Not Recommended for New Designs
Please use ATA663211 or MCP2003B
MCP2003/4/3A/4A
LIN J2602 Transceiver
Features
• The MCP2003/2003A and MCP2004/2004A are
Compliant with Local Interconnect Network (LIN)
Bus Specifications 1.3, 2.0 and 2.1, and are
Compliant to SAE J2602
• Supports Baud Rates up to 20 Kbaudwith
LIN Bus Compatible Output Driver
• 43V Load Dump Protected
• Very Low/High Electromagnetic Immunity (EMI)
meets Stringent Original Equipment
Manufacturers (OEM) Requirements
• Very High Electrostatic Discharge (ESD)
Immunity:
- >20 kV on V
BB
(IEC 61000-4-2)
- >14 kV on L
BUS
(IEC 61000-4-2)
• Very High Immunity to RF Disturbances meets
Stringent OEM Requirements
• Wide Supply Voltage, 6.0V-27.0V Continuous
• Extended Temperature Range: -40°C to +125°C
• Interface to PIC
®
MCU EUSART and Standard
USARTs
• LIN Bus Pin:
- Internal pull-up resistor and diode
- Protected against battery shorts
- Protected against loss of ground
- High-current drive
• Automatic Thermal Shutdown
• Low-Power mode:
- Receiver monitoring bus and transmitter off
(
5 µA)
Description
This device provides a bidirectional, half-duplex commu-
nication, physical interface to automotive and industrial
LIN systems to meet the LIN Bus Specification
Revision 2.1 and SAE J2602. The device is short-circuit
and overtemperature protected by internal circuitry. The
device has been specifically designed to operate in the
automotive operating environment and will survive all
specified transient conditions, while meeting all of the
stringent quiescent current requirements.
MCP200X family members:
• 8-pin PDIP, DFN and SOIC packages:
- MCP2003: LIN bus compatible driver with
WAKE pins, wake-up on falling edge of L
BUS
- MCP2003A: LIN bus compatible driver with
WAKE pins, wake-up on rising edge of L
BUS
- MCP2004: LIN bus compatible driver with
FAULT/T
XE
pins, wake-up on falling edge of
L
BUS
- MCP2004A: LIN bus compatible driver with
FAULT/T
XE
pins, wake-up on rising edge of
L
BUS
Package Types
MCP2003/2003A
PDIP, SOIC
R
XD
1
CS 2
WAKE 3
T
XD
4
8 V
REN
7 V
BB
5 V
SS
MCP2004/2004A
PDIP, SOIC
R
XD
1
CS/WAKE 2
T
XD
4
8 V
REN
7 V
BB
6 L
BUS
5 V
SS
6 L
BUS
FAULT/T
XE
3
MCP2003/2003A
4x4 DFN*
R
XD
1
CS 2
WAKE 3
T
XD
4
EP
9
8 V
REN
7 V
BB
6 L
BUS
5 V
SS
MCP2004/2004A
4x4 DFN*
R
XD
1
CS/WAKE 2
FAULT/T
XE
3
T
XD
4
EP
9
8 V
REN
7 V
BB
6 L
BUS
5 V
SS
* Includes Exposed Thermal Pad (EP); see
Table 1-2.
2010-2016 Microchip Technology Inc.
DS20002230G-page 1
MCP2003/4/3A/4A
MCP2003/2003A Block Diagram
V
REN
Ratiometric
Reference
WAKE
–
+
~30 k
V
BB
4.3V
Wake-up
Logic and
Power Control
R
XD
CS
T
XD
OC
L
BUS
V
SS
Thermal
Protection
Short-Circuit
Protection
MCP2004/2004A Block Diagram
V
REN
4.3V
4.3V
Ratiometric
Reference
V
BB
Wake-up
Logic and
Power Control
R
XD
CS/WAKE
T
XD
FAULT/T
XE
Thermal
Protection
OC
–
+
~30 k
L
BUS
V
SS
Short-Circuit
Protection
DS20002230G-page 2
2010-2016 Microchip Technology Inc.
