Infrared IrDA
®
Compliant Transceiver
Technical Data
HSDL-2100
Features
• Small Module Package
– height of 5.5 mm max.
• Integrated EMI Shield
– excellent Noise Immunity
• Lower I
LEDA
Current
• IEC825-Class 1 Eye Safe
• Enhanced Reliability
Performance
• Fully Compliant to IrDA 1.1
Specifications
– excellent Nose-to-Nose
operation
– 2 Channels:
– 2.4 Kb/s to 115.2 Kb/s
– 576 Kb/s to 4.0 Mb/s
• Designed to Accommodate
Light Loss with Cosmetic
Windows
• Compatible with ASK,
HP-SIR and TV Remote
• No Mode Programming
Required
• Interfaces to Various Super
I/O and Controller Devices
• Digital Appliances:
Internet Web TVs,
Internet Appliances
• Industrials and Medical
Instrumentation
– General Data Collection
Devices
– Patient and Pharmaceutical
Data Collection
• IR LANs
Description
The HSDL-2100 is a new
generation low-cost Infrared (IR)
transceiver module that provides
the interface between logic and
IR signals for through-air, serial,
half-duplex IR data links and is
compliant to IrDA Physical Layer
Specification 1.1. This module
is also IEC825-Class 1 Eye Safe.
Package
This IR module provides two
output signals, RXD-A for signal
rates from 2.4 Kb/s to 115.2 Kb/s
and RXD-B for signal rates of
0.576 Mb/s to 4.0 Mb/s.
HSDL-2100 consists of the
following basic elements: an
Optical SubAssembly (OSA) and
an Electrical SubAssembly (ESA)
combination with an integrated
EMI shield.
I/O pins configuration table is
shown on page 2. HSDL-2100
block diagram and recommended
application circuit is illustrated in
Figure 1 on page 3. The IR
transceiver module package
outline and recommended
PCBoard Pad layout, (Option
#001 — Integrated EMI shield
with guide pins) is illustrated
in Figure 2 on page 4.
Benefits
This combination of an integrated
EMI shield and transceiver sub-
assembly utilizes existing in-
house high-volume assembly
processes ensuring high quality
and high-volume supply. An
integrated EMI shield helps to
ensure low EMI emissions and
high immunity to EMI fields,
enhancing reliable performance.
Applications
• Data Communication:
Notebook Computers,
Subnotebook Computers,
Desktop Computers,
Printers, PDAs, Fax/
Photocopier
• Digital Imaging:
Digital Cameras, Photo
Imaging Printers
2
A brief description of the 2 basic
sub-assemblies,
Optical
SubAssembly
(OSA) and
Electrical SubAssembly
(ESA), is
on page 2.
Applications Information
The Applications Engineering
group, in the Hewlett-Packard
Communications Semiconductor
Solutions Division, is available
to assist you with the technical
understanding associated with
this IR transceiver module. You
can contact them through your
local Hewlett-Packard sales
representative for additional
details.
a discrete emitter that utilizes
a high speed, high efficiency,
Transparent Substrate, double
heterojunction, Aluminum
Gallium Arsenide (TS AlGaAs)
LED technology with an integral
lens in a clear molded package.
The transmitter lens is optimized
for speed, efficiency, and
distance at an emission wavelength
of 870 nm.
The receiver utilizes a discrete
silicon PIN photodiode with an
integral lens in a molded package
and contains a dye to absorb
visible light. The receiver lens
magnifies the effective area of the
PIN diode to enhance sensitivity.
The power supply for the PIN
and preamplifier are filtered to
attenuate noise from external
sources.
Electrical SubAssembly
The Electrical SubAssembly
(ESA) consists of a printed circuit
board on which a bipolar silicon
Integrated Circuit (IC) and
various surface-mount passive
circuit elements are attached. The
IC contains an LED driver and a
receiver providing two output
signals, RXD-A and RXD-B.
