Product Bulletin
Fail-Safe Floating Electrode MLCC /
Outline Drawing
W
T
S
ELECTRODES
L
B
NICKEL PLATE
CONDUCTIVE METALLIZATION
TIN PLATE
FE-CAP
/ X7R Dielectric
Product Description
The FE-CAP is a SMD MLCC utilizing a floating internal electrode design, wherein the electrodes are con-
figured to form multiple capacitors in series within a single MLCC package. This not only yields improved
voltage and ESD performance over standard designs, but also mitigates the risk of low-IR or short-circuit
failures that can occur due to board flex. Combined with the stability of an X7R dielectric, the FE-CAP com-
plements KEMET's Open Mode Devices by providing a fail-safe design optimized for low to mid range
capacitance values.
FE-CAP Internal Design
Flex Crack
Unique electrode
design allows for
a fail-open during
a flex condition.
Dimensions – Millimeters (Inches)
EIA Size Metric Size
Code
Code
0402
0603
0805
1206
1210
1812
1005
1608
2012
3216
3225
4532
L
Length
1.0 (.04) ± 0.05 (.002)
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.20 (.008)
3.2 (.126) ± 0.20 (.008)
3.2 (.126) ± 0.20 (.008)
4.5 (.177) ± 0.30 (.012)
W
Width
0.5 (.02) ± 0.05 (.002)
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.20 (.008)
1.6 (.063) ± 0.20 (.008)
2.5 (.098) ± 0.20 (.008)
3.2 (.126 ) ± 0.30 (.012)
B
Bandwidth
0.20 (.008) -0.40 (.016)
0.35 (.014) ± 0.15 (.006)
0.05 (.02) ± 0.25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.60 (.024) ± .35 (.014)
S
Separation
0.30 (.012)
0.70 (.028)
0.75 (.030)
N/A
N/A
N/A
Refer to standard thickness dimensions and table located in the F3102 SMT catalog on pages 73, 74, and 77.
F3280A 3/07
Ordering Information
C
Style
C - Ceramic
Size Code
0402, 0603, 0805, 1206, 1210, 1812
Specification
S - Floating Electrode
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
Capacitance Tolerance
K = ±10%; M = ±20%; J = ±5%
End Metallization
C = Standard
Failure Rate Level
A = Not Applicable
Temperature Characteristic
Designated by Capacitance
Change over Temperature Range
R – X7R (±15%) (-55°C +125°C)
Voltage
4 = 16V, 3 = 25V, 5 = 50V
1 = 100V, 2 = 200V, A = 250V
0805
S
103
K
5
R
A
C
Electrical Parameters
As detailed in the KEMET Surface Mount Catalog F3102 for X7R, with following specific requirements
based on room temperature (25°C) parameters:
• Operating Range: -55°C to +125°C, with no-bias capacitance shift limited to ± 15% over that range.
• Insulation Resistance (IR) measured after 2 minutes at rated voltage @ 25°C: Limit is 1,000
megohm microfarads or 100 gigohm, whichever is less.
• Capacitance and Dissipation Factor (DF) measured at 1kHz and 1 Vrms.
DF Limits are:
50 - 250 Volts
16 - 25 Volts
2.5%
3.5%
Soldering Process
These components are suitable for reflow and wave soldering. All parts incorporate the standard KEMET
barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as well as resist-
ance to leaching.
Marking
These chips will be supplied unmarked. If required, they can be laser-marked as an extra option.
Details on the marking format are included in KEMET Surface Mount catalog F3102.
In general, the information in the KEMET Surface Mount catalog F3102 applies to these
capacitors. The information in this bulletin supplements that in the catalog.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Microchip MCU
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