Shift Register Single 8-Bit Serial/Parallel to Serial 16-Pin SOIC Tube
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| Part Status | Obsolete |
| SVHC | Yes |
| Supplier Package | SOIC |
| Pin Count | 16 |
| Standard Package Name | SOP |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Length | 10(Max) |
| Package Width | 4(Max) |
| PCB changed | 16 |
| Lead Shape | Gull-wing |
| CD74HCT165MG4 | CD74HCT165MTE4 | CD74HCT165MTG4 | CD74HC165M96E4 | CD74HC165MTG4 | |
|---|---|---|---|---|---|
| 描述 | Shift Register Single 8-Bit Serial/Parallel to Serial 16-Pin SOIC Tube | Counter Shift Registers High Speed CMOS 8-Bit Shift Register | Counter Shift Registers Hi Sp CMOS 8B Par-In Ser-Out Shift Reg | Counter Shift Registers High Speed CMOS 8-Bit Shift Register | Counter Shift Registers Hi Sp CMOS 8B Par-In Ser-Out Shift Reg |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | - | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | - | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 |
| 针数 | - | 16 | 16 | 16 | 16 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow |
| 其他特性 | - | SISO OPERATION ALSO AVAILABLE | SISO OPERATION ALSO AVAILABLE | SISO OPERATION ALSO AVAILABLE | SISO OPERATION ALSO AVAILABLE |
| 计数方向 | - | RIGHT | RIGHT | RIGHT | RIGHT |
| 系列 | - | HCT | HCT | HC/UH | HC/UH |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | - | e4 | e4 | e4 | e4 |
| 长度 | - | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm |
| 逻辑集成电路类型 | - | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT |
| 最大频率@ Nom-Su | - | 18000000 Hz | 20000000 Hz | 20000000 Hz | 20000000 Hz |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 位数 | - | 8 | 8 | 8 | 8 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 16 | 16 | 16 | 16 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | SOP | SOP | SOP |
| 封装等效代码 | - | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 5 V | 5 V | 2/6 V | 2/6 V |
| 传播延迟（tpd） | - | 60 ns | 60 ns | 250 ns | 250 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 4.5 V | 4.5 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | - | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| 最小 fmax | - | 18 MHz | 18 MHz | 24 MHz | 24 MHz |
嵌入式系统
微控制器 MCU
微控制器 MCU
实时操作系统RTOS
无线连接
ARM技术
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
