P
OLYFUSE
®
R
ESETTABLE
F
USES
SMD1210
SMD Type, 6 V - 30 V
Standard
UL 1434 1 Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
st
Specifications
Packaging
A
Materials
Terminals:
Blistertape and reel Ø 178 mm
Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Lead free plating on request
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider de-rating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3
Reflow only
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
Approvals
cULus Recognition
TÜV
Features
This product line is designed for surface-mount
applications with a range in hold currents from
50 mA to 1.5 A and voltages from 6 V to 30 V.
These smaller devices (1210-mil footprint) are
ideally suited for palm PC, PDAs and applications
where space is constrained and circuit protec-
tion is required.
Suitable for reflow soldering
Dimensions (mm)
Solder pad Layout (mm)
2.0
2.5
1.0
1.0
Dimensions (mm)
Model
SMD1210P005TS/TF
SMD1210P010TS/TF
SMD1210P020TS/TF
SMD1210P035TS/TF
SMD1210P050TS/TF
SMD1210P075TS/TF
SMD1210P110TS/TF
SMD1210P150TS/TF
A
Min Max
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
Min Max
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
B
Min Max
0.75
0.75
0.60
0.50
0.50
0.50
0.90
1.00
1.25
1.25
1.00
0.85
0.85
0.85
1.30
1.60
C
D
Min
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
Min Max
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
E
packaging quantity
tape
3.000
3.000
3.000
4.000
4.000
4.000
3.000
2.000
Permissible continuous operating current is
≤
100 % at ambient temperature of 20 ºC (68 ºF).
Model
cURus
•
•
•
•
•
•
•
•
SMD1210P005TS/TF
SMD1210P010TS/TF
SMD1210P020TS/TF
SMD1210P035TS/TF
SMD1210P050TS/TF
SMD1210P075TS/TF
SMD1210P110TS/TF
SMD1210P150TS/TF
0.05
0.10
0.20
0.35
0.50
0.75
1.10
1.50
0.15
0.30
0.40
0.70
1.00
1.50
2.20
3.00
30
30
30
6
13.2
6
6
6
10
10
10
40
40
40
40
40
1.50 @ 0.25
1.50 @ 0.50
0.02 @ 8.00
0.20 @ 8.00
0.10 @ 8.00
0.10 @ 8.00
0.30 @ 8.00
0.50 @ 8.00
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.8
3.600
1.600
0.800
0.320
0.250
0.130
0.060
0.040
25.000
7.000
2.900
0.810
0.550
0.290
0.140
0.070
50.000
15.000
5.000
1.300
0.900
0.400
0.210
0.110
Please choose TS for SnPb and
TF
for Sn plating
NOTE:
I
hold
=
I
trip
=
V
max
=
I
max
=
Hold current: maximum current device will pass without tripping in 20 °C still air.
Trip current: minimum current at which the device will trip in 20 °C still air.
Maximum voltage device can withstand without damage at rated current (I
max
)
Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
=
Power dissipated from device when in the tripped state at 20 °C still air.
Minimum resistance of device in initial (un-soldered) state.
R
min
=
R
1max
= Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Caution: Operation beyond the specified rating may result in damage and possible arcing and
fl
ame.
Specifications are subject to change without notice
Order
Information
Qty.
Order-
Number
Model
Packaging
040606
In our continuing strategy to deliver unparalleled circuit protection solutions,
technical expertise and application leadership, we proudly introduce the
WICKMANN Group and its products to the Littelfuse portfolio.
www.littelfuse.com
TÜV
•
•
•
•
•
•
•
•
I
hold
(A)
I
Trip
(A)
V
max. dc
(V)
I
max.
(A)
max. time to trip
(s @ A)
P
d max.
(W)
Resistance
Approvals
R
min.
(
Ω
) R
typ.
(
Ω
) R
I max.
(
Ω
)
嵌入式系统
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