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24CW640T-I/SN

产品描述EEPROM
产品类别存储    存储   
文件大小862KB,共50页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
下载文档 详细参数 选型对比 全文预览

24CW640T-I/SN概述

EEPROM

24CW640T-I/SN规格参数

参数名称属性值
厂商名称Microchip(微芯科技)
包装说明SOIC-8
Reach Compliance Codecompliant
Factory Lead Time13 weeks
最大时钟频率 (fCLK)1 MHz
JESD-30 代码R-PDSO-G8
长度4.9 mm
内存密度65536 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量8
字数8192 words
字数代码8000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织8KX8
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
并行/串行SERIAL
筛选级别TS 16949
座面最大高度1.75 mm
串行总线类型I2C
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.6 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
宽度3.9 mm
最长写入周期时间 (tWC)5 ms

文档预览

下载PDF文档
24CW16X/24CW32X/24CW64X/24CW128X
16K-128K I
2
C Serial EEPROM with Software Write
Protection Family Data Sheet
Device Selection Table
Part Number
24CW16X
24CW32X
24CW64X
24CW128X
Note:
Density
16-Kbit
32-Kbit
64-Kbit
128-Kbit
Page Size
32-byte
32-byte
32-byte
32-byte
V
CC
Range
1.6-5.5
1.6-5.5
1.6-5.5
1.6-5.5
Package
SN, OT, ST, MUY
SN, OT, ST, MUY
SN, OT, ST, MUY, CS0, CS1
SN, OT, ST, MUY, CS0, CS1
Temp. Ranges
I
I
I
I
‘X’ in the part number refers to the preset hardware slave address. Refer to
Table 3-2
for additional information.
Features
• 16/32/64/128-Kbit EEPROM:
- Internally organized as one
2048/4096/8192/16384 x 8 bit block
- Byte or page writes up to 32 bytes
- Byte or sequential reads within a block
- Self-timed write cycle (5 ms maximum)
• High-Speed I
2
C Interface:
- Industry standard: 1 MHz, 400 kHz and
100 kHz
- Output slope control to eliminate ground
bounce
- Schmitt trigger inputs for noise suppression
• Programmable Hardware Slave Address Bits:
- Configurable via the Hardware Address
Register (HAR)
• Versatile Data Protection Options:
- Software write protection via the Write
Protection Register (WPR)
• Operating Voltage Range of 1.6V to 5.5V
• Low-Power CMOS Technology:
- Write current: 1.0 mA maximum at 5.5V
- Read current: 1.0 mA maximum at 5.5V,
1 MHz
- Standby Current: 1 µA at 5.5V
• High Reliability:
- More than one million erase/write cycles
- Data retention: >200 years
- ESD protection: >4000V
• RoHS Compliant
Package Types (not to scale)
8-Lead SOIC/TSSOP
(Top View)
NC
NC
NC
Vss
1
2
3
4
8
7
6
5
V
CC
NC
SCL
SDA
5-Lead SOT23
(Top View)
SCL 1
V
SS
2
SDA 3
4 V
CC
5 NC
8-Pad UDFN
(Top View)
NC
1
NC
2
NC
3
V
SS
4
4-Ball CSP (CS0)
(1)
(Top View)
V
CC
V
SS
8
V
CC
7
NC
6
SCL
5
SDA
4-Ball CSP (CS1)
(2)
(Top View)
V
CC
SCL
SCL
SDA
SDA
V
SS
Note 1:
CS0 CSP ball pitch is 0.4x0.4 mm.
2:
CS1 CSP ball pitch is 0.5x0.4 mm.
Pin Function Table
Name
V
SS
SDA
SCL
V
CC
Ground
Serial Data Pin
Serial Clock Input
Supply Voltage
Function
Packages
• 8-Lead SOIC, 8-Lead TSSOP, 8-Pad UDFN,
5-Lead SOT-23 and Two 4-Ball CSP options
2018 Microchip Technology Inc.
DS20005772B-page 1

24CW640T-I/SN相似产品对比

24CW640T-I/SN 24CW320T-I/ST 24CW160T-I/ST 24CW160T-I/OT 24CW320-I/SN 24CW640-I/ST 24CW160T-I/SN 24CW160-I/ST 24CW640T-I/OT
描述 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
厂商名称 Microchip(微芯科技) Microchip(微芯科技) - - Microchip(微芯科技) Microchip(微芯科技) - - Microchip(微芯科技)
包装说明 SOIC-8 TSSOP, - - SOP, TSSOP-8 - - SOT-23, 5 PIN
Reach Compliance Code compliant compliant - - compliant compliant - - compliant
Factory Lead Time 13 weeks 13 weeks - - 9 weeks 6 weeks - - 13 weeks
最大时钟频率 (fCLK) 1 MHz 1 MHz - - 1 MHz 1 MHz - - 1 MHz
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 - - R-PDSO-G8 R-PDSO-G8 - - R-PDSO-G5
长度 4.9 mm 4.4 mm - - 4.9 mm 4.4 mm - - 2.9 mm
内存密度 65536 bit 32768 bit - - 32768 bit 65536 bit - - 65536 bit
内存集成电路类型 EEPROM EEPROM - - EEPROM EEPROM - - EEPROM
内存宽度 8 8 - - 8 8 - - 8
功能数量 1 1 - - 1 1 - - 1
端子数量 8 8 - - 8 8 - - 5
字数 8192 words 4096 words - - 4096 words 8192 words - - 8192 words
字数代码 8000 4000 - - 4000 8000 - - 8000
工作模式 SYNCHRONOUS SYNCHRONOUS - - SYNCHRONOUS SYNCHRONOUS - - SYNCHRONOUS
最高工作温度 85 °C 85 °C - - 85 °C 85 °C - - 85 °C
最低工作温度 -40 °C -40 °C - - -40 °C -40 °C - - -40 °C
组织 8KX8 4KX8 - - 4KX8 8KX8 - - 8KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY
封装代码 SOP TSSOP - - SOP TSSOP - - LSSOP
封装形状 RECTANGULAR RECTANGULAR - - RECTANGULAR RECTANGULAR - - RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - - SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
并行/串行 SERIAL SERIAL - - SERIAL SERIAL - - SERIAL
筛选级别 TS 16949 TS 16949 - - TS 16949 TS 16949 - - TS 16949
座面最大高度 1.75 mm 1.2 mm - - 1.75 mm 1.2 mm - - 1.45 mm
串行总线类型 I2C I2C - - I2C I2C - - I2C
最大供电电压 (Vsup) 5.5 V 5.5 V - - 5.5 V 5.5 V - - 5.5 V
最小供电电压 (Vsup) 1.6 V 1.6 V - - 1.6 V 1.6 V - - 1.6 V
标称供电电压 (Vsup) 1.8 V 1.8 V - - 1.8 V 1.8 V - - 1.8 V
表面贴装 YES YES - - YES YES - - YES
技术 CMOS CMOS - - CMOS CMOS - - CMOS
温度等级 INDUSTRIAL INDUSTRIAL - - INDUSTRIAL INDUSTRIAL - - INDUSTRIAL
端子形式 GULL WING GULL WING - - GULL WING GULL WING - - GULL WING
端子节距 1.27 mm 0.65 mm - - 1.27 mm 0.65 mm - - 0.95 mm
端子位置 DUAL DUAL - - DUAL DUAL - - DUAL
宽度 3.9 mm 3 mm - - 3.9 mm 3 mm - - 1.6 mm
最长写入周期时间 (tWC) 5 ms 5 ms - - 5 ms 5 ms - - 5 ms

 
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