MCP2003/4/3A/4A
1.0
DEVICE OVERVIEW
1.2.2
GROUND LOSS PROTECTION
The MCP2003/4/3A/4A devices provide a physical
interface between a microcontroller and a LIN bus.
These devices will translate the CMOS/TTL logic levels
to the LIN logic level and vice versa. It is intended for
automotive and industrial applications with serial bus
speeds up to 20 Kbaud.
LIN Bus Specification Revision 2.1 requires that the
transceiver of all nodes in the system is connected via
the LIN pin, referenced to ground, and with a maximum
external termination resistance load of 510 from LIN
bus to battery supply. The 510 corresponds to
1 master and 15 slave nodes.
The V
REN
pin can be used to drive the logic input of an
external voltage regulator. This pin is high in all modes
except for Power-Down mode.
The LIN Bus Specification states that the LIN pin must
transition to the Recessive state when the ground is
disconnected. Therefore, a loss of ground effectively
forces the LIN line to a high-impedance level.
1.2.3
THERMAL PROTECTION
The thermal protection circuit monitors the die
temperature and is able to shut down the LIN
transmitter.
There are two causes for a thermal overload. A thermal
shutdown can be triggered by either, or both, of the
following thermal overload conditions:
• LIN bus output overload
• Increase in die temperature due to increase in
environment temperature
Driving the T
XD
pin and checking the R
XD
pin makes it
possible to determine whether there is a bus contention
(R
XD
= low, T
XD
= high) or a thermal overload condition
(R
XD
= high, T
XD
= low). After a thermal overload event,
the device will automatically recover once the die
temperature has fallen below the recovery temperature
threshold (see
Figure 1-1).
1.1
1.1.1
External Protection
REVERSE BATTERY PROTECTION
An external reverse battery blocking diode should be
used to provide polarity protection (see
Example 1-1).
1.1.2
TRANSIENT VOLTAGE
PROTECTION (LOAD DUMP)
FIGURE 1-1:
An external 43V Transient Suppressor (TVS) diode,
between V
BB
and ground with a 50 Transient
Protection Resistor (R
TP
) in series with the battery
supply and the V
BB
pin, serve to protect the device from
power transients (see
Example 1-1)
and ESD events.
While this protection is optional, it is considered good
engineering practice.
THERMAL SHUTDOWN
STATE DIAGRAM
Shorted LIN Bus
to V
BB
Operation
Mode
Transmitter
Shutdown
1.2
1.2.1
Internal Protection
ESD PROTECTION
Temp < Shutdown
TEMP
For component-level ESD ratings, please refer to the
maximum operation specifications.
2010-2016 Microchip Technology Inc.
DS20002230G-page 3
MCP2003/4/3A/4A
1.3
Modes of Operation
For an overview of all operational modes, refer to
Table 1-1.
Upon V
BB
supply pin power-on, the device will remain
in Ready mode as long as CS is low. When CS
transitions high, the device will either enter Operation
mode, if the T
XD
pin is held high, or the device will enter
Transmitter Off mode, if the T
XD
pin is held low.
1.3.1
POWER-DOWN MODE
In Power-Down mode, everything is off except the
wake-up section. This is the lowest power mode. The
receiver is off, thus its output is open-drain.
On CS going to a high level or a falling edge on WAKE
(MCP2003/MCP2003A only), the device will enter
Ready mode as soon as the internal voltage stabilizes.
Refer to
Section 2.4 “AC Specifications”
for further
information. In addition, LIN bus activity will change the
device from Power-Down mode to Ready mode;
MCP2003/4 wakes up on a falling edge on
L
BUS
,
followed by a low level lasting at least 20 µs.
MCP2003A/4A wakes up on a rising edge on
L
BUS
,
followed by a high level lasting 70 µs, typically.
See
Figures 1-2
to
1-5
about remote wake-up. If CS is held
high as the device transitions from Power-Down to
Ready mode, the device will transition to either Opera-
tion or Transmitter Off mode, depending on the T
XD
input, as soon as internal voltages stabilize.
