507-035
Micro-D Potting shell
Potting shells are designed
to be used with solder cup
Micro-D connectors. The
potting shell is attached
to the connector and
filled with encapsulating
compounds such as epoxy
or RTV. The potting shell
is supplied with integral
jackscrews and provides a
convenient way to protect
the exposed solder cup
contacts. The low profile
shell requires minimal
clearance and is made of
machined aluminum.
B
C
.175 (4.4)
Retaining Clip
Jackscrew
G Thread - Typ.
.19 (4.8)
.035 (.9)
Wall Ref.
A
E
D
Connector
Shown For
Reference
Only
F
Metric dimensions (mm)
are indicated in
parentheses.
TABLE I: DIMENsIoNs
sHELL
sIzE
09
15
21
25
31
37
51
100
A
.775 (19.7)
.925 (23.5)
1.075 (27.3)
1.175 (29.8)
1.325 (33.7)
1.475 (37.5)
1.425 (36.2)
2.160 (54.9)
B
.34 (8.6)
.34 (8.6)
.34 (8.6)
.34 (8.6)
.34 (8.6)
.34 (8.6)
.38 (9.7)
.43 (10.9)
C
(6.6)
(6.6)
(6.6)
(6.6)
(6.6)
(6.6)
(7.6)
(9.1)
D
E
.565 (14.4)
.715 (18.2)
.865 (22.0)
.965 (24.5)
1.115 (28.3)
1.265 (32.1)
1.215 (30.9)
1.800 (45.7)
F
Ref
.154 (3.9)
.154 (3.9)
.154 (3.9)
.154 (3.9)
.154 (3.9)
.154 (3.9)
.154 (3.9)
.194 (4.9)
G Thread
2-56 UNC-2
2-56 UNC-2
2-56 UNC-2
2-56 UNC-2
2-56 UNC-2
2-56 UNC-2
2-56 UNC-2
4-40 UNC-2
.26
.26
.26
.26
.26
.26
.30
.36
.31
.48
.65
.75
.88
1.03
.98
1.35
(7.9)
(12.2)
(16.5)
(19.1)
(22.4)
(26.2)
(24.9)
(34.3)
HoW To oRDER
series
507
Basic
Part
Number
035
shell
Plating *
C
– Black Anodize
E
– Chem. Film
J
– Gold Iridite Over Cadmium Over Electroless
Nickel
M
– Electroless Nickel
NF
– Cadmium, Olive Drab Over Electroless Nickel
z 2
– Gold
shell
size
(Table I)
09
15
21
25
31
37
51
100
21
Sample Part Number:
507
—
035
M
* sEE PAGE C-4 FoR CoMPLETE INFoRMATIoN
© 2011 Glenair, Inc.
CAGE Code 06324
Printed in U.S.A.
GLENAIR, INC.
•
1211 AIR WAY
•
GLENDALE, CA 91201-2497
•
818-247-6000
•
FAX 818-500-9912
www.glenair.com
E-Mail: sales@glenair.com
C-33
MIL-DTL-83513
Micro-D
GD32 MCU
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