Optical SubAssembly
The Optical SubAssemblies (OSA)
includes a Transmitter and a
Receiver. The transmitter has
I/O Pins Configuration Table
Pin
1
2
3
4
5
6
7
8
9
10
Description
LED Anode
Transmitter Data Input
Receiver Data Output – Channel B
Receiver Data Output – Channel A
Threshold Capacitor
Ground
Supply Voltage
Averaging Capacitor
Ground (Analog)
PIN Bypass Cap
Symbol
LEDA
TXD
RXD-B
RXD-A
CX3
GND
V
CC
CX4
GND
CX1
3
V
CC
CX7
R2
1
HSDL-2100
CX2
TXD
R1
2
LEDA
TXD
IE
EI
PIN
BIAS
V
CC
CX6
CX1
10
CX1
GND
6
CX4
8
CX4
CX3
5
CX3
R3
CX5
9
GND
ADAPTIVE
THRESHOLD
& SQUELCH
RXD-A
4
V
REF
RXD-B
3
7
V
CC
Figure 1. HSDL-2100 Block Diagram and Application Circuit.
Recommended Application Circuit Components
Component
R1
R2
R3
[1]
CX1
[2]
CX2
CX3
[4]
CX4
CX5
[2]
CX6
CX7
[3]
560
Ω, ±
5%, 0.125 Watt
4.7
Ω, ±
5%, 0.5 Watt
10
Ω, ±
5%, 0.125 Watt
0.47
µF, ±
10%, X7R Ceramic
220 pF,
±
10%, X7R Ceramic
4700 pF,
±
10%, X7R Ceramic
0.010
µF, ±
10%, X7R Ceramic
0.47
µF, ±
20%, X7R Ceramic
≤
5 mm lead length
6.8
µF
Tantalum. Larger value recommended for noisy supplies or environments.
0.47
µF, ±
20%, X7R Ceramic.
Recommended Value
Notes:
1. In environments with noisy power supplies, supply rejection can be enhanced by including R3 as shown in application circuit.
2. CX1 and CX5 must be placed within 0.7 cm of the HSDL-2100 to obtain optimum noise immunity.
3. Only necessary in applications where transmitter switching causes more than a 50 mV ripple on V
CC
.
4. CX3 may be replaced with 1000 pF for MIR, FIR application performance. For FIR application used 4700 pF as shown in application
circuit.
4
Package Outline with Dimension and Recommended PCBoard Pad Layout
(Option #001 — Integrated EMI shield with Guide Pins.)
1.05
1.00
7.5 ± 0.20
8.8 ± 0.20
13.00 ± 0.20
6.30 ± 0.10
TYP. R 0.15
1
0.59
TYP. 0.55
1.143 BSC
0.80 ± 0.15
5.50
± 0.15
9.60 ± 0.30
10
2.80 ± 0.30
5.30 ± 0.20
GUIDE PINS
3.20 ± 0.30
+ 0.15
1.00 0
3° ± 3°
1.50 ± 0.30
0.80 ± 0.20
SHIELD GROUND PIN
0.97 ± 0.10
(10X) 0.70
0.51 ± 0.15
PIN
1
1.05 ± 0.10
1.31 ± 0.10
2.31 ± 0.10
1.143
BSC
5.05
(10X) 2.60
2.92
4.30
A
R 0.40
2.40
B
A
1.25
5.84
11.86 ± 0.10
SHIELD
SOLDER PAD
NOTES:
1. RECOMMENDED SOLDER STENCIL TO BE 5 TO 6 MILS THICK.
2. LETTER 'A' INDICATES LOCATION OF THROUGH HOLE FOR SHIELD GUIDE PIN.
2. LETTER 'B' INDICATES LOCATION OF SHIELD SOLDERED GROUNDING PAD.
Figure 2.
5
Package Outline with Dimension and Recommended PCBoard Pad Layout
(Option #002 — Integrated EMI shield without Guide Pins.)
1.05
1.00
7.5 ± 0.20
8.8 ± 0.20
13.00 ± 0.20
2.80 ± 0.30
5.30 ± 0.20
TYP. R 0.15
1 1
TYP. 0.55
1.143 BSC
10
3.20 ± 0.30
0.80 ± 0.15
5.50
± 0.15
9.60 ± 0.30
+ 0.15
1.00 0
3° ± 3°
0.80 ± 0.20
SHIELD GROUND PIN
1.50 ± 0.30
0.97 ± 0.10
(10X) 0.70
0.51 ± 0.15
PIN
1
1.05 ± 0.10
1.31 ± 0.10
2.31 ± 0.10
1.143
BSC
5.05
(10X) 2.60
2.92
2.40
A
SHIELD SOLDER PAD
1.25
NOTES:
1. RECOMMENDED SOLDER STENCIL TO BE 5 TO 6 MILS THICK.
2. LETTER 'A' INDICATES LOCATION OF SHIELD SOLDERED GROUNDING PAD.
Figure 3.
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