1.3.3
OPERATION MODE
In this mode, all internal modules are operational.
The device will go into Power-Down mode on the falling
edge of CS. For the MCP2003/4 device, a specific
process should be followed to put all nodes into Power-
Down mode. Refer to
Section 1.6 “MCP2003/4 and
MCP2003A/4A Difference Details”
and
Figure 1-6.
The device will enter Transmitter Off mode in the event
of a Fault condition, such as thermal overload, bus
contention and T
XD
timer expiration.
The MCP2004/2004A device can also enter Transmitter
Off mode if the FAULT/T
XE
pin is pulled low. The V
BB
to
L
BUS
pull-up resistor is connected only in Operation
mode.
1.3.4
TRANSMITTER OFF MODE
1.3.2
READY MODE
Upon entering Ready mode, V
REN
is enabled and the
receiver detect circuit is powered up. The transmitter
remains disabled and the device is ready to receive
data but not to transmit.
Transmitter Off mode is reached whenever the
transmitter is disabled, either due to a Fault condition or
pulling the FAULT/T
XE
pin low on the MCP2004/2004A.
The Fault conditions include: thermal overload, bus
contention, R
XD
monitoring or T
XD
timer expiration.
The device will go into Power-Down mode on the falling
edge of CS or return to Operation mode if all Faults are
resolved and the FAULT/T
XE
pin on the MCP2004/2004A
is high.
FIGURE 1-2:
OPERATIONAL MODES STATE DIAGRAM – MCP2003
POR
V
REN
OFF
RX OFF
TX OFF
V
BAT
> 5.5V
Ready
V
REN
ON
RX ON
TX OFF
CS =
1
and T
XD
=
1
CS =
1
and T
XD
=
0
Falling Edge on LIN
or CS =
1
or Falling Edge on WAKE Pin
T
OFF
Mode
V
REN
ON
RX ON
TX OFF
CS =
1
and T
XD
=
1
and No Fault
Fault (thermal or timer)
Operation
Mode
V
REN
ON
RX ON
TX ON
CS =
0
CS =
0
POWER-
DOWN
V
REN
OFF
RX OFF
TX OFF
DS20002230G-page 4
2010-2016 Microchip Technology Inc.
MCP2003/4/3A/4A
FIGURE 1-3:
OPERATIONAL MODES STATE DIAGRAM – MCP2003A
POR
V
REN
OFF
RX OFF
TX OFF
V
BAT
> 5.5V
Ready
V
REN
ON
RX OFF
TX OFF
CS =
1
and T
XD
=
1
CS =
1
and T
XD
=
0
Rising Edge on LIN
or CS =
1
or Falling Edge on WAKE Pin
T
OFF
Mode
V
REN
ON
RX ON
TX OFF
CS =
1
and T
XD
=
1
and No Fault
Fault (thermal or timer)
Operation
Mode
V
REN
ON
RX ON
TX ON
CS =
0
CS =
0
POWER-
DOWN
V
REN
OFF
RX OFF
TX OFF
FIGURE 1-4:
OPERATIONAL MODES STATE DIAGRAM – MCP2004
POR
V
REN
OFF
RX OFF
TX OFF
V
BAT
> 5.5V
Ready
V
REN
ON
RX ON
TX OFF
CS =
1
and T
XD
=
1
and T
XE
=
1
CS =
1
and (T
XE
=
0
or T
XD
=
0)
CS =
1
and T
XD
=
1
and T
XE
=
1
and No Fault
Fault (thermal or time-out) or
FAULT/T
XE
=
0
Falling Edge on LIN or
CS =
1
T
OFF
Mode
V
REN
ON
RX ON
TX OFF
Operation
Mode
V
REN
ON
RX ON
TX ON
CS =
0
CS =
0
POWER-
DOWN
V
REN
OFF
RX OFF
TX OFF
2010-2016 Microchip Technology Inc.
DS20002230G-page 5
ARM技术
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
