8-bit Microcontroller with 2K Bytes Flash
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP20,.3 |
| 针数 | 20 |
| Reach Compliance Code | unknow |
| Factory Lead Time | 1 week |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 8 |
| CPU系列 | AVR RISC |
| 最大时钟频率 | 8 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e0 |
| 长度 | 25.739 mm |
| 湿度敏感等级 | 1 |
| I/O 线路数量 | 16 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 128 |
| ROM（单词） | 2048 |
| ROM可编程性 | FLASH |
| 座面最大高度 | 5.334 mm |
| 速度 | 8 MHz |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.62 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| ATTINY26L-8PC | ATTINY26L-8SI | ATTINY26L-8SC | ATTINY26L-8MC | ATTINY26L | ATTINY26-16SC | ATTINY26-16PI | ATTINY26-16PC | ATTINY26-16MC | ATTINY26 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 8-bit Microcontroller with 2K Bytes Flash | 8-bit Microcontroller with 2K Bytes Flash | 8-bit Microcontroller with 2K Bytes Flash | 8-bit Microcontroller with 2K Bytes Flash | 8-bit Microcontroller with 2K Bytes Flash | 8-bit Microcontroller with 2K Bytes Flash | 8-bit Microcontroller with 2K Bytes Flash | 8-bit Microcontroller with 2K Bytes Flash | 8-bit Microcontroller with 2K Bytes Flash | 8-bit Microcontroller with 2K Bytes Flash |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 零件包装代码 | DIP | SOIC | SOIC | QFN | - | SOIC | DIP | DIP | QFN | - |
| 包装说明 | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 | HVQCCN, LCC32,.2SQ,20 | - | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 | HVQCCN, LCC32,.2SQ,20 | - |
| 针数 | 20 | 20 | 20 | 32 | - | 20 | 20 | 20 | 32 | - |
| Reach Compliance Code | unknow | unknow | compli | compli | - | compli | unknow | unknow | compli | - |
| 具有ADC | YES | YES | YES | YES | - | YES | YES | YES | YES | - |
| 位大小 | 8 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 | - |
| CPU系列 | AVR RISC | AVR RISC | AVR RISC | AVR RISC | - | AVR RISC | AVR RISC | AVR RISC | AVR RISC | - |
| 最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | - | 16 MHz | 16 MHz | 16 MHz | 16 MHz | - |
| DAC 通道 | NO | NO | NO | NO | - | NO | NO | NO | NO | - |
| DMA 通道 | NO | NO | NO | NO | - | NO | NO | NO | NO | - |
| JESD-30 代码 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | S-XQCC-N32 | - | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | S-XQCC-N32 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 | - |
| 长度 | 25.739 mm | 12.8 mm | 12.8 mm | 5 mm | - | 12.8 mm | 25.739 mm | 25.739 mm | 5 mm | - |
| I/O 线路数量 | 16 | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 | - |
| 端子数量 | 20 | 20 | 20 | 32 | - | 20 | 20 | 20 | 32 | - |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | - | 70 °C | 85 °C | 70 °C | 70 °C | - |
| PWM 通道 | YES | YES | YES | YES | - | YES | YES | YES | YES | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | - |
| 封装代码 | DIP | SOP | SOP | HVQCCN | - | SOP | DIP | DIP | HVQCCN | - |
| 封装等效代码 | DIP20,.3 | SOP20,.4 | SOP20,.4 | LCC32,.2SQ,20 | - | SOP20,.4 | DIP20,.3 | DIP20,.3 | LCC32,.2SQ,20 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | - |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE | IN-LINE | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 峰值回流温度（摄氏度） | 225 | 240 | 240 | 240 | - | 240 | 225 | 225 | 240 | - |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - | 5 V | 5 V | 5 V | 5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| RAM（字节） | 128 | 128 | 128 | 128 | - | 128 | 128 | 128 | 128 | - |
| ROM（单词） | 2048 | 2048 | 2048 | 2048 | - | 2048 | 2048 | 2048 | 2048 | - |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | - | FLASH | FLASH | FLASH | FLASH | - |
| 座面最大高度 | 5.334 mm | 2.649 mm | 2.649 mm | 1 mm | - | 2.649 mm | 5.334 mm | 5.334 mm | 1 mm | - |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | - | 16 MHz | 16 MHz | 16 MHz | 16 MHz | - |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V | - | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | NO | YES | YES | YES | - | YES | NO | NO | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 0.5 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | 0.5 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | - | DUAL | DUAL | DUAL | QUAD | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | - | 30 | 30 | 30 | 30 | - |
| 宽度 | 7.62 mm | 7.5 mm | 7.5 mm | 5 mm | - | 7.5 mm | 7.62 mm | 7.62 mm | 5 mm | - |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - |
| 厂商名称 | - | Atmel (Microchip) | Atmel (Microchip) | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - |
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