Inverter, CMOS, PDIP14,
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Fairchild |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | compliant |
JESD-30 代码 | R-PDIP-T14 |
JESD-609代码 | e0 |
逻辑集成电路类型 | INVERTER |
湿度敏感等级 | 2A |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 250 |
电源 | 5/15 V |
Prop。Delay @ Nom-Sup | 400 ns |
施密特触发器 | YES |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
Base Number Matches | 1 |
74C14PCQR | 74C14FCQM | 74C14DC | 74C14FCQR | 74C14PC | 74C14FC | 74C14PCQM | 74C14DCQR | 74C14DCQM | |
---|---|---|---|---|---|---|---|---|---|
描述 | Inverter, CMOS, PDIP14, | Inverter, CMOS, CDFP14, | Inverter, CMOS, CDIP14, | Inverter, CMOS, CDFP14, | Inverter, CMOS, PDIP14, | Inverter, CMOS, CDFP14, | Inverter, CMOS, PDIP14, | Inverter, CMOS, CDIP14, | Inverter, CMOS, CDIP14, |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
包装说明 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
JESD-30 代码 | R-PDIP-T14 | R-XDFP-F14 | R-XDIP-T14 | R-XDFP-F14 | R-PDIP-T14 | R-XDFP-F14 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
湿度敏感等级 | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
封装代码 | DIP | DFP | DIP | DFP | DIP | DFP | DIP | DIP | DIP |
封装等效代码 | DIP14,.3 | FL14,.3 | DIP14,.3 | FL14,.3 | DIP14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
Prop。Delay @ Nom-Sup | 400 ns | 400 ns | 400 ns | 400 ns | 400 ns | 400 ns | 200 ns | 400 ns | 400 ns |
施密特触发器 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
表面贴装 | NO | YES | NO | YES | NO | YES | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
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