM, LLP-10, MOSFET Driver IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO10, 4 X 4 MM, LLP-10, MOSFET Driver IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO10, 4 X 4 MM, LLP-10, MOSFET Driver IC 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, MS-012AA, SOIC-8, MOSFET Driver
是否Rohs认证 不符合 符合 不符合 符合 符合 符合 不符合 不符合 不符合
包装说明 PLASTIC, SOP-8 SOP, SOP8,.25 PLASTIC, SOP-8 SOP, SOP8,.25 HVSON, SOLCC10,.16,32 HVSON, SOLCC10,.16,32 4 X 4 MM, LLP-10 4 X 4 MM, LLP-10 MS-012AA, SOIC-8
Reach Compliance Code compliant compliant compliant compliant compliant compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
高边驱动器 YES YES YES YES YES YES YES YES YES
接口集成电路类型 HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 S-PDSO-N8 S-PDSO-N8 S-PDSO-N10 S-PDSO-N10 R-PDSO-G8
长度 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4 mm 4 mm 4 mm 4 mm 4.9 mm
功能数量 1 1 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 10 10 8
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
标称输出峰值电流 3 A 3 A 3 A 3 A 3 A 3 A 3 A 3 A 3 A
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HLSOP SOP HLSOP SOP HVSON HVSON HVSON HVSON SOP
封装等效代码 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25 SOLCC10,.16,32 SOLCC10,.16,32 SOLCC10,.16,32 SOLCC10,.16,32 SOP8,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE SQUARE RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
电源 12 V 12 V 12 V 12 V 12 V 12 V 12 V 12 V 12 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.68 mm 1.75 mm 1.68 mm 1.75 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 1.75 mm
最大供电电压 14 V 14 V 14 V 14 V 14 V 14 V 14 V 14 V 14 V
最小供电电压 9 V 9 V 9 V 9 V 9 V 9 V 9 V 9 V 9 V
标称供电电压 12 V 12 V 12 V 12 V 12 V 12 V 12 V 12 V 12 V
表面贴装 YES YES YES YES YES YES YES YES YES
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING GULL WING GULL WING NO LEAD NO LEAD NO LEAD NO LEAD GULL WING
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
断开时间 0.045 µs 45 µs 0.045 µs 45 µs 45 µs 45 µs 0.045 µs 0.045 µs 0.045 µs
接通时间 0.045 µs 45 µs 0.045 µs 45 µs 45 µs 45 µs 0.045 µs 0.045 µs 0.045 µs
宽度 3.9 mm 3.9 mm 3.9 mm 3.9 mm 4 mm 4 mm 4 mm 4 mm 3.9 mm
厂商名称 National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) - National Semiconductor(TI ) National Semiconductor(TI )
Is Samacsys N N N N N N - - -
Base Number Matches 1 1 1 1 1 1 1 - -
JESD-609代码 - e3 - e3 e3 e3 e0 e0 e0
湿度敏感等级 - 1 - 1 1 1 1 1 1
峰值回流温度(摄氏度) - 260 - 260 260 260 260 260 235
端子面层 - Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15)
处于峰值回流温度下的最长时间 - 40 - 40 40 40 40 40 NOT SPECIFIED

 
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