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BR25L020FV-W: 产品描述SPI BUS 2Kbit (256 x 8bit) EEPROM; 产品类别存储存储; 文件大小330KB，共6页; 制造商ROHM(罗姆半导体); 官网地址https://www.rohm.com/; 标准

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BR25L020FV-W概述

SPI BUS 2Kbit (256 x 8bit) EEPROM

BR25L020FV-W规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
零件包装代码	SOIC
包装说明	LSSOP, TSSOP8,.25
针数	8
Reach Compliance Code	compli
ECCN代码	EAR99
最大时钟频率 (fCLK)	5 MHz
数据保留时间-最小值	40
耐久性	1000000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8
JESD-609代码	e2
长度	4.4 mm
内存密度	2048 bi
内存集成电路类型	EEPROM
内存宽度	8
功能数量	1
端子数量	8
字数	256 words
字数代码	256
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	256X8
封装主体材料	PLASTIC/EPOXY
封装代码	LSSOP
封装等效代码	TSSOP8,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
并行/串行	SERIAL
峰值回流温度（摄氏度）	260
电源	2/5 V
认证状态	Not Qualified
座面最大高度	1.25 mm
串行总线类型	SPI
最大待机电流	0.000002 A
最大压摆率	0.003 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.8 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Copper (Sn/Cu)
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	10
宽度	3 mm
最长写入周期时间 (tWC)	5 ms
写保护	HARDWARE/SOFTWARE
Base Number Matches	1

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Appendix

Notes

No technical content pages of this document may be reproduced in any form or transmitted by any

means without prior permission of ROHM CO.,LTD.

The contents described herein are subject to change without notice. The specifications for the

product described in this document are for reference only. Upon actual use, therefore, please request

that specifications to be separately delivered.

Application circuit diagrams and circuit constants contained herein are shown as examples of standard

use and operation. Please pay careful attention to the peripheral conditions when designing circuits

and deciding upon circuit constants in the set.

Any data, including, but not limited to application circuit diagrams information, described herein

are intended only as illustrations of such devices and not as the specifications for such devices. ROHM

CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any

third party's intellectual property rights or other proprietary rights, and further, assumes no liability of

whatsoever nature in the event of any such infringement, or arising from or connected with or related

to the use of such devices.

Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or

otherwise dispose of the same, no express or implied right or license to practice or commercially

exploit any intellectual property rights or other proprietary rights owned or controlled by

ROHM CO., LTD. is granted to any such buyer.

Products listed in this document are no antiradiation design.

The products listed in this document are designed to be used with ordinary electronic equipment or devices

(such as audio visual equipment, office-automation equipment, communications devices, electrical

appliances and electronic toys).

Should you intend to use these products with equipment or devices which require an extremely high level of

reliability and the malfunction of with would directly endanger human life (such as medical instruments,

transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other

safety devices), please be sure to consult with our sales representative in advance.

About Export Control Order in Japan

Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control

Order in Japan.

In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)

on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.

Appendix1-Rev1.1

BR25L020FV-W相似产品对比

	BR25L020FV-W	BR25L020F-W	BR25L020FJ-W	BR25L020FVM-W	BR25L020FVJ-W	BR25L020FVT-W
描述	SPI BUS 2Kbit (256 x 8bit) EEPROM	SPI BUS 2Kbit (256 x 8bit) EEPROM	SPI BUS 2Kbit (256 x 8bit) EEPROM	SPI BUS 2Kbit (256 x 8bit) EEPROM	SPI BUS 2Kbit (256 x 8bit) EEPROM	SPI BUS 2Kbit (256 x 8bit) EEPROM
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合
零件包装代码	SOIC	SOIC	SOIC	MSOP	SOIC	SOIC
包装说明	LSSOP, TSSOP8,.25	LSOP, SOP8,.25	SOP, SOP8,.25	VSSOP, TSSOP8,.16	TSSOP,	LSSOP,
针数	8	8	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli	compli	compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最大时钟频率 (fCLK)	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	S-PDSO-G8	R-PDSO-G8
JESD-609代码	e2	e2	e2	e2	e2	e2
长度	4.4 mm	5 mm	4.9 mm	2.9 mm	3 mm	4.4 mm
内存密度	2048 bi	2048 bi	2048 bi	2048 bi	2048 bi	2048 bi
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	8	8	8	8	8	8
功能数量	1	1	1	1	1	1
端子数量	8	8	8	8	8	8
字数	256 words	256 words	256 words	256 words	256 words	256 words
字数代码	256	256	256	256	256	256
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	256X8	256X8	256X8	256X8	256X8	256X8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LSSOP	LSOP	SOP	VSSOP	TSSOP	LSSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
封装形式	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	260	260	260	260	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
串行总线类型	SPI	SPI	SPI	SPI	SPI	SPI
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Copper (Sn/Cu)	Tin/Copper (Sn/Cu)	Tin/Copper (Sn/Cu)	Tin/Copper (Sn97.5Cu2.5)	Tin/Copper (Sn/Cu)	Tin/Copper (Sn/Cu)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	1.27 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	10	10	10	10	NOT SPECIFIED	NOT SPECIFIED
宽度	3 mm	4.4 mm	3.9 mm	2.8 mm	3 mm	3 mm
最长写入周期时间 (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
数据保留时间-最小值	40	40	40	40	-	-
耐久性	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-	-
封装等效代码	TSSOP8,.25	SOP8,.25	SOP8,.25	TSSOP8,.16	-	-
电源	2/5 V	2/5 V	2/5 V	2/5 V	-	-
座面最大高度	1.25 mm	1.6 mm	-	0.9 mm	1.05 mm	1.25 mm
最大待机电流	0.000002 A	0.000002 A	0.000002 A	0.000002 A	-	-
最大压摆率	0.003 mA	0.003 mA	0.003 mA	0.003 mA	-	-
写保护	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-	-
Base Number Matches	1	1	1	-	1	-

BR25L020FV-W

BR25L020FV-W概述

BR25L020FV-W规格参数

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BR25L020FV-W相似产品对比

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