74ACQ574LCX概述

AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20

74ACQ574LCX规格参数

参数名称	属性值
厂商名称	Texas Instruments(德州仪器)
零件包装代码	QLCC
包装说明	QCCN,
针数	20
Reach Compliance Code	unknown
系列	AC
JESD-30 代码	S-CQCC-N20
长度	8.89 mm
逻辑集成电路类型	BUS DRIVER
位数	8
功能数量	1
端口数量	2
端子数量	20
最高工作温度	85 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN
封装形状	SQUARE
封装形式	CHIP CARRIER
传播延迟（tpd）	13.5 ns
认证状态	Not Qualified
座面最大高度	1.905 mm
最大供电电压 (Vsup)	6 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	NO LEAD
端子节距	1.27 mm
端子位置	QUAD
宽度	8.89 mm
Base Number Matches	1

74ACQ574LCX相似产品对比

	74ACQ574LCX	54ACTQ574FMX	54ACTQ574LMX	74ACTQ574LCX	74ACTQ574DCQR	74ACQ574FCX	74ACTQ574FCX	74ACQ574DCQR
描述	AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20	ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20	ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20	ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20	ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20	AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20	ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20	AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20
包装说明	QCCN,	DFP,	QCCN,	QCCN,	DIP,	DFP,	DFP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
系列	AC	ACT	ACT	ACT	ACT	AC	ACT	AC
JESD-30 代码	S-CQCC-N20	R-GDFP-F20	S-CQCC-N20	S-CQCC-N20	R-GDIP-T20	R-GDFP-F20	R-GDFP-F20	R-GDIP-T20
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
位数	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
端口数量	2	2	2	2	2	2	2	2
端子数量	20	20	20	20	20	20	20	20
最高工作温度	85 °C	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
封装代码	QCCN	DFP	QCCN	QCCN	DIP	DFP	DFP	DIP
封装形状	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER	FLATPACK	CHIP CARRIER	CHIP CARRIER	IN-LINE	FLATPACK	FLATPACK	IN-LINE
传播延迟（tpd）	13.5 ns	11 ns	11 ns	9.5 ns	9.5 ns	13.5 ns	9.5 ns	13.5 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.905 mm	2.286 mm	1.905 mm	1.905 mm	5.08 mm	2.286 mm	2.286 mm	5.08 mm
最大供电电压 (Vsup)	6 V	5.5 V	5.5 V	5.5 V	5.5 V	6 V	5.5 V	6 V
最小供电电压 (Vsup)	2 V	4.5 V	4.5 V	4.5 V	4.5 V	2 V	4.5 V	2 V
标称供电电压 (Vsup)	3.3 V	5 V	5 V	5 V	5 V	3.3 V	5 V	3.3 V
表面贴装	YES	YES	YES	YES	NO	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	NO LEAD	FLAT	NO LEAD	NO LEAD	THROUGH-HOLE	FLAT	FLAT	THROUGH-HOLE
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
端子位置	QUAD	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL	DUAL
宽度	8.89 mm	6.731 mm	8.89 mm	8.89 mm	7.62 mm	6.731 mm	6.731 mm	7.62 mm
Base Number Matches	1	1	1	1	1	1	1	1
厂商名称	Texas Instruments(德州仪器)	-	-	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
长度	8.89 mm	-	8.89 mm	8.89 mm	24.51 mm	-	-	24.51 mm

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