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BR24L01AF-W: 产品描述I2C BUS 1Kbit (128 x 8bit) EEPROM; 产品类别存储存储; 文件大小310KB，共6页; 制造商ROHM(罗姆半导体); 官网地址https://www.rohm.com/; 标准

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BR24L01AF-W概述

I2C BUS 1Kbit (128 x 8bit) EEPROM

BR24L01AF-W规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	ROHM(罗姆半导体)
零件包装代码	SOIC
包装说明	LSOP, SOP8,.25
针数	8
Reach Compliance Code	compli
ECCN代码	EAR99
最大时钟频率 (fCLK)	0.1 MHz
数据保留时间-最小值	40
耐久性	1000000 Write/Erase Cycles
I2C控制字节	1010DDDR
JESD-30 代码	R-PDSO-G8
JESD-609代码	e2
长度	5 mm
内存密度	1024 bi
内存集成电路类型	EEPROM
内存宽度	8
功能数量	1
端子数量	8
字数	128 words
字数代码	128
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	128X8
封装主体材料	PLASTIC/EPOXY
封装代码	LSOP
封装等效代码	SOP8,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, LOW PROFILE
并行/串行	SERIAL
峰值回流温度（摄氏度）	260
电源	2/5 V
认证状态	Not Qualified
座面最大高度	1.71 mm
串行总线类型	I2C
最大待机电流	0.000002 A
最大压摆率	0.002 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.8 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Copper (Sn/Cu)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	10
宽度	4.4 mm
最长写入周期时间 (tWC)	5 ms
写保护	HARDWARE

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Appendix

Notes

No technical content pages of this document may be reproduced in any form or transmitted by any

means without prior permission of ROHM CO.,LTD.

The contents described herein are subject to change without notice. The specifications for the

product described in this document are for reference only. Upon actual use, therefore, please request

that specifications to be separately delivered.

Application circuit diagrams and circuit constants contained herein are shown as examples of standard

use and operation. Please pay careful attention to the peripheral conditions when designing circuits

and deciding upon circuit constants in the set.

Any data, including, but not limited to application circuit diagrams information, described herein

are intended only as illustrations of such devices and not as the specifications for such devices. ROHM

CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any

third party's intellectual property rights or other proprietary rights, and further, assumes no liability of

whatsoever nature in the event of any such infringement, or arising from or connected with or related

to the use of such devices.

Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or

otherwise dispose of the same, no express or implied right or license to practice or commercially

exploit any intellectual property rights or other proprietary rights owned or controlled by

ROHM CO., LTD. is granted to any such buyer.

Products listed in this document are no antiradiation design.

The products listed in this document are designed to be used with ordinary electronic equipment or devices

(such as audio visual equipment, office-automation equipment, communications devices, electrical

appliances and electronic toys).

Should you intend to use these products with equipment or devices which require an extremely high level of

reliability and the malfunction of with would directly endanger human life (such as medical instruments,

transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other

safety devices), please be sure to consult with our sales representative in advance.

About Export Control Order in Japan

Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control

Order in Japan.

In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)

on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.

Appendix1-Rev1.1

BR24L01AF-W相似产品对比

	BR24L01AF-W	BR24L01AFJ-W	BR24L01AFV-W	BR24L01AFVM-W	BR24L01AFVT-W	BR24L01AFVJ-W
描述	I2C BUS 1Kbit (128 x 8bit) EEPROM	I2C BUS 1Kbit (128 x 8bit) EEPROM	I2C BUS 1Kbit (128 x 8bit) EEPROM	I2C BUS 1Kbit (128 x 8bit) EEPROM	I2C BUS 1Kbit (128 x 8bit) EEPROM	I2C BUS 1Kbit (128 x 8bit) EEPROM
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合
厂商名称	ROHM(罗姆半导体)	ROHM(罗姆半导体)	ROHM(罗姆半导体)	ROHM(罗姆半导体)	ROHM(罗姆半导体)	ROHM(罗姆半导体)
零件包装代码	SOIC	SOIC	SOIC	MSOP	SOIC	SOIC
包装说明	LSOP, SOP8,.25	SOP-8	LSSOP, TSSOP8,.25	MSOP-8	TSSOP, TSSOP8,.25	TSSOP-8
针数	8	8	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli	compli	compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最大时钟频率 (fCLK)	0.1 MHz	0.1 MHz	0.1 MHz	0.1 MHz	0.1 MHz	0.1 MHz
数据保留时间-最小值	40	40	40	40	40	40
耐久性	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C控制字节	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	S-PDSO-G8
JESD-609代码	e2	e2	e2	e2	e2	e2
长度	5 mm	4.9 mm	4.4 mm	2.9 mm	4.4 mm	3 mm
内存密度	1024 bi	1024 bi	1024 bi	1024 bi	1024 bi	1024 bi
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	8	8	8	8	8	8
功能数量	1	1	1	1	1	1
端子数量	8	8	8	8	8	8
字数	128 words	128 words	128 words	128 words	128 words	128 words
字数代码	128	128	128	128	128	128
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	128X8	128X8	128X8	128X8	128X8	128X8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LSOP	LSOP	LSSOP	VSSOP	TSSOP	TSSOP
封装等效代码	SOP8,.25	SOP8,.25	TSSOP8,.25	TSSOP8,.16	TSSOP8,.25	TSSOP8,.19
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	SMALL OUTLINE, LOW PROFILE	SMALL OUTLINE, LOW PROFILE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	260	260	260	260	260	260
电源	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.71 mm	1.65 mm	1.35 mm	0.9 mm	1.2 mm	1.1 mm
串行总线类型	I2C	I2C	I2C	I2C	I2C	I2C
最大待机电流	0.000002 A	0.000002 A	0.000002 A	0.000002 A	0.000002 A	0.000002 A
最大压摆率	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Copper (Sn/Cu)	Tin/Copper (Sn/Cu)	Tin/Copper (Sn/Cu)	Tin/Copper (Sn97.5Cu2.5)	Tin/Copper (Sn/Cu)	Tin/Copper (Sn/Cu)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	10	10	10	10	10	10
宽度	4.4 mm	3.9 mm	3 mm	2.8 mm	3 mm	3 mm
最长写入周期时间 (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
写保护	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE

BR24L01AF-W

BR24L01AF-W概述

BR24L01AF-W规格参数

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BR24L01AF-W相似产品对比

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