† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
recommended operating conditions
SN54F11
MIN
VCC
VIH
VIL
IIK
IOH
IOL
TA
Supply voltage
High-level input voltage
Low-level input voltage
Input clamp current
High-level output current
Low-level output current
Operating free-air temperature
−55
4.5
2
0.8
−18
−1
20
125
0
NOM
5
MAX
5.5
MIN
4.5
2
0.8
−18
−1
20
70
SN74F11
NOM
5
MAX
5.5
UNIT
V
V
V
mA
mA
mA
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
VOL
II
IIH
IIL
IOS§
ICCH
VCC = 4.5 V,
VCC = 4.5 V,
VCC = 4.75 V,
VCC = 4.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
TEST CONDITIONS
II = − 18 mA
IOH = − 1 mA
IOH = − 1 mA
IOL = 20 mA
VI = 7 V
VI = 2.7 V
VI = 0.5 V
VO = 0
VI = 4.5 V
VI = 0
−60
4.1
SN54F11
MIN TYP‡
MAX
−1.2
2.5
3.4
0.3
0.5
0.1
20
− 0.6
−150
6.2
−60
4.1
2.5
2.7
0.3
0.5
0.1
20
− 0.6
−150
6.2
9.7
3.4
V
V
mA
µA
mA
mA
mA
mA
SN74F11
MIN TYP‡
MAX
−1.2
UNIT
V
ICCL
6.5
9.7
6.5
‡ All typical values are at VCC = 5 V, TA = 25°C.
§ Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
2−2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
SN54F11, SN74F11
TRIPLE 3 INPUT POSITIVE AND GATES
SDFS040A − MARCH 1987 − REVISED OCTOBER 1993
switching characteristics
VCC = 5 V,
CL = 50 pF,
RL = 500
Ω,
TA = 25°C
′F11
MIN
tPLH
tPHL
A, B, or C
Y
2.2
1.7
TYP
3.8
3.7
MAX
5.6
5.5
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500
Ω,
TA = MIN to MAX†
SN54F11
MIN
1.7
1.2
MAX
7.5
7.5
SN74F11
MIN
2.2
1.7
MAX
6.6
6.5
ns
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
UNIT
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
2−3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
5962-9758101Q2A
Status
(1)
Package Type Package Pins Package
Drawing
Qty
LCCC
FK
20
1
Eco Plan
(2)
Lead/Ball Finish
POST-PLATE
MSL Peak Temp
(3)
Op Temp (°C)
-55 to 125
Device Marking
(4/5)
Samples
ACTIVE
TBD
N / A for Pkg Type
5962-
9758101Q2A
SNJ54F
11FK
5962-9758101QC
A
SNJ54F11J
5962-9758101QD
A
SNJ54F11W
JM38510/
34002B2A
JM38510/
34002BCA
JM38510/
34002BDA
JM38510/
34002B2A
JM38510/
34002BCA
JM38510/
34002BDA
SN54F11J
F11
F11
F11
F11
F11
5962-9758101QCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9758101QDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/34002B2A
JM38510/34002BCA
JM38510/34002BDA
M38510/34002B2A
M38510/34002BCA
M38510/34002BDA
SN54F11J
SN74F11D
SN74F11DE4
SN74F11DG4
SN74F11DR
SN74F11DRE4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
LCCC
CDIP
CFP
CDIP
SOIC
SOIC
SOIC
SOIC
SOIC
FK
J
W
FK
J
W
J
D
D
D
D
D
20
14
14
20
14
14
14
14
14
14
14
14
1
1
1
1
1
1
1
50
50
50
2500
2500
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
POST-PLATE
A42
A42
POST-PLATE
A42
A42
A42
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
SN74F11DRG4
SN74F11N
SN74F11N3
SN74F11NE4
SN74F11NSR
SN74F11NSRE4
SN74F11NSRG4
SNJ54F11FK
Status
(1)
Package Type Package Pins Package
Drawing
Qty
SOIC
PDIP
PDIP
PDIP
SO
SO
SO
LCCC
D
N
N
N
NS
NS
NS
FK
14
14
14
14
14
14
14
20
25
2000
2000
2000
1
2500
25
Eco Plan
(2)
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
MSL Peak Temp
(3)
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
-55 to 125
F11
Device Marking
(4/5)
Samples
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
Pb-Free
(RoHS)
TBD
Pb-Free
(RoHS)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Level-1-260C-UNLIM
N / A for Pkg Type
Call TI
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
SN74F11N
SN74F11N
74F11
74F11
74F11
5962-
9758101Q2A
SNJ54F
11FK
5962-9758101QC
A
SNJ54F11J
5962-9758101QD
A
SNJ54F11W
SNJ54F11J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54F11W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
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