®
Technical Data Sheet
275 Flux-Cored Wire
Product Description
No-Clean Cored Wire for Lead-free and Leaded Alloys
Kester 275 Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the
electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly
activated rosin fluxes. The use of 275 results in an extremely clear post-soldering residue without cleaning. The unique
chemistry in 275 was also designed to reduce spattering common to most core fluxes. 275 can be used for both lead-free
and leaded soldering.
Performance Characteristics:
■
Colorless translucent residues
■
Improves wetting performance
■
Excellent solderability and fast
wetting to a variety of surface
finishes
■
Eliminates the need and expense of
cleaning
■
Low smoke and odor
■
Low spattering
■
Compatible with lead-free and
leaded alloys
■
Classified as ROL0 per J-STD-004
■
Compliant to Bellcore GR-78
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2011/65/EU for the
stated banned substances. (Applies only if this core flux is combined with a lead-free alloy)
Reliability Properties
Copper Mirror Corrosion:
Low
Corrosion Test:
Low
Tested to J-STD-004, IPC-TM-650, Method
2.3.32
Tested to J-STD-004, IPC-TM-650, Method
2.6.15
Chloride and Bromides:
None
Detected
Tested to J-STD-004, IPC-TM-650, Method
2.3.35
Surface Insulation Resistivity (SIR)
85C/85%RH, IPC (typical):
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.6.3.3
Fluorides by Spot Test:
Pass
Blank
Day 1
Day 4
Day 7
1.6*10 Ω
10
275
1.1*10 Ω
10
Silver Chromate:
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.35.1
1.2*10
10
Ω
1.1*10
10
Ω
9.2*10
9
Ω
8.6*10
9
Ω
Tested to J-STD-004, IPC-TM-650, Method
2.3.33
Spread Test (typical):
Tested to J-STD-004, IPC-TM-650, Method
2.4.46
Area of Spread mm
2
(in
2
)
Flux
Cored
Solder
Sn96.5Ag3.0Cu0.5 Sn63Pb37
335 (0.52)
Surface Insulation Resistivity (SIR)
40C/90%RH, IPC (typical):
Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.6.3.7
285 Mildly
Activated 213 (0.33)
Rosin
245 No-
Clean
275 No-
Clean
200 (0.31)
219 (0.34)
348 (0.54)
361 (0.56)
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
Application Notes
Availability
275 is available in a wide variety of alloys, wire diameters and flux percentages. For most applications, Sn63Pb37,
Sn96.5Ag3.0Cu0.5 or K100LD is used. Please refer to www.kester.com for wire diameters, flux percentages, alloys and
roll sizes that are available.
Note: Core Size 50, 58 and 66 = 1.1%, 2.2% and 3.3% flux core.
®
Process Considerations
Solder iron tip temperatures are most commonly between 315-343°C (600-650°F) for Sn63Pb37 and Sn62Pb36Ag02
alloys, and between 371-400°C (700-750°F) for lead-free alloys. Heat both the land area and component lead to be
soldered with the iron prior to touching the land with the cored wire. Do not apply the wire directly to the soldering iron tip.
If needed, Kester 959T or 985M no clean flux may be used as a compatible liquid flux to aid in reworking soldered joints.
Kester 959T is available in Flux-Pen® for optimum board cleanliness.
Cleaning
The 275 flux residues are non-corrosive, non-conductive and do not require removal in most applications. IPA will
not clean the residues off the surface of the circuit board after the soldering process. A saponifier or cleaning agent
specifically designed to clean a no-clean flux is required to clean the residues. Please contact Kester Technical Support
for further information.
Storage and Warranty Period
Storage must be in a dry, non-corrosive environment between 10-40°C (50-104°F). The surface may lose its shine and
appear a dull shade of grey. This is a surface phenomenon and is not detrimental to product functionality. Flux-cored
solder wire has a limited warranty period determined by the alloy used in the wire. For alloys containing more than 70%
lead, the warranty period is 2 years from the date of manufacture. Other alloys have a warranty period of 3 years from the
date of manufacture.
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
(SDS) and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
