16Mx64 SDRAM DIMM based on 8Mx8 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD
| 参数名称 | 属性值 |
| 包装说明 | DIMM, DIMM168 |
| Reach Compliance Code | unknow |
| Is Samacsys | N |
| 最长访问时间 | 7 ns |
| 最大时钟频率 (fCLK) | 100 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDMA-N168 |
| 内存密度 | 1073741824 bi |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 64 |
| 端子数量 | 168 |
| 字数 | 16777216 words |
| 字数代码 | 16000000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16MX64 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIMM |
| 封装等效代码 | DIMM168 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 4096 |
| 最大待机电流 | 0.032 A |
| 最大压摆率 | 1.32 mA |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| KMM366S1623AT-G0 | KMM366S1623AT | KMM366S1623AT-G2 | KMM366S1623AT-G8 | |
|---|---|---|---|---|
| 描述 | 16Mx64 SDRAM DIMM based on 8Mx8 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD | 16Mx64 SDRAM DIMM based on 8Mx8 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD | 16Mx64 SDRAM DIMM based on 8Mx8 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD | 16Mx64 SDRAM DIMM based on 8Mx8 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD |
| 包装说明 | DIMM, DIMM168 | - | DIMM, DIMM168 | DIMM, DIMM168 |
| Reach Compliance Code | unknow | - | unknow | unknow |
| Is Samacsys | N | - | N | N |
| 最长访问时间 | 7 ns | - | 8 ns | 6 ns |
| 最大时钟频率 (fCLK) | 100 MHz | - | 83 MHz | 125 MHz |
| I/O 类型 | COMMON | - | COMMON | COMMON |
| JESD-30 代码 | R-PDMA-N168 | - | R-PDMA-N168 | R-PDMA-N168 |
| 内存密度 | 1073741824 bi | - | 1073741824 bi | 1073741824 bi |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE | - | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 64 | - | 64 | 64 |
| 端子数量 | 168 | - | 168 | 168 |
| 字数 | 16777216 words | - | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | - | 16000000 | 16000000 |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C |
| 组织 | 16MX64 | - | 16MX64 | 16MX64 |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIMM | - | DIMM | DIMM |
| 封装等效代码 | DIMM168 | - | DIMM168 | DIMM168 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 电源 | 3.3 V | - | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 刷新周期 | 4096 | - | 4096 | 4096 |
| 最大待机电流 | 0.032 A | - | 0.032 A | 0.032 A |
| 最大压摆率 | 1.32 mA | - | 1.16 mA | 1.6 mA |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V |
| 表面贴装 | NO | - | NO | NO |
| 技术 | CMOS | - | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | - | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL |
| Base Number Matches | 1 | - | 1 | 1 |
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