High Speed CMOS Logic 4-by-4 Register File 16-PDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A001.A.2.C |
| Factory Lead Time | 6 weeks |
| Samacsys Descripti | High Speed CMOS Logic 4-by-4 Register File |
| 系列 | HC |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e4 |
| 长度 | 19.305 mm |
| 逻辑集成电路类型 | LOGIC CIRCUIT |
| 最大I（ol） | 0.0078 A |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 最大电源电流（ICC） | 0.08 mA |
| Prop。Delay @ Nom-Su | 42 ns |
| 传播延迟（tpd） | 42 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | N |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 6 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| CD74HC670E | CD74HCT670M | CD74HCT670E | CD74HCT670EE4 | CD74HC670M | CD74HC670M96 | CD74HC670EE4 | |
|---|---|---|---|---|---|---|---|
| 描述 | High Speed CMOS Logic 4-by-4 Register File 16-PDIP -55 to 125 | High Speed CMOS Logic 4-by-4 Register File 16-SOIC -55 to 125 | High Speed CMOS Logic 4-by-4 Register File 16-PDIP -55 to 125 | High Speed CMOS Logic 4-by-4 Register File 16-PDIP -55 to 125 | High Speed CMOS Logic 4-by-4 Register File 16-SOIC -55 to 125 | High Speed CMOS Logic 4-by-4 Register File 16-SOIC -55 to 125 | High Speed CMOS Logic 4-by-4 Register File 16-PDIP -55 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP | SOIC | DIP | DIP | SOIC | SOIC | DIP |
| 包装说明 | DIP, | SOP, | DIP, | DIP, | SOP, | SOP, | DIP-16 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli |
| ECCN代码 | 3A001.A.2.C | EAR99 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | 3A001.A.2.C |
| 系列 | HC | HCT | HCT | HCT | HC | HC | HC/UH |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 19.305 mm | 9.9 mm | 19.3 mm | 19.305 mm | 9.9 mm | 9.9 mm | 19.305 mm |
| 逻辑集成电路类型 | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | DIP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.75 mm | 5.08 mm | 5.08 mm | 1.75 mm | 1.75 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V | 5.5 V | 5.5 V | 5.5 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 4.5 V | 4.5 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 6 V | 5 V | 5 V | 5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | NO | YES | NO | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 3.91 mm | 6.35 mm | 7.62 mm | 3.91 mm | 3.91 mm | 7.62 mm |
| Factory Lead Time | 6 weeks | 1 week | 6 weeks | - | 1 week | 1 week | - |
| 最大I（ol） | 0.0078 A | 0.006 A | 0.006 A | - | 0.0078 A | 0.0078 A | - |
| 位数 | 4 | 4 | 4 | - | 4 | 4 | - |
| 输出极性 | TRUE | TRUE | TRUE | - | TRUE | TRUE | - |
| 包装方法 | TUBE | TUBE | TUBE | - | TUBE | TR | - |
| 最大电源电流（ICC） | 0.08 mA | 0.08 mA | 0.08 mA | - | 0.08 mA | 0.08 mA | - |
| Prop。Delay @ Nom-Su | 42 ns | 50 ns | 50 ns | - | 42 ns | 42 ns | - |
| 传播延迟（tpd） | 42 ns | 50 ns | 50 ns | - | 42 ns | 42 ns | - |
| 施密特触发器 | N | N | N | - | N | N | - |
| 是否无铅 | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
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