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High-speed Complex Programmable Logic Device
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | compli |
| 其他特性 | NO |
| 最大时钟频率 | 50 MHz |
| 系统内可编程 | NO |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| JTAG BST | NO |
| 长度 | 31.877 mm |
| 湿度敏感等级 | 1 |
| 专用输入次数 | 11 |
| I/O 线路数量 | 10 |
| 宏单元数 | 10 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 3.3 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 15 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.334 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.62 mm |
| ATF750LVC-15PC | ATF750LVC-15X(1) | ATF750LVC-15XC(1) | ATF750LVC-15SC | ATF750LVC-15JI | ATF750LVC | ATF750LVC-15JC | |
|---|---|---|---|---|---|---|---|
| 描述 | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | - | 不符合 |
| 零件包装代码 | DIP | - | - | SOIC | LCC | - | LCC |
| 包装说明 | DIP, DIP24,.3 | - | - | SOP, SOP24,.4 | QCCJ, LDCC28,.5SQ | - | QCCJ, LDCC28,.5SQ |
| 针数 | 24 | - | - | 24 | 28 | - | 28 |
| Reach Compliance Code | compli | - | - | compli | compli | - | compli |
| 其他特性 | NO | - | - | NO | NO | - | NO |
| 最大时钟频率 | 50 MHz | - | - | 50 MHz | 50 MHz | - | 50 MHz |
| 系统内可编程 | NO | - | - | NO | NO | - | NO |
| JESD-30 代码 | R-PDIP-T24 | - | - | R-PDSO-G24 | S-PQCC-J28 | - | S-PQCC-J28 |
| JESD-609代码 | e0 | - | - | e0 | e0 | - | e0 |
| JTAG BST | NO | - | - | NO | NO | - | NO |
| 长度 | 31.877 mm | - | - | 15.4 mm | 11.5062 mm | - | 11.5062 mm |
| 湿度敏感等级 | 1 | - | - | 2 | 2 | - | 2 |
| 专用输入次数 | 11 | - | - | 11 | 11 | - | 11 |
| I/O 线路数量 | 10 | - | - | 10 | 10 | - | 10 |
| 宏单元数 | 10 | - | - | 10 | 10 | - | 10 |
| 端子数量 | 24 | - | - | 24 | 28 | - | 28 |
| 最高工作温度 | 70 °C | - | - | 70 °C | 85 °C | - | 70 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | - | - | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | - | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | - | - | MACROCELL | MACROCELL | - | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | - | - | SOP | QCCJ | - | QCCJ |
| 封装等效代码 | DIP24,.3 | - | - | SOP24,.4 | LDCC28,.5SQ | - | LDCC28,.5SQ |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | SQUARE | - | SQUARE |
| 封装形式 | IN-LINE | - | - | SMALL OUTLINE | CHIP CARRIER | - | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 225 | - | - | 240 | 225 | - | 225 |
| 电源 | 3.3 V | - | - | 3.3 V | 3.3 V | - | 3.3 V |
| 可编程逻辑类型 | EE PLD | - | - | EE PLD | EE PLD | - | EE PLD |
| 传播延迟 | 15 ns | - | - | 15 ns | 15 ns | - | 15 ns |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 5.334 mm | - | - | 2.65 mm | 4.572 mm | - | 4.572 mm |
| 最大供电电压 | 3.6 V | - | - | 3.6 V | 3.6 V | - | 3.6 V |
| 最小供电电压 | 3 V | - | - | 3 V | 3 V | - | 3 V |
| 标称供电电压 | 3.3 V | - | - | 3.3 V | 3.3 V | - | 3.3 V |
| 表面贴装 | NO | - | - | YES | YES | - | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | - | CMOS |
| 温度等级 | COMMERCIAL | - | - | COMMERCIAL | INDUSTRIAL | - | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | - | GULL WING | J BEND | - | J BEND |
| 端子节距 | 2.54 mm | - | - | 1.27 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | - | - | DUAL | QUAD | - | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | - | - | 30 | 30 | - | 30 |
| 宽度 | 7.62 mm | - | - | 7.5 mm | 11.5062 mm | - | 11.5062 mm |
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