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74ACT251FCQR

产品描述IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer
产品类别逻辑   
文件大小163KB,共8页
制造商National Semiconductor(TI )
官网地址http://www.ti.com
敬请期待 详细参数 选型对比

74ACT251FCQR概述

IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer

74ACT251FCQR规格参数

参数名称属性值
厂商名称National Semiconductor(TI )
包装说明CERAMIC, FP-16
Reach Compliance Codeunknown
系列ACT
JESD-30 代码R-GDFP-F16
长度9.6645 mm
负载电容(CL)50 pF
逻辑集成电路类型MULTIPLEXER
功能数量1
输入次数8
输出次数1
端子数量16
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性COMPLEMENTARY
封装主体材料CERAMIC, GLASS-SEALED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
传播延迟(tpd)18.5 ns
认证状态Not Qualified
座面最大高度2.032 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
宽度6.604 mm
Base Number Matches1

74ACT251FCQR相似产品对比

74ACT251FCQR 54ACT251DMQB 74ACT251LCQR 54ACT251LMQB 74AC251PCQR 74AC251SCQR 74ACT251PCQR 54ACT251FMQB 74ACT251SCQR
描述 IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDIP16, CERAMIC, DIP-16, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer IC AC SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16, Multiplexer/Demultiplexer IC AC SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16, SOIC-16, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16, SOIC-16, Multiplexer/Demultiplexer
包装说明 CERAMIC, FP-16 DIP, DIP16,.3 CERAMIC, LCC-20 CERAMIC, LCC-20 PLASTIC, DIP-16 SOP, SOP16,.25 DIP, DIP16,.3 CERAMIC, FP-16 SOIC-16
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
系列 ACT ACT ACT ACT AC AC ACT ACT ACT
JESD-30 代码 R-GDFP-F16 R-GDIP-T16 S-CQCC-N20 S-CQCC-N20 R-PDIP-T16 R-PDSO-G16 R-PDIP-T16 R-GDFP-F16 R-PDSO-G16
长度 9.6645 mm 19.43 mm 8.89 mm 8.89 mm 19.305 mm 9.9 mm 19.305 mm 9.6645 mm 9.9 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER
功能数量 1 1 1 1 1 1 1 1 1
输入次数 8 8 8 8 8 8 8 8 8
输出次数 1 1 1 1 1 1 1 1 1
端子数量 16 16 20 20 16 16 16 16 16
最高工作温度 85 °C 125 °C 85 °C 125 °C 85 °C 85 °C 85 °C 125 °C 85 °C
最低工作温度 -40 °C -55 °C -40 °C -55 °C -40 °C -40 °C -40 °C -55 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY
封装代码 DFP DIP QCCN QCCN DIP SOP DIP DFP SOP
封装形状 RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE SMALL OUTLINE IN-LINE FLATPACK SMALL OUTLINE
传播延迟(tpd) 18.5 ns 19.5 ns 18.5 ns 19.5 ns 19 ns 19 ns 18.5 ns 19.5 ns 18.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.032 mm 5.08 mm 1.905 mm 1.905 mm 5.08 mm 1.75 mm 5.08 mm 2.032 mm 1.75 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 6 V 6 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 2 V 2 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 3.3 V 3.3 V 5 V 5 V 5 V
表面贴装 YES NO YES YES NO YES NO YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL MILITARY INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY INDUSTRIAL
端子形式 FLAT THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE GULL WING THROUGH-HOLE FLAT GULL WING
端子节距 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL QUAD QUAD DUAL DUAL DUAL DUAL DUAL
宽度 6.604 mm 7.62 mm 8.89 mm 8.89 mm 7.62 mm 3.9 mm 7.62 mm 6.604 mm 3.9 mm
Base Number Matches 1 1 1 1 1 1 1 1 1
厂商名称 National Semiconductor(TI ) - National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
是否Rohs认证 - 不符合 - 不符合 不符合 不符合 不符合 不符合 不符合
JESD-609代码 - e0 - e0 e0 e0 e0 e0 e0
最大I(ol) - 0.024 A - 0.024 A 0.012 A 0.012 A 0.024 A 0.024 A 0.024 A
封装等效代码 - DIP16,.3 - LCC20,.35SQ DIP16,.3 SOP16,.25 DIP16,.3 FL16,.3 SOP16,.25
峰值回流温度(摄氏度) - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 - 5 V - 5 V 3.3/5 V 3.3/5 V 5 V 5 V 5 V
Prop。Delay @ Nom-Sup - 15 ns - 15 ns 15.5 ns 15.5 ns 14 ns 15 ns 14 ns
端子面层 - Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间 - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

 
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