IC HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, SSOP-20, Bus Driver/Transceiver
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SSOP |
| 包装说明 | SSOP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | BROADSIDE VERSION OF 374 |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 7.2 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 45 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 5.3 mm |
| Base Number Matches | 1 |
| 74HC574DB-T | 74HCT574D-T | 74HCT574DB-T | 74HC574PW-T | 74HC574D-T | |
|---|---|---|---|---|---|
| 描述 | IC HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, SSOP-20, Bus Driver/Transceiver | IC HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, SO-20, Bus Driver/Transceiver | IC HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, SSOP-20, Bus Driver/Transceiver | HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, TSSOP-20 | IC HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, SO-20, Bus Driver/Transceiver |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SSOP | SOIC | SSOP | TSSOP | SOIC |
| 包装说明 | SSOP, | SOP, | SSOP, | TSSOP, | SOP, |
| 针数 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | compliant | compliant | compliant | compliant |
| 其他特性 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 |
| 系列 | HC/UH | HCT | HCT | HC/UH | HC/UH |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 7.2 mm | 12.8 mm | 7.2 mm | 6.5 mm | 12.8 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SOP | SSOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 45 ns | 50 ns | 50 ns | 45 ns | 45 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 2.65 mm | 2 mm | 1.1 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 6 V | 5.5 V | 5.5 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 4.5 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 5.3 mm | 7.5 mm | 5.3 mm | 4.4 mm | 7.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
