SRAM 1.8/2.5V 256K x 72 18M
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | GSI Technology |
| 零件包装代码 | BGA |
| 包装说明 | LBGA, |
| 针数 | 209 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.B |
| Factory Lead Time | 8 weeks |
| 最长访问时间 | 7.5 ns |
| 其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY |
| JESD-30 代码 | R-PBGA-B209 |
| JESD-609代码 | e1 |
| 长度 | 22 mm |
| 内存密度 | 18874368 bit |
| 内存集成电路类型 | ZBT SRAM |
| 内存宽度 | 72 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 209 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX72 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.7 mm |
| 最大供电电压 (Vsup) | 2 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 14 mm |
| GS8162Z72CGC-150V | GS8162Z72CGC-250V | GS8162Z72CGC-200IV | GS8162Z72CGC-200V | GS8162Z72CC-200IV | GS8162Z72CC-250IV | GS8162Z72CC-200V | GS8162Z72CC-250V | |
|---|---|---|---|---|---|---|---|---|
| 描述 | SRAM 1.8/2.5V 256K x 72 18M | SRAM 1.8/2.5V 256K x 72 18M | SRAM 1.8/2.5V 256K x 72 18M | SRAM 1.8/2.5V 256K x 72 18M | SRAM 1.8/2.5V 256K x 72 18M | SRAM 1.8/2.5V 256K x 72 18M | SRAM 1.8/2.5V 256K x 72 18M | SRAM 1.8/2.5V 256K x 72 18M |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, |
| 针数 | 209 | 209 | 209 | 209 | 209 | 209 | 209 | 209 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| Factory Lead Time | 8 weeks | 8 weeks | 8 weeks | 8 weeks | 8 weeks | 8 weeks | 8 weeks | 8 weeks |
| 最长访问时间 | 7.5 ns | 5.5 ns | 6.5 ns | 6.5 ns | 6.5 ns | 5.5 ns | 6.5 ns | 5.5 ns |
| 其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY |
| JESD-30 代码 | R-PBGA-B209 | R-PBGA-B209 | R-PBGA-B209 | R-PBGA-B209 | R-PBGA-B209 | R-PBGA-B209 | R-PBGA-B209 | R-PBGA-B209 |
| 长度 | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm |
| 内存密度 | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit |
| 内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
| 内存宽度 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 209 | 209 | 209 | 209 | 209 | 209 | 209 | 209 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| 组织 | 256KX72 | 256KX72 | 256KX72 | 256KX72 | 256KX72 | 256KX72 | 256KX72 | 256KX72 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm |
| 最大供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| 厂商名称 | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | - | GSI Technology | - |
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